JPH02170441A - Electronic component mounted printed circuit board - Google Patents

Abstract

PURPOSE:To obtain a printed-circuit board capable of preventing a noise from being generated when a vibration and a shock are exerted by a method wherein a connection wire which connects, like a bridge, one set of two points of an electric circuit composed of a printed wiring pattern and an electronic component is provided and the connection wire is buried in a sealing agent with which the printed-circuit board has been coated and whose hardness is high at a JIS hardeness 20 or higher. CONSTITUTION:A printed wiring pattern 3b of a ceramic board 2 is formed; a silicon radiation sensor 4 as an electronic component is mounted on the board 2. One set of two points of an electric circuit 7 composed of the wiring pattern 3b and the sensor 4 are connected like a bridge by using a connection wire 5; the connection wire 5 is buried in a silicone rubber 15 as a sealing agent with which the board 2 has been coated and which is at a JIS hardness 20 or higher. The connection wire 5 and the silicone rubber 15 are sealed with a silicone gel 6 at a part between the sensor 4 and the printed wiring pattern 3b.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to electronic component mounting used in electronic equipment, etc., in which electronic components such as semiconductor radiation sensors are mounted on a printed circuit board provided with printed wiring. The present invention relates to a printed circuit board device, particularly a device that does not generate noise in an electric circuit consisting of printed wiring and electronic components even when subjected to vibration or shock.

[Conventional technology]

FIG. 7 is a sectional view illustrating the configuration of a conventional electronic component mounting printed circuit board device l. In the figure, "C12" is -1
A printed circuit board with printed wiring patterns 3m and 3b is provided, and 4 is a ceramic substrate at ℃, and 4 is a ceramic substrate 2.
The anode 4a of the sensor 4, which has a diode structure in this case, is conductively fixed to the pattern 3a, and the sensor 4
The cathode 4b of is connected to the pattern 3b via the connection line 5. 6 is connected to the pattern 3ae 3b and the sensor 4
1@Circuit 7 consisting of
l+z consists of the above-mentioned parts. Here, the silicon gel 6 is provided to mechanically and chemically protect the sensor 4 from the outside world.

The printed circuit board device 1 is configured as described above. Conventionally, it has been used for the purposes described below.

That is, FIG. 8 is an electrical circuit diagram of a radiation measuring device 8 using a substrate mounting TTL. 11 is a coupling capacitor configured to input potential fluctuations in the pattern 3bK to the amplification section 12, and 13t'! is a counting section that counts the pulses output from the amplification section 12. Since each part of the sensor in the figure is constructed as described above, when, for example, an r-ray 14 is incident on the depletion layer formed in the sensor 4 due to the application of a reverse bias voltage, electrons and A pulse current flows through the resistor 10, which is a hole pair generator, and as a result, a pulse voltage is input to the amplifying section 12, and the t counting section 13 performs a pulse counting operation.However, t, in this case, the counting section 1
The dose of industrial gamma rays 14 can be determined based on the counting results in step 3.

[Between the lines where the invention is about to disappear]

The printed circuit board device l is used for the above-mentioned purpose, but in this case, the sensor 4K Am is 7'114
is incident, (1
) The electrically dense charge shown in Figure 2 flows. Here, 3.6
CeV) 1! The energy required to generate a t-electron-hole pair in the silicon sensor 4 is 1.602
[C) is the electrical quantity of electrons or holes.

(59X103(eV)/3.6[6V))Xl, 6
02XLO-1QCc)-2,63X10 [C]
...... (1) In other words, when the above-mentioned r-ray 14 is incident on the sensor 4, the electrical circuit K between the patterns 38 and 3b causes a variation in the electrical quantity on the right side of equation (1), 1, this electric I fluctuation ΔQ is caused by the fact that an electric current EEE of K l 5 (V) is applied between the patterns 3a and 3b, so that the capacitance C between the connection line 5 and the pattern 38 is ( This is equivalent to changing by ΔC shown in equation 2.

jc=JQβ=zb3xxo-”[C)/l 5[V)
= 1.8 Assuming that the widths tlK are equal, the distance between the connection @5 and the pattern 3a is dam), the diameter and length of the connection line 5 are w (m) and tCrr], and the specific fat charge of the silicone gel 6 is (8g), and let the a-electricity of the JE sky be [ε0] and 1(3
) formula holds, and from this formula 11, it is derived that the above-mentioned ΔC is equivalent to the variation ΔdK of the distance d shown in formula (4).

Cm(ε0)・(εs)・(w-z)/d --
−−−−(3)Δd=d2*(ΔC)/((ε0)−(
εa) - (W@t) (4) Therefore, now, W = 75 [: μm], t = 5 Cm: 1.
If d=0.4Cs++”l, (εo)=8.8
Since there is 55XlOCF/m) and (εS)=2.4 f, ΔC=1.8Xlo CF)7, and Δd=3.6XlO is obtained from equation (4). Therefore.

