JPH0217381U - - Google Patents
Info
- Publication number
- JPH0217381U JPH0217381U JP9617188U JP9617188U JPH0217381U JP H0217381 U JPH0217381 U JP H0217381U JP 9617188 U JP9617188 U JP 9617188U JP 9617188 U JP9617188 U JP 9617188U JP H0217381 U JPH0217381 U JP H0217381U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- module
- chip
- card
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096171U JPH084310Y2 (ja) | 1988-07-20 | 1988-07-20 | Ｉｃカード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096171U JPH084310Y2 (ja) | 1988-07-20 | 1988-07-20 | Ｉｃカード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0217381U true JPH0217381U (de) | 1990-02-05 |
| JPH084310Y2 JPH084310Y2 (ja) | 1996-02-07 |
Family
ID=31321008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988096171U Expired - Lifetime JPH084310Y2 (ja) | 1988-07-20 | 1988-07-20 | Ｉｃカード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH084310Y2 (de) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6146655U (ja) * | 1984-08-31 | 1986-03-28 | カシオ計算機株式会社 | Ｉｃカ−ド |
| JPS6253895A (ja) * | 1985-08-31 | 1987-03-09 | 凸版印刷株式会社 | Ｉｃカ−ドの製造方法 |
| JPS6296847U (de) * | 1985-12-09 | 1987-06-20 | ||
| JPS62187780U (de) * | 1986-05-19 | 1987-11-30 | ||
| JPS6391294A (ja) * | 1986-10-06 | 1988-04-21 | 松下電器産業株式会社 | Ｉｃカ−ド |
| JPS63233892A (ja) * | 1987-03-23 | 1988-09-29 | 松下電子工業株式会社 | Ｉｃカ−ド |
-
1988
- 1988-07-20 JP JP1988096171U patent/JPH084310Y2/ja not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6146655U (ja) * | 1984-08-31 | 1986-03-28 | カシオ計算機株式会社 | Ｉｃカ−ド |
| JPS6253895A (ja) * | 1985-08-31 | 1987-03-09 | 凸版印刷株式会社 | Ｉｃカ−ドの製造方法 |
| JPS6296847U (de) * | 1985-12-09 | 1987-06-20 | ||
| JPS62187780U (de) * | 1986-05-19 | 1987-11-30 | ||
| JPS6391294A (ja) * | 1986-10-06 | 1988-04-21 | 松下電器産業株式会社 | Ｉｃカ−ド |
| JPS63233892A (ja) * | 1987-03-23 | 1988-09-29 | 松下電子工業株式会社 | Ｉｃカ−ド |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH084310Y2 (ja) | 1996-02-07 |