JPH0217876U - - Google Patents
Info
- Publication number
- JPH0217876U JPH0217876U JP9623888U JP9623888U JPH0217876U JP H0217876 U JPH0217876 U JP H0217876U JP 9623888 U JP9623888 U JP 9623888U JP 9623888 U JP9623888 U JP 9623888U JP H0217876 U JPH0217876 U JP H0217876U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- plating
- wiring board
- printed wiring
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 238000009713 electroplating Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9623888U JPH0217876U (no) | 1988-07-20 | 1988-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9623888U JPH0217876U (no) | 1988-07-20 | 1988-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217876U true JPH0217876U (no) | 1990-02-06 |
Family
ID=31321095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9623888U Pending JPH0217876U (no) | 1988-07-20 | 1988-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217876U (no) |
-
1988
- 1988-07-20 JP JP9623888U patent/JPH0217876U/ja active Pending
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