JPH0217847U - - Google Patents

Info

Publication number
JPH0217847U
JPH0217847U JP9600588U JP9600588U JPH0217847U JP H0217847 U JPH0217847 U JP H0217847U JP 9600588 U JP9600588 U JP 9600588U JP 9600588 U JP9600588 U JP 9600588U JP H0217847 U JPH0217847 U JP H0217847U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
conductor pattern
substrate
circuit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9600588U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0741161Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988096005U priority Critical patent/JPH0741161Y2/ja
Publication of JPH0217847U publication Critical patent/JPH0217847U/ja
Application granted granted Critical
Publication of JPH0741161Y2 publication Critical patent/JPH0741161Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Waveguides (AREA)
JP1988096005U 1988-07-20 1988-07-20 混成集積回路 Expired - Lifetime JPH0741161Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988096005U JPH0741161Y2 (ja) 1988-07-20 1988-07-20 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988096005U JPH0741161Y2 (ja) 1988-07-20 1988-07-20 混成集積回路

Publications (2)

Publication Number Publication Date
JPH0217847U true JPH0217847U (US20030199744A1-20031023-C00003.png) 1990-02-06
JPH0741161Y2 JPH0741161Y2 (ja) 1995-09-20

Family

ID=31320794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988096005U Expired - Lifetime JPH0741161Y2 (ja) 1988-07-20 1988-07-20 混成集積回路

Country Status (1)

Country Link
JP (1) JPH0741161Y2 (US20030199744A1-20031023-C00003.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183422A (ja) * 1993-12-24 1995-07-21 Nec Corp 樹脂封止型半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6372180A (ja) * 1986-09-12 1988-04-01 ティーディーケイ株式会社 電子部品及びその製造方法
JPS6359370U (US20030199744A1-20031023-C00003.png) * 1986-10-06 1988-04-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6372180A (ja) * 1986-09-12 1988-04-01 ティーディーケイ株式会社 電子部品及びその製造方法
JPS6359370U (US20030199744A1-20031023-C00003.png) * 1986-10-06 1988-04-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183422A (ja) * 1993-12-24 1995-07-21 Nec Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPH0741161Y2 (ja) 1995-09-20

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