JPH0217855U - - Google Patents
Info
- Publication number
- JPH0217855U JPH0217855U JP9606888U JP9606888U JPH0217855U JP H0217855 U JPH0217855 U JP H0217855U JP 9606888 U JP9606888 U JP 9606888U JP 9606888 U JP9606888 U JP 9606888U JP H0217855 U JPH0217855 U JP H0217855U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor package
- resin
- sealed
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9606888U JPH0217855U (es) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9606888U JPH0217855U (es) | 1988-07-19 | 1988-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0217855U true JPH0217855U (es) | 1990-02-06 |
Family
ID=31320868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9606888U Pending JPH0217855U (es) | 1988-07-19 | 1988-07-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0217855U (es) |
-
1988
- 1988-07-19 JP JP9606888U patent/JPH0217855U/ja active Pending