JPH02172737A - Laminating film excellent in low temperature heat sealability - Google Patents

Laminating film excellent in low temperature heat sealability

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Publication number
JPH02172737A
JPH02172737A JP32632688A JP32632688A JPH02172737A JP H02172737 A JPH02172737 A JP H02172737A JP 32632688 A JP32632688 A JP 32632688A JP 32632688 A JP32632688 A JP 32632688A JP H02172737 A JPH02172737 A JP H02172737A
Authority
JP
Japan
Prior art keywords
copolymer
heat
ethylene
low
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32632688A
Other languages
Japanese (ja)
Other versions
JP2704895B2 (en
Inventor
Tomohiro Haraikawa
祓川 友宏
Takashi Abe
隆 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAIKA KOGYO KK
NUC Corp
Original Assignee
TAIKA KOGYO KK
Nippon Unicar Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAIKA KOGYO KK, Nippon Unicar Co Ltd filed Critical TAIKA KOGYO KK
Priority to JP32632688A priority Critical patent/JP2704895B2/en
Publication of JPH02172737A publication Critical patent/JPH02172737A/en
Application granted granted Critical
Publication of JP2704895B2 publication Critical patent/JP2704895B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To improve heat sealability at low temp. by forming a laminating film by providing a laminating layer composed of a copolymer having a specific composition and a heat-sealing layer composed of a copolymer having a specific composition on a base film. CONSTITUTION:A laminating layer constituted of 70-95wt.% of a composition consisting of a straight chain ethylene/buten-1 copolymer or straight-chain ethylene/hexane-1 copolymer having density of 0.91-0.94g/cm<2> and 30-5 wt.% of high-pressure low density polyethylene is provided on a base film. Subsequently, a heat-sealing layer composed of a composition consisting of 35-60wt.% of a straight chain ethylene/hexane-1 copolymer having density of 0.91-0.94g/cm<2>, 25-40wt.% of a low-crystalline ethylene/alpha-olefin copolymer and 15-25wt.% of high-pressure low density polyethylene is laminated to said laminating layer to obtain a laminating film.

Description

【発明の詳細な説明】 [発明の利用分野] 本発明は各種基材フィルムに貼合する低温シール性の優
れた貼合用積層フィルムに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a laminated film for lamination with excellent low-temperature sealability that is laminated to various base films.

[従来の技術] ナイロン、ポリエステル、ポリプロピレン等は透明性に
すぐれ、強度があり、耐熱性のすぐれた包装用基材であ
るが、これらで作った包装資材は、そのままで最も経済
的なヒートシールにより内容物の封かんを行うと、熱溶
着温度が高いので、フィルムが収縮したり、あるいは完
全な溶着が困難である等の欠陥があり、ヒートシールは
困難であった・ 従って、上記の材料でつくったフィルムはヒートシール
層を別に設けた積層フィルムとして使用されている。
[Prior art] Nylon, polyester, polypropylene, etc. are packaging base materials with excellent transparency, strength, and heat resistance. When sealing the contents using the above-mentioned materials, heat sealing was difficult because the heat welding temperature was high, resulting in defects such as shrinkage of the film or difficulty in complete welding. The produced film is used as a laminated film with a separate heat-sealing layer.

ヒートシール層に使用される樹脂としては高圧法低密度
ポリエチレン、エチレン−酢酸ビニル共重合体、アイオ
ノマー、ポリプロピレン、高密度ポリエチレン等が使用
されている。貼合積層フィルムを作製する時高圧法低密
度ポリエチレンはヒートシール温度が110℃前後で扱
い易いが内容物を含んだままボイルすることはなく、又
若干臭気がある場合があったり、適して屈曲により屈曲
部にビンホールが発生し、外部空気が遮断されにくいた
め、生鮮食品の包装には問題を生ずる場合がある。
As the resin used for the heat seal layer, high-pressure low density polyethylene, ethylene-vinyl acetate copolymer, ionomer, polypropylene, high density polyethylene, etc. are used. When producing laminated laminated films, high-pressure low-density polyethylene has a heat-sealing temperature of around 110°C and is easy to handle, but it does not boil while containing the contents, may have a slight odor, and is not suitable for bending. As a result, bottle holes are generated at the bent portions, making it difficult to block external air, which may cause problems when packaging fresh foods.

エチレン−酢酸ビニル共重合体は低温シール性には優れ
るが、高温でシールすると臭気が増大し、耐屈曲ピンホ
ール性、ホットタック性、耐熱性も優れていない。
Ethylene-vinyl acetate copolymer has excellent low-temperature sealing properties, but increases odor when sealed at high temperatures, and does not have excellent bending pinhole resistance, hot tack properties, or heat resistance.

