JPH0218879A - Harmetic terminal - Google Patents
Harmetic terminalInfo
- Publication number
- JPH0218879A JPH0218879A JP16705788A JP16705788A JPH0218879A JP H0218879 A JPH0218879 A JP H0218879A JP 16705788 A JP16705788 A JP 16705788A JP 16705788 A JP16705788 A JP 16705788A JP H0218879 A JPH0218879 A JP H0218879A
- Authority
- JP
- Japan
- Prior art keywords
- connecting body
- container
- hermetic terminal
- thermal expansion
- coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 claims abstract description 15
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 11
- 239000012212 insulator Substances 0.000 claims description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229910000833 kovar Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract 7
- 238000010168 coupling process Methods 0.000 abstract 7
- 238000005859 coupling reaction Methods 0.000 abstract 7
- 230000000977 initiatory effect Effects 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- -1 Kovar Chemical class 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は真空容器や圧力容器などの密閉容器を貫通する
ハーメチック端子に関するものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a hermetic terminal that penetrates a closed container such as a vacuum container or a pressure container.
「従来の技術」
真空容器や圧力容器などの密封容器に用いられる密封電
気端子としては、アルミナなどのセラミックスやガラス
の絶縁体と、この絶縁体と熱膨張係数の近いコバールな
どの金属を組み合わせたハーメチック端子が用いられて
いる。ハーメチック端子でコバールなどの金属を用いた
のは、通常の金属ではセラミックスやガラスの絶縁体と
熱膨張係数が非常に異なるため、温度変化によって熱膨
張差が絶縁体と金属との間に発生し、接合部において割
れが発生してしまうからである。``Conventional technology'' Sealed electrical terminals used in sealed containers such as vacuum vessels and pressure vessels are made by combining ceramic or glass insulators such as alumina with metals such as Kovar, which have a coefficient of thermal expansion similar to that of the insulators. Hermetic terminals are used. The reason why metals such as Kovar are used in hermetic terminals is that ordinary metals have very different thermal expansion coefficients from ceramic or glass insulators, so thermal expansion differences occur between the insulator and metal due to temperature changes. This is because cracks will occur at the joint.
第９図に従来のハーメチック端子の例を示す。ステンレ
ス容器１０１の開口にコバールなどの金属の電気端子１
０２を押通させてコバールなどの筒体１０３を弯め電気
的に絶縁するためのセラミックスやガラスの絶縁体１０
４を介在させて密封する。電気端子１０２と絶縁体１０
４、絶縁体１０４と筒体１０３とをそれぞれろう材１０
５ ・１０６で接合する。ここで使用するろう材１０
５ ・１０６は、金ろう、銀ろう、接合すべきセラミ
ックスやガラスにメタライズ処理を施す必要のないろう
材などである。さらに、筒体１０３を容器１０１に溶接
する。ここで、電気端子１０２、絶縁体１０４、筒体１
０３は互いに熱膨張係数が近いので、温度が変化しても
電気端子１０２と絶縁体１０４、絶縁体１０４と筒体１
０３との間に割れは生じない。また、筒体１０３と容器
１０１は、弾性を有するので、温度が変化しても熱膨張
差を吸収して割れは生じない。このようにして温度が変
化しても気密性を保持する貫通ハーメチック電気端子が
形成されている。FIG. 9 shows an example of a conventional hermetic terminal. An electric terminal 1 made of metal such as Kovar is attached to the opening of the stainless steel container 101.
An insulator 10 made of ceramics or glass for electrically insulating the cylindrical body 103 made of Kovar or the like by pushing 02 through it.
4 and seal. Electrical terminal 102 and insulator 10
4. The insulator 104 and the cylindrical body 103 are each filled with a brazing material 10.
5 ・Join with 106. Brazing filler metal 10 used here
5.106 is a gold solder, a silver solder, or a brazing material that does not require metallization treatment on the ceramics or glass to be joined. Furthermore, the cylindrical body 103 is welded to the container 101. Here, an electric terminal 102, an insulator 104, a cylinder 1
03 have similar thermal expansion coefficients to each other, so even if the temperature changes, the electrical terminal 102 and the insulator 104, and the insulator 104 and the cylindrical body 1
No cracks occur between the two. Moreover, since the cylinder 103 and the container 101 have elasticity, even if the temperature changes, they absorb the difference in thermal expansion and do not crack. In this way, a through-hermetic electrical terminal is formed that maintains hermeticity even when the temperature changes.
