JPH0217847U - - Google Patents
Info
- Publication number
- JPH0217847U JPH0217847U JP9600588U JP9600588U JPH0217847U JP H0217847 U JPH0217847 U JP H0217847U JP 9600588 U JP9600588 U JP 9600588U JP 9600588 U JP9600588 U JP 9600588U JP H0217847 U JPH0217847 U JP H0217847U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- conductor pattern
- substrate
- circuit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Wire Bonding (AREA)
- Waveguides (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988096005U JPH0741161Y2 (ja) | 1988-07-20 | 1988-07-20 | 混成集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988096005U JPH0741161Y2 (ja) | 1988-07-20 | 1988-07-20 | 混成集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0217847U true JPH0217847U (US08124317-20120228-C00026.png) | 1990-02-06 |
JPH0741161Y2 JPH0741161Y2 (ja) | 1995-09-20 |
Family
ID=31320794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988096005U Expired - Lifetime JPH0741161Y2 (ja) | 1988-07-20 | 1988-07-20 | 混成集積回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0741161Y2 (US08124317-20120228-C00026.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183422A (ja) * | 1993-12-24 | 1995-07-21 | Nec Corp | 樹脂封止型半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6372180A (ja) * | 1986-09-12 | 1988-04-01 | ティーディーケイ株式会社 | 電子部品及びその製造方法 |
JPS6359370U (US08124317-20120228-C00026.png) * | 1986-10-06 | 1988-04-20 |
-
1988
- 1988-07-20 JP JP1988096005U patent/JPH0741161Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6372180A (ja) * | 1986-09-12 | 1988-04-01 | ティーディーケイ株式会社 | 電子部品及びその製造方法 |
JPS6359370U (US08124317-20120228-C00026.png) * | 1986-10-06 | 1988-04-20 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183422A (ja) * | 1993-12-24 | 1995-07-21 | Nec Corp | 樹脂封止型半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0741161Y2 (ja) | 1995-09-20 |