アイオノマーはヒートシール強度、ホットタック性には
優れているが、接着強度がやや弱く、押出加工性に劣り
、フィルムにフィッシュアイ、ブツか発生しやすく、(
1’J t’+づフィルムにした場合フィルムに腰があ
り硬い風合いになり、チルト肉などの重重物を真空包装
して移動させる時など包装物同士がこすれてピンホール
が入りやずくなり、真空戻りの原因となることがある。
Ionomers have excellent heat seal strength and hot tack properties, but their adhesive strength is somewhat weak, their extrusion processability is poor, and the film is prone to fish eyes and bumps.
If you use 1'J t'+ film, the film will have a stiff and hard texture, and when moving heavy items such as tilted meat in a vacuum package, the packages will rub against each other and cause pinholes to form. This may cause vacuum return.

ポリプロピレンはヒートシール強度は強いが、T−ダイ
加工時には、熱分解し、分子皿が低下し易く、ネックイ
ンか大きいといった加工上の欠点があり、ヒートシール
温度が150℃と高すぎて扱いにくく、耐寒性にも劣る
ため、使用範囲が限定される。
Polypropylene has strong heat-sealing strength, but during T-die processing, it tends to thermally decompose, the molecular plate tends to drop, and there is a large amount of neck-in, which is difficult to handle.The heat-sealing temperature is too high at 150℃, making it difficult to handle. , its range of use is limited due to poor cold resistance.

高密度ポリエチレンは、ヒートシール強度は優れている
が、低温ヒートシール性か悪く、またT−ダイ加工を行
う場合はネックインが大きく、加工性に劣る。
Although high-density polyethylene has excellent heat-sealing strength, it has poor low-temperature heat-sealability, and when T-die processing is performed, neck-in is large and processability is poor.

以上の様に各々の材料は一長一短であり、未だ満足すべ
きものはない。
As mentioned above, each material has its advantages and disadvantages, and none of them are satisfactory yet.

[発明が解決しようとする課題] 本発明者等は、かかる状況に鑑み低温シール性と経済性
に特に優れ、かつ低温耐衝撃性、耐ピンホール性、層間
接着性、耐ストレスクラック性、ホットタック性、無臭
性そして透明性にすぐれた貼合用積層フィルムを得るべ
く種々検討した結果、以下に述へる手段で、上記目的が
達成できることが分かり本発明を完成させた。
[Problems to be Solved by the Invention] In view of the above circumstances, the present inventors have developed a product that has particularly excellent low-temperature sealing properties and economical efficiency, and has excellent low-temperature impact resistance, pinhole resistance, interlayer adhesion, stress crack resistance, and hot As a result of various studies to obtain a laminated film for lamination with excellent tackiness, odorlessness, and transparency, it was found that the above object could be achieved by the means described below, and the present invention was completed.

[課題を解決するための手段] すなわち本発明は、基材フィルムに低温ヒートシール性
を付与するための、基材フィルムに貼合する層とヒート
シール層とからなる貼合用積層フィルムにおいて、基材
フィルムに貼合する層が密度0.91〜0.94 g/
am3の直鎖状エチレン−ブテン−1共重合体又は直鎖
状エチレン−ヘキセン−1共重合体70〜95重量%と
高圧法低密度ポリエチレン30〜5重量%からなる組成
物から構成され、ヒートシール層が密度0.91〜0.
94g/cm’の直鎖状エチレン−ブテン−1共重合体
又は直鎖状エチレン−ヘキセン−1共重合体35〜60
重世%と低結晶性エチレン−αオレフイン共重合体25
〜40重量%及び高圧法低密度ポリエチレン15〜25
重世%からなる組成物から構成される事を特徴とする低
温ヒートシール層の優れた貼合用積層フィルムであり、
さらに該積層フィルムにおいて、ヒートシールする層の
厚さが0、Ol、mmから積層フィルム厚さの173ま
でである事を特徴とするものである。
[Means for Solving the Problems] That is, the present invention provides a laminated film for lamination consisting of a layer to be laminated to a base film and a heat sealing layer for imparting low-temperature heat sealability to the base film, The layer bonded to the base film has a density of 0.91 to 0.94 g/
It is composed of a composition consisting of 70 to 95% by weight of am3 linear ethylene-butene-1 copolymer or linear ethylene-hexene-1 copolymer and 30 to 5% by weight of high-pressure low-density polyethylene. The seal layer has a density of 0.91 to 0.
94 g/cm' linear ethylene-butene-1 copolymer or linear ethylene-hexene-1 copolymer 35-60
Heavy weight percent and low crystallinity ethylene-α olefin copolymer 25
~40% by weight and high pressure low density polyethylene 15-25
An excellent laminated film for lamination with a low-temperature heat-sealing layer, characterized by being composed of a composition consisting of
Furthermore, the laminated film is characterized in that the thickness of the heat-sealed layer ranges from 0.01 mm to 173 mm, which is the thickness of the laminated film.