「発明が解決しようとする課題」
ところで最近、超高真空容器としてガスが発生しに（い
アルミニウムもしくはアルミニウム合金の容器を用いる
ことが多くなってきた。アルミニウムもしくはアルミニ
ウム合金はコバールに比して融点が大変低くゆっくり接
合するとアルミニウムもしくはアルミニウム合金は融け
てしまう。"Problem to be Solved by the Invention" Recently, aluminum or aluminum alloy containers, which do not generate gas, have been increasingly used as ultra-high vacuum containers.Aluminum or aluminum alloys have a lower melting point than Kovar. If the bonding temperature is very low and the bonding is slow, the aluminum or aluminum alloy will melt.
このように、アルミニウムとコバールは融点が非常に異
なるが、急速加熱、急速冷却できて接合が急速に完了す
るレーザ溶接によると溶接できる。しかしながら、急速
加熱、急速冷却に伴って発生する熱応力に起因した凝固
割れが生じやすく、気密洩れをひきおこしやすい。一方
、第１０図に示すアルミニウムもしくはアルミニウム合
金の容器１１１の開口にコバールなどの金属の電気端子
１１２を挿通させ、アルミナなどのセラミックスやガラ
スの絶縁体１１３を介在させて、電気端子１１２と絶縁
体１１３、絶縁体１１３と容器１１１ とをろう材１１
４ ・１１５で接合したとする。As described above, although aluminum and Kovar have very different melting points, they can be welded by laser welding, which can rapidly heat and cool and quickly complete the bond. However, solidification cracks are likely to occur due to thermal stress that occurs with rapid heating and rapid cooling, and airtight leaks are likely to occur. On the other hand, an electrical terminal 112 made of metal such as Kovar is inserted into the opening of a container 111 made of aluminum or aluminum alloy shown in FIG. 113, the insulator 113 and the container 111 are connected to the brazing material 11
4. Assume that the joint is made at 115.
すると、このアルミニウムもしくはアルミニウム合金の
容器１１１と絶縁体１１３とでは熱膨張差が太き（、温
度が変化すると両者の間に割れが生じてしまう。Then, there is a large difference in thermal expansion between the aluminum or aluminum alloy container 111 and the insulator 113 (if the temperature changes, cracks will occur between the two).
このように第９図に示すステンレス容器１０１をそのま
ま第１０図に示す使用が望まれているアルミニウムもし
くはアルミニウム合金の容器１１１に置き替えることは
凝固割れの点で不可能である。As described above, it is impossible to directly replace the stainless steel container 101 shown in FIG. 9 with the aluminum or aluminum alloy container 111 shown in FIG. 10, which is desired to be used, in view of solidification cracking.
「課題を解決するための手段」
そこで、本発明は上記の事情に鑑み、容器開口の電気端
子の挿通部に割れが生じないようにすべく、電気端子を
貫通させる絶縁体を、絶縁体と熱膨張係数の近いコバー
ルなどの連結体をろう材で接合し、容器と連結体の対向
面の少なくとも一方に層を形成し連結体の外側を容器に
溶接により接合し、絶縁体と容器との間に熱膨張差によ
る応力や歪を吸収できる連結体を介在させたものである
。また、応力や歪の吸収構造を容器の一部に設けること
もでき、連結体と容器の一部との両者、あるいは何れか
の一方で応力や歪を吸収させる。"Means for Solving the Problems" In view of the above circumstances, the present invention has been developed to replace the insulator through which the electrical terminal is inserted with an insulator in order to prevent cracks from occurring in the insertion portion of the electrical terminal in the opening of the container. Connecting bodies such as Kovar, which have similar coefficients of thermal expansion, are joined using a brazing material, a layer is formed on at least one of the facing surfaces of the container and the connecting body, and the outside of the connecting body is joined to the container by welding. A connecting body that can absorb stress and strain due to differences in thermal expansion is interposed between the two. Further, a stress or strain absorbing structure can be provided in a part of the container, and the stress or strain can be absorbed by both or one of the connecting body and a part of the container.
