JPH0217891U - - Google Patents
Info
- Publication number
- JPH0217891U JPH0217891U JP9572988U JP9572988U JPH0217891U JP H0217891 U JPH0217891 U JP H0217891U JP 9572988 U JP9572988 U JP 9572988U JP 9572988 U JP9572988 U JP 9572988U JP H0217891 U JPH0217891 U JP H0217891U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- heat generating
- motherboard
- copper foil
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000011888 foil Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9572988U JPH0217891U (sv) | 1988-07-21 | 1988-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9572988U JPH0217891U (sv) | 1988-07-21 | 1988-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217891U true JPH0217891U (sv) | 1990-02-06 |
Family
ID=31320438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9572988U Pending JPH0217891U (sv) | 1988-07-21 | 1988-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217891U (sv) |
-
1988
- 1988-07-21 JP JP9572988U patent/JPH0217891U/ja active Pending