本発明において使用される密度0.91〜094g、/
crn”の直鎖状エチレン−ブテン−1共重合体及び直
鎖状エチレン−ヘキセン−1共重合体とは公知の方法、
すなわち、主触媒として遷移金属化合物(チタン、バナ
ジウム等の化合物)、助触媒として有機金属化合物(た
とえば、有機アルミニウム)、担体(例えばケイ素、チ
タン、マグネシウム等の酸化物)からなるチーグラー触
媒、クロム系触媒等の存在下で、エチレンとブテン−1
あるいはヘキセン−1を中圧又は低圧下で、重合させて
得られる。
Density used in the present invention: 0.91-094g, /
crn'' linear ethylene-butene-1 copolymer and linear ethylene-hexene-1 copolymer by known methods,
That is, a Ziegler catalyst consisting of a transition metal compound (compounds such as titanium or vanadium) as a main catalyst, an organometallic compound (e.g. organoaluminium) as a co-catalyst, and a carrier (e.g. an oxide of silicon, titanium, magnesium, etc.), or a chromium-based catalyst. In the presence of a catalyst etc., ethylene and butene-1
Alternatively, it can be obtained by polymerizing hexene-1 under medium or low pressure.

重合は、スラリー重合、気相重合、高温溶解重合などの
種々の方法において行われる。
Polymerization is carried out in a variety of ways, such as slurry polymerization, gas phase polymerization, and high temperature solution polymerization.

市販品としてはウルトセックス、ネオセックス(三井石
曲化学製)、ダウレックス(ダウケミカル社製)、NU
C−ポリエチレン−LL、タフセン(日本ユニカー社製
)等があげられる。
Commercially available products include Ultsex, Neosex (manufactured by Mitsui Ishimagari Kagaku), Dowlex (manufactured by Dow Chemical), and NU.
Examples include C-polyethylene-LL, Tafsen (manufactured by Nippon Unicar Co., Ltd.), and the like.

本発明で使用される、高圧法低密度ポリエチレンとは、
エチレン単独又はエチレンとプロピレン、ブテン−1、
インブチレン、■−ヘキセン、4−メチル−1−ペンテ
ン、ビニルアセテート、エチルアクリレート等を重合圧
力1,000〜4.000 kg/cm2、温度230
〜360°Cの条件下ラジカル重合開始剤、連鎖移動剤
の存在下、管状反応器又は槽型反応器内で、重合して製
造したものであり、結晶化度40〜70、密度が0.9
2〜0.93g/mn、メルトインデックスが1〜50
の、エチレン単独重合体、エチレン−酢酸ビニル共重合
体、エチレン−アクリル酸エチル共重合体、エチレン−
プロピレン共重合体、エチレン−ブテン−1共重合体等
である。
The high-pressure low-density polyethylene used in the present invention is:
Ethylene alone or ethylene and propylene, butene-1,
Polymerization of inbutylene, ■-hexene, 4-methyl-1-pentene, vinyl acetate, ethyl acrylate, etc. at a pressure of 1,000 to 4,000 kg/cm2 and a temperature of 230
It is produced by polymerization in a tubular reactor or tank reactor in the presence of a radical polymerization initiator and a chain transfer agent under conditions of ~360°C, and has a crystallinity of 40 to 70 and a density of 0. 9
2-0.93g/mn, melt index 1-50
, ethylene homopolymer, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-
These include propylene copolymer, ethylene-butene-1 copolymer, and the like.

本発明で使用される低結晶性エチレン−aオレフィン共
重合体とは、メルトインデ・ソクス01〜50 g/ 
l 0m1n 、密度0.870〜0.900g/cm
3. X線による結晶化度5〜40%、融点40〜l 
OO’Cおよびエチレン含有f185〜95モル%のエ
チレンと炭素数3〜10のa−オレフィンとのランダム
共重合体である。
The low crystalline ethylene-a olefin copolymer used in the present invention is a meltinde sox 01 to 50 g/
l 0m1n, density 0.870-0.900g/cm
3. Crystallinity by X-rays 5-40%, melting point 40-1
It is a random copolymer of OO'C and ethylene containing f185 to 95 mol% ethylene and an a-olefin having 3 to 10 carbon atoms.

エチレンと共重合される炭素数3〜10のa −オレフ
ィンとは、具体的には、プロピレン、1ブデン、l−ベ
ンゾン、1−ヘキセン、4−メチル−1−ペンテン、1
−オクテン、1−デセンあるいはこれらの混合物であり
、特に炭素数3〜5のa−オレフィン、とりわけ1−フ
′テンが好ましい。メルトインデックスが0.1 g 
/ 10m1n未満だと流動特性が悪く良好な積層フィ
ルムが得られない。
Specifically, the a-olefin having 3 to 10 carbon atoms to be copolymerized with ethylene includes propylene, 1-butene, 1-benzone, 1-hexene, 4-methyl-1-pentene, 1
-octene, 1-decene or a mixture thereof, and particularly preferred is an a-olefin having 3 to 5 carbon atoms, especially 1-ph'thene. Melt index is 0.1 g
/ If it is less than 10 m1n, the flow characteristics are poor and a good laminated film cannot be obtained.

他方、50g/10m1nを越すとフィルムの機械的強
度が低下し望ましくない。
On the other hand, if it exceeds 50 g/10 m1n, the mechanical strength of the film will decrease, which is not desirable.