「作 用」
絶縁体に絶縁体と熱膨張係数の近い連結体をろう材で接
合し、連結体に層を介在させて容器と溶接により接合し
、連結体で熱膨張差による応力や歪を吸収する。また、
容器の一部を応力や歪の吸収構造とした場合は、そこで
吸収する。``Function'' A connecting body with a coefficient of thermal expansion similar to that of the insulator is bonded to the insulator using a brazing material, and a layer is interposed between the connecting body and the container is joined by welding, and the stress and strain due to the difference in thermal expansion is absorbed by the connecting body. Absorb. Also,
If a part of the container has a structure that absorbs stress and strain, the stress and strain will be absorbed there.
「実施例」 以下、本発明を実施例に基いて詳細に説明する。"Example" Hereinafter, the present invention will be explained in detail based on examples.
第１図において、アルミニウムあるいはアルミニウム合
金の容器１の開口にアルミナなどのセラミックスやガラ
スの絶縁体２を挿通させ、この絶縁体２の中心部にコバ
ールなどの金属の電気端子３を貫通させ、コバールなど
の絶縁体２に熱膨張係数の近い材質の球面状の応力や歪
を吸収する連結体４を絶縁体２と容器１との間に介在さ
せて接合する。電気端子３と絶縁体２、絶縁体２と連結
体４とは、それぞれろう材５・６で接合する。ろう材５
・６は金ろう、銀ろう、接合すべきセラミックスやガラ
スにメタライズ処理を施す必要のないろう材などである
。容器１の開口部あるいは連結体４外側もしくは両者に
ニッケルなどのメッキ層７を設け、容器１と連結体４と
はメッキ層７を介してレーザ溶接される。In FIG. 1, an insulator 2 made of ceramic or glass such as alumina is inserted into the opening of a container 1 made of aluminum or aluminum alloy, and an electrical terminal 3 made of metal such as Kovar is passed through the center of the insulator 2. A spherical stress- and strain-absorbing connector 4 made of a material having a coefficient of thermal expansion similar to that of the insulator 2 is interposed between the insulator 2 and the container 1 and joined. The electrical terminal 3 and the insulator 2, and the insulator 2 and the connecting body 4 are joined by brazing materials 5 and 6, respectively. Brazing filler metal 5
・No. 6 is a gold solder, a silver solder, or a brazing material that does not require metallization treatment on the ceramics or glass to be joined. A plating layer 7 of nickel or the like is provided on the opening of the container 1 or on the outside of the connector 4, or both, and the container 1 and the connector 4 are laser welded via the plating layer 7.