In the radiation measuring device 8, the connecting wire 5 is connected to the pattern 3a.
Displacement 1 and r1gL with respect to I/c "C3,6Cμm3 or more
It is clear that errors occur in the dose measurement results of No. 4.

However, as mentioned above, the connection line 5 is made of silicone gel 6.
This gel 6 is originally a soft material, so when vibration or shock is applied to the printed circuit board device 1, the gel 6 vibrates and excites the connecting wire 5. As a result, the connections and glands 5 may vibrate with an amplitude of 3.6 [μm] or more.
, 3bnl: There is a problem in that noise is generated and, for example, the radiation measuring device 8 when this substrate device 1 is used may malfunction.

An object of the present invention is to obtain a printed circuit board device mounted with electronic components that does not generate electrical noise even when subjected to vibrations or shocks.

[Means to solve section moe]

In order to achieve the above object, the present invention provides a printed circuit board provided with a printed wiring pattern.

The printed circuit board [1! and a connecting line connecting at least one set of two points in an electric circuit including the printed wiring pattern and the electronic component in a bridge shape, and at least the connecting line is coated on the printed circuit board. The electrical and electronic component mounted printed circuit board device is constructed by embedding it in a hardness sealing agent having a JIS hardness of 20 or more.

That's it 1. According to one aspect of the invention, there is provided a printed circuit board provided with a printed wiring pattern, an electronic component mounted on the printed circuit board, and at least one set of two points in an electric circuit including the printed wiring pattern and the electronic component. The electric circuit is provided with a connecting wire that connects the electrical circuit in the form of a bridge, and an L-shaped cap that forms an airtight space together with the printed circuit board and confines the electrical circuit and the connecting wire in the airtight space. Configure a component mounting printed circuit board device.

Furthermore, according to the present invention, there is provided a printed circuit board provided with a printed wiring pattern, an electronic component mounted on the printed circuit board, and an electric circuit comprising the printed wiring pattern and the electronic component. a connecting line connecting at least one set of two points in a bridge shape, and an L'C electronic component mounted printed circuit board device so that the electronic component is embedded in a sealant applied to the printed circuit board. Configure.

[Effect]

With the above configuration, the electronic component mounted pre-seat board device in which the connection wires are embedded in the encapsulant is subjected to vibrations and shocks, and the encapsulant is hard and vibrates with a large amplitude. Since only one step is required, large-amplitude vibrations of the connecting wires do not occur, and as a result, a printed circuit board device that does not generate minute noise due to vibrations or shocks can be obtained. Also, if a printed circuit board device with connecting wires enclosed in an airtight space is operated and vibration or shock is applied to the device.

The only cause of the excitation force on the connection is the inertial mass of the connection wire. Wanting 1. In this case, since the mass is usually small, the connecting wire does not vibrate with a large amplitude.
．． A printed circuit board device that does not generate 1wL of noise due to machine vibration or impact can be obtained. In addition, the printed circuit board device embedded in the Wl electronic component sealant 1:
In this case, the cotton wire is exposed to the outside air.'c1 This connecting wire has a small inertial mass as mentioned above, so it does not vibrate greatly due to vibration or impact. A printed circuit board device that does not generate electrical noise due to vibration or impact can be obtained.

〔Example〕

Figure a1 is a vertical cross-sectional diagram of the first embodiment of the present invention in which the connecting wire 5 is embedded in a highly hard sealant, and the difference from Figure 7 in this figure is the electric circuit of the VC continuous cotton wire 5. 7, it is embedded in the silicone rubber 15 applied to the ceramic substrate 2 as a hard sealant. Yes L
℃, in this case, a rubber having a hardness of 20 or more according to the silicone rubber 15 and 11ΣJISK is used. This rubber is harder than the silicone gel 6 described above, so when vibrations or shocks are applied to it, it does not move in a large range as in the case of the gel 6. However, if the printed circuit board device is configured as shown in Fig. 1, large-amplitude vibrations of the connecting wire 5 will not occur even when vibrations or shocks are applied, and air noise will not occur. A substrate device is obtained. In this case, the sensor 4 is also buried in the rubber 15. 1: Both the electric circuit 7 including the sensor 4 and the connecting wire 5 are mechanically and chemically protected from the outside world by the rubber 15.

Figure 2 is a longitudinal cross-sectional view of the second embodiment of the present invention in which the connections 5 are embedded in a hard sealant.
Differences from the diagram: Connection #a5 and the pattern 3b connected to both ends of the connection line, the sensor 40 part, and the pattern 3a part near this sensor part are embedded in the silicone rubber 15. 'c, and silicone rubber 15
The part of the electric circuit 137 that is not covered by the rubber 15 is embedded in the silicone gel 6 applied to the substrate 2. In figure m2, 'c' is the printed circuit board device since each part is configured as described above.