密度が0.870 g/cm’未痛のものは(δ1脂に
へたつきがあり、積層フィルムがブロッキングし望まし
くなく、0.900 g/cm’を越えるものは、積層
フィルムの面1屈曲性の改善効果がなく望ましくない。
If the density is 0.870 g/cm', it is undesirable because the δ1 fat is sagging and the laminated film is blocked, and if the density exceeds 0.900 g/cm', the laminated film is bent at one side. It is undesirable because it has no effect on improving sex.

結晶化度が5%未満のものはべたつきがあり、積層フィ
ルムがブロッキングし望ましくなく、40%を越えるも
のは積層フィルムの耐屈曲性を改善せず望ましくない。
If the crystallinity is less than 5%, the laminated film will be sticky and will block, which is undesirable. If it exceeds 40%, it will not improve the bending resistance of the laminated film, which is undesirable.

DSCによる昇温速度lO℃/ m i nでの吸熱曲
線から求めた融点は40〜loo’c、好ましくは70
〜85℃の範囲にあることが必要である。融点が40℃
未満のものは積層フィルムの耐熱性が低下し望ましくな
く、t o o ’cを超大るものはヒートシール効果
がなく望ましくない。
The melting point determined from the endothermic curve at a heating rate of 10°C/min by DSC is 40 to 100°C, preferably 70°C.
It is necessary that the temperature is in the range of ~85°C. Melting point is 40℃
If it is less than that, the heat resistance of the laminated film will decrease, which is undesirable, and if it is too large, it will not have a heat sealing effect, which is undesirable.

この低結晶性エチレン−〇オレフィン共重合体の製造法
は、三塩化バナジル、モノエトキシニ塩化バナジル、ト
リエトキシバナジル、バナジウムオキシジアセチルアセ
トネート、バナジウムトリアセチルアセトネート等のバ
ナジウム化合物と、実験式RnAIX*−7(但しRは
アルキル基のような炭化水素、O<n≦3、Xは水素、
塩素、炭素数2〜4のアルコキシ基)で示される性悪ア
ルミニウム化合物からなる触媒を用い、エチレンと炭素
数3〜10のa−オレフィンを溶媒の存在下に共重合さ
せる方法が好適であるが、これに限定されるものではな
い。本発明において基材フィルムに貼合する層は直鎖状
エチレン−ヘキセン−1共重合体70〜95重量%と高
圧法低密度ポリエチレン30〜5重量%からなる組成物
が使用される。
The method for producing this low-crystalline ethylene-〇 olefin copolymer uses a vanadium compound such as vanadyl trichloride, monoethoxy divanadyl chloride, triethoxyvanadyl, vanadium oxydiacetylacetonate, vanadium triacetylacetonate, and the empirical formula RnAIX*- 7 (However, R is a hydrocarbon such as an alkyl group, O<n≦3, X is hydrogen,
A preferred method is to copolymerize ethylene and an a-olefin having 3 to 10 carbon atoms in the presence of a solvent using a catalyst consisting of a bad aluminum compound represented by chlorine or an alkoxy group having 2 to 4 carbon atoms. It is not limited to this. In the present invention, a composition comprising 70 to 95% by weight of a linear ethylene-hexene-1 copolymer and 30 to 5% by weight of high-pressure low-density polyethylene is used for the layer bonded to the base film.

直鎖状エチレン−ブテン−1共重合体又は直鎖状エチレ
ン−ヘキセン−1共重合体が、95重■%以上であると
、積層フィルムの共押出による製造時において、押1口
幾内での剪断粘度か高くなり押出加工性が極めて悪くな
り、又、伸長粘度が非常に小さく、溶融張力が小さく、
このため押出加工において押出機に高い負荷がかかり、
またTダイスての成膜性が不安定となる。すなわち耳部
の安定性が悪くなるといつ加工上の欠点が現われフィル
ムの透明性が悪くなり望ましくない。
If the linear ethylene-butene-1 copolymer or the linear ethylene-hexene-1 copolymer is 95% by weight or more, it will be difficult to produce a laminated film within 1 extrusion during production by coextrusion. The shear viscosity is high, resulting in extremely poor extrusion processability, and the elongational viscosity is extremely low, resulting in low melt tension.
For this reason, a high load is placed on the extruder during extrusion processing,
Furthermore, the film formation properties of the T-dies become unstable. That is, if the stability of the edges deteriorates, processing defects will appear and the transparency of the film will deteriorate, which is undesirable.

直鎖状エチレン−ブテン−1共重合体又は直鎖状エチレ
ン−ヘキセン−1共重合体が70重母%以下であると、
基材へのヒートシール強度、フィルム自体の機械的強度
が悪くなり望ましくない。
When the linear ethylene-butene-1 copolymer or the linear ethylene-hexene-1 copolymer is 70% or less,
This is undesirable because the heat seal strength to the base material and the mechanical strength of the film itself deteriorate.

直′i11状エチレンーブテンー1共重合体又は直鎖状
エチレン−ヘキセン−1共重合体が70〜95重量%の
範囲にあるときのみ、ヒートシール性、耐屈曲性、耐熱
性、ホットタック性、耐衝撃性、耐引裂性、透明性、剛
性等においてバランスのとれた貼合層が得られる。
Heat-sealability, bending resistance, heat resistance, and hot tack properties are improved only when the linear 11-type ethylene-butene-1 copolymer or linear ethylene-hexene-1 copolymer is in the range of 70 to 95% by weight. A laminated layer with well-balanced properties such as hardness, impact resistance, tear resistance, transparency, and rigidity can be obtained.