連結体としては球面状の連結体４のみならず、第２図に
示す円形波状連結体１４、第３図および第４図に示す有
底円筒状連結体２４、第５図および第６図に示す有底四
角筒状連結体３４、第７図に示す内側に突出する球面状
連結体４４がある。第８図では容器１の開口部に外方に
向けて吸収支持体８を突出させこの吸収支持体８内に絶
縁体２を介して電気端子３を挿通させ、絶縁体２と吸収
支持体８との間に薄い円盤状の連結体５４を介して温度
変化による形状歪を起こしやすく形成しである。吸収支
持体８および円盤状連結体５４とも歪や応力を吸収する
連結体であって、両者を共に備える場合について述べた
が、歪や応力の吸収は何れか一方だけでするようにし他
方は剛体的形状とすることもできる。The connecting body includes not only the spherical connecting body 4, but also the circular wave-like connecting body 14 shown in FIG. 2, the bottomed cylindrical connecting body 24 shown in FIGS. 3 and 4, and the connecting body 24 shown in FIGS. There is a bottomed square cylindrical connecting body 34 shown, and a spherical connecting body 44 projecting inward as shown in FIG. In FIG. 8, an absorbent support 8 is projected outward from the opening of the container 1, and an electrical terminal 3 is inserted through the insulator 2 into the absorbent support 8. A thin disk-shaped connecting body 54 is interposed between the two and is formed so that the shape is easily distorted due to temperature changes. Both the absorbing support 8 and the disk-shaped connecting body 54 are connecting bodies that absorb strain and stress, and although the case where both are provided has been described, only one of them absorbs strain and stress, and the other is a rigid body. It can also be shaped like
上記実施例ではアルミニウムもしくはアルミニウム合金
の容器と連結体との接合はレーザ溶接によったが、それ
に限られずガス溶接、電気溶接、ろう付けであってもよ
い。また、容器と連結体とのレーザ溶接の際、ニッケル
層を介在させた例について述べたが、ニッケル以外でも
よく、コバールなどと溶接しやすい材質ならばよい。ま
た、メッキも無電解メッキ、電気メッキなどであっても
よく、例えば無電解ニッケルー１重量％硼素メッキ、無
電解ニッケルー８重量％りんメッキでもよい。また、メ
ッキでなくニッケル層をエピタキシー、スパッタ、蒸着
、固相拡散などによっても形成してもよい。なお、容器
ではなく、連結体のほうに、容器と溶接しやすい材質の
層をメッキなどで設けてもよい。あるいは両者に層を設
けてもよい。In the above embodiments, the aluminum or aluminum alloy container and the connector were joined by laser welding, but the method is not limited thereto, and gas welding, electric welding, or brazing may be used. Further, an example in which a nickel layer is interposed during laser welding of the container and the connecting body has been described, but any material other than nickel may be used as long as it is easily welded with Kovar or the like. Further, the plating may be electroless plating, electroplating, etc., such as electroless nickel-1 weight % boron plating or electroless nickel-8 weight % phosphorus plating. Further, instead of plating, the nickel layer may be formed by epitaxy, sputtering, vapor deposition, solid phase diffusion, or the like. Note that a layer of a material that is easily welded to the container may be provided on the connecting body instead of on the container by plating or the like. Alternatively, layers may be provided on both.
「発明の効果」
本発明は、上述のように構成したので、超高真空容器と
してすぐれているアルミニウムもしくはアルミニウム合
金などコバールとの直接溶接できない容器に、温度変化
があっても割れがないように、ハーメチック端子を取り
付は得る。超高真空の工業的学術的利用にきわめて有効
である。温度が変化しても熱膨張差による割れの生じな
い耐久性のあるハーメチック端子が提供できる。"Effects of the Invention" Since the present invention is configured as described above, it is possible to prevent cracks in containers that cannot be directly welded with Kovar, such as aluminum or aluminum alloy, which are excellent as ultra-high vacuum containers, even if there is a temperature change. , install hermetic terminals. It is extremely effective for industrial and academic uses of ultra-high vacuum. It is possible to provide a durable hermetic terminal that does not crack due to differences in thermal expansion even when the temperature changes.
第１図は本発明の具体的一実施例の一部を断面した側面
図、第２図は他の実施例で一部を断面した側面図、第３
図は別の実施例で一部を断面した側面図、第４図は第３
図の平面図、第５図はさらに別の実施例の一部を断面し
た側面図、第６図は第５図の平面図、第７図はさらに別
の実施例の一部を断面した側面図、第８図はさらに別の
実施例の一部を断面した側面図である。
ｌ・・・容 器
２・・・絶 縁 体
３・・・電気端子
４ ・１４・２４・
３４・４４・５４・・・連 結 体
６・・・ろ う 付 け
７・・・メッキ層（層の例）
４・・・球面状連結体
１４・・・円形波状連結体
２４・・・有底円筒状連結体
３４・・・有底四角筒状連結体
４４・・・内側に突出する球面状連結体５４・・・薄い
円盤状連結体
８・・・吸収支持体FIG. 1 is a partially sectional side view of a specific embodiment of the present invention, FIG. 2 is a partially sectional side view of another embodiment, and FIG.