It is clear from the above that the sensor 4 etc. is a board device that does not generate any mechanical noise during imaging or impact, and is mechanically and chemically resistant to the outside world. be. In addition, as mentioned above, silicon gel 6 is used in this printed circuit board assembly. Because it has the ability to absorb
It has the advantage of being more resistant to thermal shock and mechanical shock than the one shown in the figure.

Figure 3 shows aluminum JIII with a diameter of 200 Cμm.
The part of the printed circuit board device in the radiation wrap measurement device 8 shown in FIG. 8, which was formed using the printed circuit board device shown in FIG. 1 or FIG. 1 of the miscounts exhibited by the counting section 13 when
! In the explanatory diagram of the test results, Fig. 3 shows the silicone gel manufactured by Toshiba Silicon Co., Ltd., product number YFiS818 as silicone gel 6, and the hardness 24 rubber is Shin-Etsu Chemical Co., Ltd. product number 115, product number KH109. It shows the JJI combination using silicone rubber 15 and 1, and the hardness 50 rubber shows the case where product number 1 (E106 made by Shin-Etsu Chemical Co., Ltd.) is used as silicone rubber 15 and 1. A) Hardness of 24° and 50 are both rubber #! degrees according to the JIS definition.So L'
In the case of 0 com, it is clear that the miscounts are approximately 9 and 2, respectively, and from this figure 3 it is clear that the printed circuit board device shown in figure 1 is subject to vibrations and shocks! 'It depends on XK! It can be confirmed that the equipment generates a lot of noise and becomes an ugly device.

FIG.
&c This is a vertical cross-sectional configuration diagram of an actual example of the present invention in which the present invention is closed, and the difference from FIG. 1 and FIG. A ceramic cap 17 is provided to confine the electrical circuit 7 and the connecting wire 5, and the electrical circuit 7 and the connecting wire 5 are not embedded in the silicone rubber 15 or silicone gel 6. 1B is nitrogen gas sealed in the cavity 16. When a printed circuit board device is formed as shown in FIG. mechanical,
It is clear that chemical protection is provided, but in this case, vibrations and shocks are applied to the printed circuit board device.
Generated elastic vibration wave 1 eceramic substrate 2 and cap 17
It branched out and spread.

Vibration waves propagating to the connection line 5 are reduced. Yes L'c,
Furthermore, in this case, v! The connecting wire 5 excitation source tx is only the inertial mass of the connecting wire, and since the dimensions of the connecting wire 5 are as described above, this mass is extremely small.

Therefore, if the printed circuit board device is formed as shown in Fig. 4, the connections @5 will not move significantly (t), and the printed circuit board device will generate less electrical noise when subjected to vibration or impact. You can get it.

In Figure 4, the CtX cap 17 is made of ceramic.

This cap 171 has excellent light shielding and sealing properties compared to the transparent and slightly moisture permeable silicone gel 6 shown in FIG. The printed circuit board assembly g11 shown in FIG. 7 has the advantage of being more resistant to environmental conditions such as bright light and humidity.

FIG. 5 is a vertical cross-sectional view of an embodiment of the present invention in which an electronic component is embedded in a sealant. The difference from FIG. This is the point where the buried machining is done and the tangent PA line 5 is exposed. When configured as shown in Figure 5, it ranks 4th in terms of environmental resistance.
Although it is inferior to the printed circuit board device shown in the figure, it is similar to the printed circuit board device.

It is clear that a printed circuit board device that generates less electrical noise when subjected to impact can be obtained. The printed circuit board device shown in FIG. 5 does not require the cap 17 as shown in FIG. 4, so it has the advantage that CM fabrication is easier than in FIG. 4.

Figure 6 t This is an explanatory diagram of the experimental results of miscounts exhibited by each counting unit 13 when a weight is dropped from a height of 10 (cm) and collided with it. In the case of the printed circuit board device shown in FIG. 5, Z is the case of the printed circuit board device shown in FIG. Yes, C, this l! Experimental smell "Ct"
Z All connections 15 on each printed circuit board device 1 diameter 7
5 [μm] aluminum cage, silicone gel 6 and L℃ Shin-Etsu Chemical Co., Ltd. product number KJR9010
As the cap 17, product number 40LDCAP manufactured by Kyocera Corporation is used. From Fig. 6, it is clear that when the printed circuit board device is configured as shown in Fig. 4 or Fig. 5, the generation of electrical noise is significantly reduced.In particular, in the case of Fig. 4, an experimental result was obtained in which there were no erroneous counts. There is.

