JPH0217509Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an electronic device having a housing frame structure, and relates to an improvement in heat dissipation of a heat generating part thereof.

Electrical, communication, and electronic equipment consists of various constituent units, and each unit is mounted in a predetermined position on a housing frame. Among the units, the power supply unit, transmission unit, etc. generate a considerable amount of heat, and it is necessary to dissipate this heat efficiently. For this reason, conventionally, as shown in Fig. 1, a radiator 3 provided on a heat generating unit 2 mounted on a housing frame 1 is exposed on the front (or rear) side, and radiation and natural convection are emitted from the radiator 3. It was radiating heat into the air. Therefore, the heat dissipation efficiency is not necessarily good, and in particular, if the heat is dissipated from the bottom as shown in the figure, the temperature of the upper unit increases, which is a problem.

In view of the above-mentioned problems, the present invention is designed to guide the heat from the heat dissipation section to the upper part of the chassis frame using an air duct, and radiate and exhaust the heat. By using unused space, no special space is required for this purpose. Examples of the electronic device casing of the present invention will be specifically described below with reference to the drawings.

FIG. 2 shows a perspective view of essential parts of an embodiment of an electronic device casing according to the present invention. In the figure, 10 is a housing frame, 11 is a left side surface, 12 is a right side surface, 13 is a bottom surface, and 14 is a top surface. In this way, the electronic device unit is mounted in a predetermined position in the internal space of the vertically long rectangular frame. Further, the left side surface 11 has a substantially U-shaped groove in cross section as shown in the A end surface, and the right side surface 12 is also substantially similar. Both members constitute a strength member of the housing frame as a kind of pillar panel member, and similar members in FIG. 1 are also similar as shown at 1' and 1'. This groove-shaped recessed space has conventionally been used only as a passage for wiring cables, etc., and is a necessary space for strength. Therefore, in the left side surface 11 of the present invention, a plate is stretched on the inner surface as a frame part, and this part is used as an air duct and is open at the top and bottom. At the bottom of this air duct, a radiator 21 on one side of the heat generating unit 20 can be inserted into the opening at the lower end of the air duct, and the heat generating unit 20 is fixed by means not shown.

Although the outer surface side of the left side surface 11 is not shown, the right side surface 1
As in the same part of No. 2, an intake port 15 is provided.

With the above configuration, the heat generated by the heat generating unit 20 heats the radiator 21. The radiator 21 has a large number of radiating fins formed in parallel in the vertical direction, and since these fins are located at the lower end of the air duct, low-temperature air flows in from the outside through the intake port in the direction of arrow B.
The heated air rises in the air duct. The speed of the rising air is determined by the size of the temperature difference and the length of the air duct due to the chimney effect; the higher the height, the more efficiently the air is exhausted. Exhaust gas is discharged from the upper end in the direction of arrow C.

In the above embodiment, the side surface of the U-shape is directly used as an air duct, but the present invention is not limited to this, and a conduit with a frame-shaped cross section can be provided along the U-shaped space to form an air duct.

As mentioned above, the present invention uses the side space of the chassis frame as an air duct that communicates with the top and bottom, and the chimney effect of this air duct makes it extremely efficient and requires no space. This is an electronic device case with excellent packaging.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional electronic device housing, and FIG. 2 is a perspective view of essential parts of an embodiment of the present invention. In the figure, 10 is the housing frame, 11 is the left side, 12 is the right side, 13 is the bottom, 14 is the top, 15 is the intake port, 2
0 indicates a heat generating unit, and 21 indicates a heat radiator.

Claims (1)

[Claims for Utility Model Registration] In an electronic device housing having a housing frame whose side surfaces are made up of strength members having a U-shaped cross section, vertical communication is provided by utilizing the internal space of the strength member having a U-shaped cross section. What is claimed is: 1. An electronic device casing comprising: an air duct formed in the air duct; and a heat radiating fin provided on a heat generating unit disposed at the lowermost opening of the air duct to dissipate heat from the heat generating unit.