本発明において、ヒートシール層は密度0.91〜0.
94 g/cm″の直鎖状エチレン−ブテン−1共重合
体又は直鎖状エチレン−ヘキセン−1共重合体35〜6
0重量%と低結晶性エチレン−αオレフイン共重合体2
5〜40重量%及び高圧法低密度ポリエチレン15〜2
5重量%からなる組成物から構成される。
In the present invention, the heat seal layer has a density of 0.91 to 0.
94 g/cm'' linear ethylene-butene-1 copolymer or linear ethylene-hexene-1 copolymer 35-6
0% by weight and low crystalline ethylene-α olefin copolymer 2
5-40% by weight and high pressure low density polyethylene 15-2
The composition consists of 5% by weight.

密度0.91〜0.94 g/cm’の直鎖状エチレン
−ブテン−1共重合体又はエチレン−ヘキセン−1共重
合体の含有量が35重量%以下であるとヒートシール層
の機械的強度が弱くなり、ヒートシール強度、ホットタ
ック性等が悪くなり望ましくなく、60重量%以上であ
ると低温ヒートシール性が悪くなり望ましくない。低結
晶性エチレン−αオレフィン共重合体の含有量が25重
量%以下であると低温ヒートシール性が付与されず望ま
しくなく、40重量%以上であるとヒートシール層の機
械的強度が低下し、望ましくない。
If the content of the linear ethylene-butene-1 copolymer or ethylene-hexene-1 copolymer with a density of 0.91 to 0.94 g/cm' is 35% by weight or less, the mechanical properties of the heat seal layer It is undesirable because the strength becomes weak, and heat sealing strength, hot tack properties, etc. deteriorate, and when it is 60% by weight or more, low temperature heat sealing properties deteriorate, which is undesirable. If the content of the low-crystalline ethylene-α-olefin copolymer is less than 25% by weight, low-temperature heat-sealability will not be imparted, which is undesirable, and if it is more than 40% by weight, the mechanical strength of the heat-sealing layer will decrease, Undesirable.

高圧法低密度ポリエチレンの含有量は15〜25重量%
であるが、15重量%以下であると、ヒートシール層の
押出加工において加工性が悪くなり、25重量%以上で
あると、ヒートシール層の機械的強度と低温ヒートシー
ル性を損い望ましくない。
The content of high-pressure low-density polyethylene is 15 to 25% by weight.
However, if it is less than 15% by weight, the processability in extrusion processing of the heat-sealing layer will be poor, and if it is more than 25% by weight, it will impair the mechanical strength and low-temperature heat-sealability of the heat-sealing layer, which is undesirable. .

三者の混合比率が上記の範囲にあるときのみ、ヒートシ
ール層の低温シール性機械的強度、ホットタック性、低
温特性、耐屈曲性、押出加工性、透明性等のバランスが
とれ、本発明が成立する。
Only when the mixing ratio of the three is within the above range, the heat seal layer's low temperature sealing properties, mechanical strength, hot tack properties, low temperature properties, bending resistance, extrusion processability, transparency, etc. can be balanced, and the present invention can be achieved. holds true.

本発明の貼合用積層フィルムを基材に貼合する場合、本
発1明でいう基材フィルムに貼合する層と基材が貼合さ
れる。
When the laminated film for lamination of the present invention is laminated to a base material, the layer to be laminated to the base film in the first aspect of the present invention is laminated to the base material.

貼合する方法としては、押出ラミネート法、ドライラミ
ネート法、サンドイッチラミネート法、共押出法等公知
の方法がある。
Examples of the bonding method include known methods such as extrusion lamination, dry lamination, sandwich lamination, and coextrusion.

本発明の貼合用積層フィルムを貼合する対象としての基
材は紙、アルミニウム箔、セロハン、高分子重合体等が
あげられ、目的、被包装物に応じて適宜選択される。
The base material to which the laminated film for lamination of the present invention is laminated includes paper, aluminum foil, cellophane, high molecular weight polymer, etc., and is appropriately selected depending on the purpose and the item to be packaged.