Each one of the above! In the embodiment, a silicon radiation sensor layer is mounted on the ceramic substrate 2, but in the present invention, the substrate 2 may be made of a material other than ceramic, and the sensor 4 may be made of other electronic components, For example, if it is a semiconductor pressure sensor, temperature may not be a problem, *:tS:
, at least one of a plurality of electronic components such as 4 and a plurality of connection lines such as connection line 5 may be provided.

〔Effect of the invention〕

As described above, one aspect of the present invention is to provide a printed circuit board provided with a printed wiring pattern, an electronic component not mounted on the printed circuit board, and at least one set of electronic components in an electric circuit consisting of the printed wiring pattern and the electronic component. A KL'C electronic component mounted printed circuit board, comprising: a connecting line connecting two points in a bridge-like manner; Configured the device.

In addition, in the present invention, t refers to a printed circuit board provided with a printed wiring pattern, an electronic component mounted on the printed circuit board Km, and at least one set in an electric circuit consisting of the printed wiring pattern and the electronic component. and a cap that forms an airtight space together with the printed circuit board and is pressurized to confine the electrical circuit and the connection wire in this airtight space. A component mounting printed circuit board device was constructed.

Yes, C, another invention of 'CG'! A connection that connects at least one set of two points in an electric circuit consisting of a printed circuit board with a printed wiring pattern, an electronic component mounted on the printed circuit board, and the printed wiring pattern and the electronic component. wire, and the electronic component is embedded in a sealant applied to the printed circuit board.
A printed circuit board device for mounting child components was constructed.

Therefore, when configured as above, I! 5;5! When installing an electronic component mounting printed circuit board device in which the wire is embedded in a sealant, vibration and shock may be applied to the device.Since the sealant is hard, it will not vibrate with a large amplitude, so the connecting wire t without large-amplitude vibrations occurring.

As a result, it is possible to obtain a printed circuit board device that does not generate noise due to vibration or impact.

Also, i! ! In a printed circuit board device confined in a closed space, 1. If vibration or shock is applied to the tX device, Il! ! ! 4J! It is only the inertial mass of the connecting wire that causes the excitation force to be applied to the connecting wire. However, in this case, since the mass is usually small, the connecting wires do not vibrate with large amplitude, and the printed circuit board device does not generate electrical noise due to vibration or impact. There are benefits to be gained. In addition, in a printed circuit board device in which i-child components are embedded in a sealant, the temperature is 2°C when the v1 connection wire is exposed to the outside air.
When I get used to it, I get used to it! ! As with the continuation line, the chronic mass is small, so it does not vibrate greatly due to vibration or impact.

In this case as well, it is possible to obtain a printed circuit board device that does not generate CC air noise due to vibrations or shocks.

[Brief explanation of the drawing]

1, 2, 4, and 5 are longitudinal configuration diagrams of different embodiments of the present invention, and FIG. 3 and FIG.
's different experimental results explanatory diagrams, Figure 7 is a longitudinal configuration diagram of a conventional electronic component mounted printed circuit board device, and Figure 888 is an electrical circuit diagram of a radiation measuring device using the electronic component mounted printed circuit board device of Figure 7. . l...Electronic component mounting printed circuit board device 2 *
**ew ceramic substrate, 3a*3b...printed wiring pattern, 4...silicon radiation sensor, 5...connection line. 6...Silicone gel, 7.+e*e*electric circuit, 15-... Silicone rubber, 16...
Airtight space, 17... cat. Notebook diagram

Claims (1)

[Scope of Claims] 1) A printed circuit board provided with a printed wiring pattern, an electronic component mounted on the printed circuit board, and at least one set of two in an electric circuit consisting of the printed wiring pattern and the electronic component. 1. An electronic component mounting printed circuit board device comprising: a connecting line connecting points in a bridge-like manner; and at least the connecting line is embedded in a sealant having a JIS hardness of 20 or more coated on the printed circuit board. 2) A printed circuit board provided with a printed wiring pattern, an electronic component mounted on the printed circuit board, and a bridge-like connection between at least one set of two points in an electric circuit consisting of the printed wiring pattern and the electronic component. an electronic component mounting printed circuit board device, comprising: a connecting line that is connected to the printed circuit board; and a cap that forms an airtight space together with the printed circuit board and confines the electrical circuit and the connecting line in the airtight space. . 3) A printed circuit board provided with a printed wiring pattern, an electronic component mounted on the printed circuit board, and a bridge-like connection between at least one set of two points in an electric circuit consisting of the printed wiring pattern and the electronic component. What is claimed is: 1. An electronic component mounted printed circuit board device, comprising: a connecting line for connecting the electronic component to the printed circuit board; and the electronic component is embedded in a sealant applied to the printed circuit board.