The figure is a partially sectional side view of another embodiment, and Figure 4 is a side view of another embodiment.
FIG. 5 is a partially sectional side view of yet another embodiment; FIG. 6 is a plan view of FIG. 5; and FIG. 7 is a partially sectional side view of yet another embodiment. FIG. 8 is a partially sectional side view of still another embodiment. l... Container 2... Insulator 3... Electrical terminal 4, 14, 24, 34, 44, 54... Connecting body 6... Brazing 7... Plating layer (Example of layers) 4... Spherical connecting body 14... Circular wavy connecting body 24... Bottomed cylindrical connecting body 34... Bottomed square cylindrical connecting body 44... Projects inward Spherical connecting body 54... Thin disk-shaped connecting body 8... Absorption support
Claims (1)
って、容器の開口に絶縁体を介して電気端子を挿通させ
、絶縁体と容器との間に絶縁体の熱膨張係数に近い熱膨
張係数を有する連結体を介在させ、連結体の内側を絶縁
体にろう付けにて接合し連結体と容器の対向面の少なく
とも一方に層を形成し連結体の外側を容器に溶接により
接合したハーメチック端子 （２）容器がアルミニウムもしくはアルミニウム合金で
ある第１請求項記載のハーメチック端子 （３）連結体の材質がコバールである第２請求項記載の
ハーメチック端子 （４）層がニッケルである第３請求項記載のハーメチッ
ク端子 （５）ニッケル層がメッキによって形成された第４請求
項記載のハーメチック端子 （６）連結体と層を介して容器との溶接がレーザ溶接で
ある第５請求項記載のハーメチック端子 （７）連結体が熱膨張差による応力や歪を吸収できる第
６請求項記載のハーメチック端子（８）連結体が球面状
である第７請求項記載のハーメチック端子 （９）連結体が円形波状である第７請求項記載のハーメ
チック端子 （１０）連結体が有底円筒状である第７請求項記載のハ
ーメチック端子 （１１）連結体が有底四角筒状である第７請求項記載の
ハーメチック端子 （１２）連結体が内側に突出する球面状である第７請求
項記載のハーメチック端子 （１３）連結体が薄い円盤状である第７請求項記載のハ
ーメチック端子 （１４）容器の吸収支持体が熱膨張差による応力や歪を
吸収する第７請求項記載のハーメチック端子 （１５）剛体的な連結体であって容器の吸収支持体が熱
膨張差による応力や歪を吸収する第６請求項記載のハー
メチック端子[Claims] (1) A hermetic terminal provided through a sealed container, in which an electrical terminal is inserted into the opening of the container via an insulator, and thermal expansion of the insulator is provided between the insulator and the container. A connecting body having a coefficient of thermal expansion close to the coefficient is interposed, the inside of the connecting body is joined to the insulator by brazing, a layer is formed on at least one of the facing surfaces of the connecting body and the container, and the outside of the connecting body is attached to the container. Hermetic terminal (2) joined by welding; Hermetic terminal (3) according to the first claim, wherein the container is made of aluminum or aluminum alloy; (3) The material of the connecting body is Kovar; (4) the layer is nickel. (5) The hermetic terminal (6) according to the fourth claim, in which the nickel layer is formed by plating. The hermetic terminal (7) according to claim 6, wherein the connecting body can absorb stress and strain caused by a difference in thermal expansion (8); The hermetic terminal (9) according to claim 7, wherein the connecting body has a spherical shape. ) The hermetic terminal according to claim 7, wherein the connecting body has a circular wavy shape (10); The hermetic terminal according to claim 7, wherein the connecting body has a cylindrical shape with a bottom; The hermetic terminal (12) according to claim 7, the hermetic terminal (13) according to claim 7, wherein the connecting body has a spherical shape protruding inwardly; the hermetic terminal (14) according to claim 7, ) The hermetic terminal according to claim 7, wherein the absorbing support of the container absorbs stress and strain caused by a difference in thermal expansion. The hermetic terminal according to claim 6 which absorbs
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16705788A JPH0218879A (en) | 1988-07-05 | 1988-07-05 | Harmetic terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16705788A JPH0218879A (en) | 1988-07-05 | 1988-07-05 | Harmetic terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0218879A true JPH0218879A (en) | 1990-01-23 |