高分子重合体としては、超低密度ポリエチレン低密度ポ
リエチレン、中密度ポリエチレン、高密度ポリエチレン
、エチレン−酢酸ビニル共重合体、エチレン−アクリル
酸エステル共重合体、アイオノマー、ポリプロピレン、
ポリブテン−1、ポリ−4−メチル−ペンテン−1、エ
チレン−αオレフィン共重合体、ポリ塩化ビニル、ポリ
塩化ビニリデン、ポリスチレン、ポリアクリレート、ポ
リアクリロニトリル、ナイロン6、ナイロン66、ナイ
ロン7、ナイロン10、ナイロン11、ナイロン12、
ナイロン610、ポリメタキシリレンアジパミド、ポリ
エチレンテレフタレート、ポリエチレンテレフタレート
−イソフタレート共重合体、ポリブチレンテレフタレー
ト、ボッビニルアルコール、エチレン−ビニルアルコー
ル共重合体、ポリカーボネート等が挙げられる。
Examples of high-molecular polymers include ultra-low density polyethylene, low-density polyethylene, medium-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, ionomer, polypropylene,
Polybutene-1, poly-4-methyl-pentene-1, ethylene-α olefin copolymer, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyacrylate, polyacrylonitrile, nylon 6, nylon 66, nylon 7, nylon 10, Nylon 11, nylon 12,
Examples include nylon 610, polymethaxylylene adipamide, polyethylene terephthalate, polyethylene terephthalate-isophthalate copolymer, polybutylene terephthalate, bobbinyl alcohol, ethylene-vinyl alcohol copolymer, polycarbonate, and the like.

本発明においてヒートシール基の厚みは最低0.010
mmから貼合積層フィルム厚さの3分の1以内である。
In the present invention, the thickness of the heat seal group is at least 0.010
mm to one-third of the thickness of the laminated film.

0.010mm以下であると、低温シール性が不十分で
あり、低温でヒートシールが可能であっても、接着強度
が弱く2弱い応力、衝撃ですぐヒートシール面が剥離し
、望ましくない。3分の1以上であると、性能的には問
題はないが、価格の高い低結晶性エチレン−αオレフィ
ン共重合体を低温ヒートシールに必要な口を越えて使用
することとなり、経済性がなくなり、望ましくない。
If it is less than 0.010 mm, the low-temperature sealability will be insufficient, and even if heat-sealing is possible at low temperatures, the adhesive strength will be weak and the heat-sealed surface will easily peel off due to weak stress or impact, which is undesirable. If it is 1/3 or more, there is no problem in terms of performance, but the expensive low-crystalline ethylene-α-olefin copolymer will be used beyond the amount required for low-temperature heat sealing, which will reduce economic efficiency. gone and undesirable.

本発明の貼合層、ヒートシール層を構成する樹脂組成物
には耐熱安定剤、酸化防止剤、着色剤、顔料、カーボン
ブラック、滑剤、加工性改良剤、目やに防止剤、スリッ
プ剤、アンチブロッキング剤、防曇剤、帯電防止剤、核
形成剤等を目的、用途に応じて添加してもよい。
The resin compositions constituting the laminating layer and heat-sealing layer of the present invention include heat-resistant stabilizers, antioxidants, colorants, pigments, carbon black, lubricants, processability improvers, eye discharge preventive agents, slip agents, and anti-blocking agents. Agents, antifogging agents, antistatic agents, nucleating agents, etc. may be added depending on the purpose and use.

以下に実施例を示す。Examples are shown below.

実施例1 直鎖状エチレン−ブテン−1共重合体(日本ユニカー製
 NUCG−5222、MI=2.0、密度0.921
)95重量%と高圧法低密度ポリエチレン(日本ユニカ
ー製DFD−0148、MI=6.3、密度0.922
)5重量%と、酸化防止剤(I RGANOXl 01
0.5ANDO3TAB−PEPQ各々0.05重量%
)とを混合し、基材フィルムに貼合する石川の(M脂組
成物(A)を県01nシた。
Example 1 Linear ethylene-butene-1 copolymer (NUCG-5222 manufactured by Nippon Unicar, MI = 2.0, density 0.921
)95% by weight and high pressure low density polyethylene (DFD-0148 manufactured by Nippon Unicar, MI=6.3, density 0.922
) 5% by weight, and an antioxidant (I RGANOXl 01
0.5ANDO3TAB-PEPQ 0.05% by weight each
) and laminated onto the base film.

一方、直鎖状エチレン−ブテン−1共重合体(日本ユニ
カー製NUCG−5222、MI=20、密度0.92
1)35重世%と高圧法低密度ポリエチレン(日本ユニ
カー:#DFD−OI48、MI=6.3、密度0.9
22)25重量%及び低結晶性エチレン−αオレフィン
共重合体(三井石油化学製タフマーA−4085、MI
=37、密度0.88)40重量%と酸化防止剤(r 
RGANOX 1010.5ANDO3TABPEPQ
各々0.05重量%)とを混合し、ヒートシール石川の
樹脂組成物(B)を準備した。
On the other hand, linear ethylene-butene-1 copolymer (NUCG-5222 manufactured by Nippon Unicar, MI=20, density 0.92
1) High pressure process low density polyethylene with 35% heavy weight (Nippon Unicar: #DFD-OI48, MI=6.3, density 0.9
22) 25% by weight and low crystalline ethylene-α olefin copolymer (Tafmer A-4085 manufactured by Mitsui Petrochemicals, MI
= 37, density 0.88) 40% by weight and antioxidant (r
RGANOX 1010.5ANDO3TABPEPQ
0.05% by weight of each) to prepare a heat-sealable Ishikawa resin composition (B).

前記樹脂組成物A及びBを下記の条件によりコンパイン
ニングアダプタ一方式共押出機を用いT−ダイより積層
押出し、2層フィルムを得た。
The resin compositions A and B were laminated and extruded from a T-die using a one-way coextruder with a companing adapter under the following conditions to obtain a two-layer film.

押出し加工条件 この2層積jΔフィルムのヒートシール層同志下記の条
件でヒートシールし、ヒートシール部の剥離強度を表1
に示した。
Extrusion processing conditions The heat-sealing layers of this two-layer laminated jΔ film were heat-sealed under the following conditions, and the peel strength of the heat-sealed portion was measured in Table 1.
It was shown to.

ヒートシール   び 離  テスト法ビートシーラー
    熱板シーラー シール圧力      ]、、 OKg/cm2シール
時間      10秒 下部バー温度     50°C シール幅       5mm ヒートシールした後放冷し、15mm幅の試験片を切り
取り、引張り速度500mm/minでヒートシール部
を剥離した際の強度を測定した。
Heat seal separation test method Beat sealer Hot plate sealer Sealing pressure ],, OKg/cm2 Sealing time 10 seconds Lower bar temperature 50°C Seal width 5 mm After heat sealing, let it cool, cut out a 15 mm wide test piece, and check the tensile speed The strength was measured when the heat-sealed portion was peeled off at 500 mm/min.

又、積石フィルムの引裂強度、衝撃強度、ヘイズ、ブロ
ッキング性を下記の方法により測定し表1に示した。
In addition, the tear strength, impact strength, haze, and blocking properties of the stacked stone film were measured by the following methods and are shown in Table 1.

弘翌史戎(エルメンドルフ:Kg/cm)JIS  P
  8116 1!強ユ(Kg°Cm/Cm) ASTM  D  l709A へ−1’ズ(%):ASTM  D  10037’O
yヱ21上、官能テストによる。
Hirotsuji Shigeki (Elmendorf: Kg/cm) JIS P
8116 1! Strength (Kg°Cm/Cm) ASTM D 1709A to -1's (%): ASTM D 10037'O
Based on the sensory test on ye21.

フィルムがくっつく状態な×、 フィルムが適度に離れる状態を O6 次に先に製造した積層フィルムとポリエチレンテレフタ
レート(PET)製0.012mm厚さのフィルムを高
圧法低密度ポリエチレン(日本ユニカー製 NUC−8
008、MI=4.7、密度0.917)を中間層とし
て、サンドイッチラミネーションを行い、この中間層の
剥離強度を測定し、表1に示した。
The state in which the film is stuck is O6, and the state in which the film is moderately separated is O6.Next, the previously produced laminated film and a 0.012 mm thick film made of polyethylene terephthalate (PET) are bonded to high-pressure low-density polyethylene (NUC-8 manufactured by Nippon Unicar).
008, MI=4.7, density 0.917) as an intermediate layer, sandwich lamination was performed, and the peel strength of this intermediate layer was measured and shown in Table 1.

実施例2〜12 実施例Iの直鎖状エチレン−ブテン−1共重合体を直鎖
状エチレン−ヘキセン−1共重合体に置換したり、各樹
脂の組成物における重■%を表1に示す如く変化させ、
その結果を示した。本発明の数値範囲では良好な効果が
ある事が表1の結果から判明する。
Examples 2 to 12 The linear ethylene-butene-1 copolymer of Example I was replaced with a linear ethylene-hexene-1 copolymer, and the weight percent of each resin in the composition was shown in Table 1. Change as shown,
The results were shown. It is clear from the results in Table 1 that within the numerical range of the present invention there is a good effect.

比較例1 ヒートシール層の厚さを0.005mmとした以外は実
施例5と同様な実験を行った。ヒートシール層が薄いの
で、剥離強度が十分でない。
Comparative Example 1 An experiment similar to Example 5 was conducted except that the thickness of the heat seal layer was 0.005 mm. Since the heat seal layer is thin, peel strength is not sufficient.

比較例2 基材フィルムに貼合する層において高圧法低密度ポリエ
チレンを全く使用せず直鎖状エチレン−ブテン−1共重
合体のみを使用したので基材層との間の剥離強度が十分
ではない。
Comparative Example 2 Since no high-pressure low-density polyethylene was used in the layer to be laminated to the base film, only linear ethylene-butene-1 copolymer was used, so the peel strength between the base film and the base film was not sufficient. do not have.

比較例3 基材フィルムに貼合する層において高圧法低密度ポリエ
チレンを40重量%としたので、積石フィルムの引裂強
度、iΦi撃強度が低下した。
Comparative Example 3 Since the layer laminated to the base film contained 40% by weight of high-pressure low-density polyethylene, the tear strength and iΦi impact strength of the stacked stone film decreased.

比較例4 ヒートシール層において、直鎖状エチレン−ブテン−1
共重合体の爪が25%と低下したので積層フィルムのブ
ロッキング性が悪くなった。
Comparative Example 4 In the heat seal layer, linear ethylene-butene-1
Since the copolymer's claw strength decreased to 25%, the blocking properties of the laminated film deteriorated.

比較例5 ヒートシール層において、低結晶性エチレンミオレフイ
ン共重合体の量が20重量%と低下したので、ヒートシ
ール強度が低下した。
Comparative Example 5 In the heat-sealing layer, the amount of low-crystalline ethylene myolefin copolymer was reduced to 20% by weight, so the heat-sealing strength was reduced.

[発明の作用効果] 本発明においては、貼合用積層フィルムの構造を2層と
し、ヒートシール部を極めて薄くしたので、高価格の低
結晶性エチレン−αオレフィン共重合体の使用量が極め
て少量ですむので、コストダウンが計られ、かつ基材へ
の貼合層を直鎖状エチレン−ブテン−1共重合体又は直
鎖状エチレン−ヘキセン−1共重合体と高圧法低密度ポ
リエチレンからなる樹脂組成物で構造したので、機械的
強度、耐衝撃性、層間接着性、耐ピンホール性、面ゴブ
ロッキング性にすぐれ、低温シール性と経済性、その地
積層フィルムに必要とされる物性のバランスがとれたす
ぐれた貼合用積層フィルムが得られる。
[Operations and Effects of the Invention] In the present invention, the structure of the laminated film for lamination is two layers, and the heat-sealed portion is made extremely thin, so the amount of expensive low-crystalline ethylene-α-olefin copolymer used is extremely reduced. Since only a small amount is required, costs can be reduced, and the bonding layer to the base material can be made of linear ethylene-butene-1 copolymer or linear ethylene-hexene-1 copolymer and high-pressure low-density polyethylene. Because the structure is made of a resin composition, it has excellent mechanical strength, impact resistance, interlayer adhesion, pinhole resistance, and face-blocking properties, as well as low-temperature sealing properties and economical properties, which are the physical properties required for the laminated film. An excellent laminated film for lamination with well-balanced properties can be obtained.

Claims (2)

【特許請求の範囲】[Claims] (1)基材フィルムに低温ヒートシール性を付与するた
めの、基材フィルムに貼合する層とヒートシール層から
なる貼合用積層フィルムにおいて、基材フィルムに貼合
する層が密度0.91〜0.94g/cm^3の直鎖状
エチレン−ブテン−1共重合体又は直鎖状エチレン−ヘ
キセン−1共重合体70〜95重量%と高圧法低密度ポ
リエチレン30〜5重量%からなる組成物から構成され
、ヒートシール層が密度0.91〜0.94g/cm^
3の直鎖状エチレン−ブテン−1共重合体又は直鎖状エ
チレン−ヘキセン−1共重合体35〜60重量%と低結
晶性エチレン−αオレフィン共重合体25〜40重量%
及び高圧法低密度ポリエチレン15〜25重量%からな
る組成物から構成される事を特徴とする低温ヒートシー
ル性の優れた貼合用積層フィルム。
(1) In a laminated film for lamination consisting of a layer to be laminated to the base film and a heat sealing layer for imparting low-temperature heat-sealability to the base film, the layer to be laminated to the base film has a density of 0. From 70 to 95% by weight of linear ethylene-butene-1 copolymer or linear ethylene-hexene-1 copolymer of 91 to 0.94 g/cm^3 and 30 to 5% by weight of high-pressure low density polyethylene The heat seal layer has a density of 0.91 to 0.94 g/cm^
35 to 60% by weight of linear ethylene-butene-1 copolymer or linear ethylene-hexene-1 copolymer and 25 to 40% by weight of low-crystalline ethylene-α-olefin copolymer
A laminated film for lamination with excellent low-temperature heat-sealing properties, characterized by comprising a composition comprising 15 to 25% by weight of high-pressure low-density polyethylene.
(2)請求項(1)において、基材に貼合する層の厚さ
が0.01mmから積層フィルム厚さの1/3までであ
る貼合用積層フィルム。
(2) The laminated film for lamination according to claim (1), wherein the thickness of the layer laminated to the base material is from 0.01 mm to 1/3 of the thickness of the laminated film.
JP32632688A 1988-12-26 1988-12-26 Laminated film with excellent low-temperature heat sealability Expired - Fee Related JP2704895B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32632688A JP2704895B2 (en) 1988-12-26 1988-12-26 Laminated film with excellent low-temperature heat sealability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32632688A JP2704895B2 (en) 1988-12-26 1988-12-26 Laminated film with excellent low-temperature heat sealability

Publications (2)

Publication Number Publication Date
JPH02172737A true JPH02172737A (en) 1990-07-04
JP2704895B2 JP2704895B2 (en) 1998-01-26

Family

ID=18186520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32632688A Expired - Fee Related JP2704895B2 (en) 1988-12-26 1988-12-26 Laminated film with excellent low-temperature heat sealability

Country Status (1)

Country Link
JP (1) JP2704895B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10119207A (en) * 1996-10-24 1998-05-12 Dainippon Printing Co Ltd Laminate and its production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10119207A (en) * 1996-10-24 1998-05-12 Dainippon Printing Co Ltd Laminate and its production

Also Published As

Publication number Publication date
JP2704895B2 (en) 1998-01-26

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