| JPH05827B2 JPH05827B2 (en) | 1993-01-06 |
Family
ID=15842602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16705788A Granted JPH0218879A (en) | 1988-07-05 | 1988-07-05 | Harmetic terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0218879A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5374166A (en) * | 1991-06-28 | 1994-12-20 | Sanden Corporation | Motor driven fluid compressor within hermetic housing |
| US5447415A (en) * | 1992-06-29 | 1995-09-05 | Sanden Corporation | Motor driven fluid compressor within hermetic housing |
| JP2013529852A (en) * | 2010-06-28 | 2013-07-22 | コメット アクチェンゲゼルシャフト | Vacuum variable capacitor |
| JP2016036000A (en) * | 2014-08-05 | 2016-03-17 | エヌイーシー ショット コンポーネンツ株式会社 | Airtight terminal having elastic buffer function |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56119270U (en) * | 1980-02-13 | 1981-09-11 | ||
| JPS5984771U (en) * | 1983-04-18 | 1984-06-08 | 株式会社 フジ電科 | Terminal structure of cold weld type flat package |
-
1988
- 1988-07-05 JP JP16705788A patent/JPH0218879A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56119270U (en) * | 1980-02-13 | 1981-09-11 | ||
| JPS5984771U (en) * | 1983-04-18 | 1984-06-08 | 株式会社 フジ電科 | Terminal structure of cold weld type flat package |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5374166A (en) * | 1991-06-28 | 1994-12-20 | Sanden Corporation | Motor driven fluid compressor within hermetic housing |
| US5447415A (en) * | 1992-06-29 | 1995-09-05 | Sanden Corporation | Motor driven fluid compressor within hermetic housing |
| JP2013529852A (en) * | 2010-06-28 | 2013-07-22 | コメット アクチェンゲゼルシャフト | Vacuum variable capacitor |
| JP2016036000A (en) * | 2014-08-05 | 2016-03-17 | エヌイーシー ショット コンポーネンツ株式会社 | Airtight terminal having elastic buffer function |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05827B2 (en) | 1993-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5675122A (en) | Sealable electronics packages | |
| US5786548A (en) | Hermetic package for an electrical device | |
| US3395993A (en) | Titanium activated nickel seal and method of forming it | |
| US3988825A (en) | Method of hermetically sealing an electrical component in a metallic housing | |
| JP2008180629A (en) | Infrared detector and method for manufacturing the same | |
| JPH0218879A (en) | Harmetic terminal | |
| JPS594008A (en) | Ceramic condenser filled in sealed glass capsule | |
| US5923083A (en) | Packaging technology for Schottky die | |
| KR920703479A (en) | Articles comprising joining ceramic and metal members together | |
| US7407083B2 (en) | Bonded silicon, components and a method of fabricating the same | |
| US3897223A (en) | Nb joined to alumina with Ni-Ti eutectic seal | |
| JPH0142914B2 (en) | ||
| US3898054A (en) | Brazed assemblies | |
| JPH02133379A (en) | Bonding method | |
| JPH0517001Y2 (en) | ||
| JPS62142526A (en) | Production of metal vacuum heat insulating container | |
| JP2577038Y2 (en) | Vacuum insulation container made of synthetic resin | |
| JPH0736804B2 (en) | Manufacturing method of metal thermos | |
| JP3715878B2 (en) | Vacuum-tight terminal and electric kettle | |
| Dockus | Direct Liquid Phase Bonding of Ceramics | |
| JPS5931157Y2 (en) | metal thermos flask | |
| JPH0489367A (en) | Ceramic-metal joined body and joining method | |
| JPS5917542B2 (en) | Hermetically sealed assembly method for semiconductor devices | |
| JPH0736805B2 (en) | Manufacturing method of metal thermos | |
| JPH02175672A (en) | Method for joining aluminum nitride to metallic plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |