JPH02169661A - Production of lowly resistant molding resin article - Google Patents
Production of lowly resistant molding resin articleInfo
- Publication number
- JPH02169661A JPH02169661A JP32315088A JP32315088A JPH02169661A JP H02169661 A JPH02169661 A JP H02169661A JP 32315088 A JP32315088 A JP 32315088A JP 32315088 A JP32315088 A JP 32315088A JP H02169661 A JPH02169661 A JP H02169661A
- Authority
- JP
- Japan
- Prior art keywords
- molding material
- molding
- lowly
- resin article
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 14
- 229920005989 resin Polymers 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000465 moulding Methods 0.000 title description 4
- 239000012778 molding material Substances 0.000 claims abstract description 37
- 229920000728 polyester Polymers 0.000 claims abstract description 15
- 238000001746 injection moulding Methods 0.000 claims abstract description 13
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 7
- 150000001336 alkenes Chemical class 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 238000009757 thermoplastic moulding Methods 0.000 claims description 5
- 239000011231 conductive filler Substances 0.000 abstract description 13
- -1 polyethylene terephthalate Polymers 0.000 abstract description 12
- 229920001707 polybutylene terephthalate Polymers 0.000 abstract description 7
- 239000004743 Polypropylene Substances 0.000 abstract description 6
- 229920001155 polypropylene Polymers 0.000 abstract description 6
- 238000002347 injection Methods 0.000 abstract description 5
- 239000007924 injection Substances 0.000 abstract description 5
- 239000004698 Polyethylene Substances 0.000 abstract description 2
- 229920000515 polycarbonate Polymers 0.000 abstract description 2
- 239000004417 polycarbonate Substances 0.000 abstract description 2
- 229920000573 polyethylene Polymers 0.000 abstract description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 2
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 2
- 229920001169 thermoplastic Polymers 0.000 abstract 3
- 239000004416 thermosoftening plastic Substances 0.000 abstract 3
- 238000013329 compounding Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920001197 polyacetylene Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電気機械器具の筐体や機構部品で帯電防止機
能が要求される低抵抗性樹脂成形部品またはその成形材
料の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for producing low-resistance resin molded parts or molding materials thereof, which are required to have an antistatic function in casings and mechanical parts of electrical equipment.
帯電防止機能が要求される電気機器部品においては、そ
の体積固有抵抗が100−備以下の低い抵抗範囲にある
ことが求められる。この種の低抵抗性成形材料としては
、従来ABS樹脂(アクリロニトリルーズタジェンース
チレンターボリマー)やポリエチルメタクリレート樹脂
(PMMA)などの汎用プラスチックや、ポリブチレン
テレフタレート樹脂(PBT)、ポリカーボネート樹脂
(PBT )等の汎用エンシリアリング樹脂と呼、ばれ
る成形材料に、黄銅やアルミニウム、ステンレス合金等
の金属繊維や、カーボンブラック、カーボン7アイパ、
およびグラファイトといった導電性物質(以下導電性フ
ィラーと呼ぶ)を適量添加して成形したものが知られて
おり、導電性フィラーが相互に接触し合って低抵抗性を
現わす。Electrical equipment parts that are required to have an antistatic function are required to have a volume resistivity in a low resistance range of 100-V or less. This type of low-resistance molding materials include conventional general-purpose plastics such as ABS resin (acrylonitrile-loose-styrene-styrene turbopolymer) and polyethyl methacrylate resin (PMMA), polybutylene terephthalate resin (PBT), and polycarbonate resin ( PBT) and other general-purpose enserializing resins are molding materials that include metal fibers such as brass, aluminum, and stainless steel alloys, as well as carbon black, carbon 7 ipa,
It is known that the conductive material (hereinafter referred to as conductive filler) is added to form a suitable amount of conductive material such as graphite.The conductive fillers come into contact with each other and exhibit low resistance.
従来低抵抗性樹脂成形材料(以下成形材料と略称する)
、ことにポリエステル系樹脂に導電性フィラーを添加し
て成形材料とする場合、使用できる導電性フィラーの種
類も限られておシ、種類によっては高価なフィラーもあ
る。また、射出成形の際の成形性に悪影響を与えたり、
成形品の機械的特性を低下させるなど、導電性フィラー
を添加するこ・とには種々の問題点が存在する。また、
低抵抗性成形材料はその製造者が導電性フィラーを添加
した状態で供給するのが普通であり、成形者が独自に導
電性フィラーを選択し添加して成形材科をv4!1にす
ることが難かしく、林料選択の自由度が制約されるとい
う問題がある。Conventional low-resistance resin molding materials (hereinafter abbreviated as molding materials)
In particular, when adding a conductive filler to a polyester resin to make a molding material, there are limited types of conductive filler that can be used, and some fillers are expensive depending on the type. In addition, it may adversely affect moldability during injection molding,
There are various problems with adding conductive fillers, such as deterioration of the mechanical properties of molded products. Also,
Low-resistance molding materials are usually supplied with conductive fillers added by their manufacturers, and molders can select and add conductive fillers on their own to make the molding material grade v4!1. There is a problem in that it is difficult to select forest materials, and the degree of freedom in selecting forest materials is restricted.
一方、ポリエステル系樹脂そのものの体積固有抵抗は一
般に10130−偲オーダの高い電気絶縁性を有するの
で、その成形品に他物体が接触した後離れるか、あるい
は表面を他物体が摩擦したシして成形品表面に静電気が
発生すると、帯電した静電気の漏れや拡散が高い絶縁抵
抗によって阻害され成形品表面の静電荷が長時間伐るい
わゆる帯電現象が発生する。成形品表面の静電荷は大気
中の塵埃などを吸着する性質があるので成形品表面が汚
損されるという問題が発生する。また帯電した成形品に
接地された導電体が接近すると静電気放電が生ずること
が間々あシ、近年電子化され九電気機器では静電気放電
によって生ずるサージ電圧によってICなどの半導体回
路が損傷するという問題が発生してお夛、その改善が求
められている。On the other hand, the volume resistivity of the polyester resin itself is generally on the order of 10130 mm, which is a high level of electrical insulation. When static electricity is generated on the surface of a molded product, leakage and diffusion of the charged static electricity is inhibited by high insulation resistance, resulting in a so-called charging phenomenon in which the static charge on the surface of the molded product continues for a long time. Since the static charge on the surface of the molded product has the property of adsorbing dust and the like in the atmosphere, a problem arises in that the surface of the molded product is contaminated. In addition, when a grounded conductor comes close to a charged molded product, static electricity discharge often occurs, and in recent years electronic equipment has become a problem where semiconductor circuits such as ICs are damaged by surge voltage caused by static electricity discharge. This has occurred and improvements are required.
この発明の目的は、導電性フィラーを用いずに体積固有
抵抗が1o10Ω−備以下の範囲にある帯電防止機能を
有す1低抵抗樹脂成形品または成形材を得ることにある
。An object of the present invention is to obtain a low-resistance resin molded product or molded material having an antistatic function and having a volume resistivity of 1010 Ω or less without using a conductive filler.
上記課題を解決するために、この発明方法によれば、ポ
リエステル系の熱可塑性成形材料にオレフィン系成形材
料を1ないし20重量%の割合でドライブレンドした後
、射出成形を行うこととする。In order to solve the above problems, according to the method of the present invention, an olefin-based molding material is dry-blended with a polyester-based thermoplastic molding material at a ratio of 1 to 20% by weight, and then injection molding is performed.
上記手段において、ポリエステル系の熱可塑性成形材料
としてのポリブチレンテレフタレート。In the above means, polybutylene terephthalate is used as a polyester-based thermoplastic molding material.
ポリエチレンテレフタレート、ポリオキシベンゾイル(
芳香族ポリエステル)などの結晶性材料やポリカーボネ
ートなどのビスフェノール系の非晶性ポリエステル材料
にボリグロビレン、ポリエチレンなどのオレフィン系成
形材料を1重量%ないし20’1iilXの割合で射出
成形機のホッパー中等でドライブレンドした後、射出成
形するよう構成したことによシ、両材料が絶縁材料であ
るにも拘らず、ポリオレフィン系材料がポリエステル系
材料の存在下で射出成形される過程で共役二重結合を持
つ有機系導電物質である例えばポリアセチレンに変化し
て低抵抗特性が現われるようになったものと考えられ、
得られた成形品の体積固有抵抗はボリオレフイ系材料を
1重量%を添加するだけで数桁、数%から十数%の添加
では最大10桁近い低下を示し、機械的摩擦や接触等に
よる静電気帯電や静電気放電の防止機能が得られるとと
もへ画成形材料の相溶性がよく成形性および特性を損う
ことなく均質な成形品が容易に得られる。Polyethylene terephthalate, polyoxybenzoyl (
Aromatic polyester) or bisphenol-based amorphous polyester material such as polycarbonate is mixed with an olefin molding material such as polyglopylene or polyethylene at a ratio of 1% by weight to 20'1iilX in a hopper of an injection molding machine or the like. Due to the structure in which injection molding is performed after blending, the polyolefin material has conjugated double bonds in the process of injection molding in the presence of the polyester material, even though both materials are insulating materials. It is thought that it changed to an organic conductive material, such as polyacetylene, and developed low resistance characteristics.
The volume resistivity of the obtained molded product decreases by several orders of magnitude when only 1% by weight of the polyolefin material is added, and by up to 10 orders of magnitude when the addition ranges from a few percent to a dozen percent. In addition to providing the function of preventing electrification and electrostatic discharge, the compatibility with the image molding material is good, and homogeneous molded products can be easily obtained without impairing moldability and properties.
以下この発明方法を実施例に基づいて説明する。 The method of this invention will be explained below based on examples.
ポリエステル系の熱可塑性成形材料としてポリブチレン
テレフタレート(PBT)を用い、オレフィン系成形材
料としてポリプロピレン(pp)を用い、射出成形機の
ホッパー内における両者の混合割合を大幅に変えて板状
または箱状の成形品を射出成形し、その体積抵抗を測定
した。Using polybutylene terephthalate (PBT) as a polyester-based thermoplastic molding material and polypropylene (PP) as an olefin-based molding material, the mixing ratio of both in the hopper of an injection molding machine is significantly changed to produce plate-shaped or box-shaped molding materials. A molded article was injection molded, and its volume resistance was measured.
第1図は得られた成形品の体積固有抵抗の代表例を示す
特性線図、第1表はその主要部分のデータ式である。FIG. 1 is a characteristic diagram showing a typical example of the volume resistivity of the obtained molded product, and Table 1 is a data formula of the main parts thereof.
第 1 表
ポリプロピレン(pp)を1重量%添加するだけで体積
固有抵抗ρは10′Ω−信オーダに急激に低下し、PP
の添加量が増すべしたがって固有抵抗ρはさらに低下し
、添加量が8ないし16重量%の範囲で固有抵抗ρは1
06ないし10’Ω−傷オーダ(最低lX10 Ω−
c1n)にまで低下する。さらに添加量を増すと、18
1量%で108Ω−傭オーダ、201E量%で1×10
0−濡オーダと体積固有抵抗が増加し、添加量30ない
し40重置方以上では絶縁性をほぼ回復する。すなわち
、射出成形された成形品の体積固有抵抗ρと、ポリエス
テル系成形材料およびオレフィン系成形材料の混合比と
の間に明らかな相関性が認めらベオレフイン系成形材料
の配合比が1ないし20重量%の範囲で10’ないし1
0 Ω−偲に体積固有抵抗が低下し、帯電防止機能を有
する成形品を得ることができる。Table 1 By adding only 1% by weight of polypropylene (PP), the volume resistivity ρ rapidly decreases to the order of 10'Ω-Ω, and PP
As the amount of addition increases, the resistivity ρ further decreases, and when the amount added is between 8 and 16% by weight, the resistivity ρ becomes 1.
06 to 10'Ω-flaw order (minimum lX10Ω-
c1n). If the amount added is further increased, 18
108Ω at 1%, 1×10 at 201E
The 0-wetting order and volume resistivity increase, and when the addition amount is 30 to 40 or more, the insulation property is almost restored. In other words, there is a clear correlation between the volume resistivity ρ of the injection molded product and the mixing ratio of the polyester molding material and the olefin molding material. % range from 10' to 1
The volume resistivity is reduced to 0 Ω, and a molded article having an antistatic function can be obtained.
また、成形条件は主材であるポリエステル系成形側斜を
用い九成形品の射出成形条件と特に変わりなく、導電性
フィラーを含まないので表面状態のよい成形品が容易に
得られるとともに1その機械的強度や熱的特性にも悪影
響は認められない。In addition, the molding conditions are not particularly different from the injection molding conditions for 9 molded products using the main material, polyester molding side slope, and since it does not contain conductive filler, it is easy to obtain molded products with good surface condition, and 1. No adverse effects were observed on physical strength or thermal properties.
二m@の絶縁材の配合によって抵抗が下がるメカニズム
については現在のところ明確ではないカーオレフィン系
材料がポリエステル系材料の存在下で射出成形される過
程で共役二重結合を有する例えばポリアセチレン等の有
機系導電物質に変化したことによるものと推定され、有
機系導電物質が絶縁材に占める割合やその分散状態によ
って体積固有抵抗が変化しているものと考えられる。The mechanism by which resistance decreases due to the combination of 2m@ insulating materials is not clear at present.In the process of injection molding of carbon olefin materials in the presence of polyester materials, organic materials such as polyacetylene, which have conjugated double bonds, It is presumed that this is due to the change to an organic conductive material, and it is thought that the volume resistivity changes depending on the proportion of the organic conductive material in the insulating material and the state of its dispersion.
また、この製造方法は電気機械器具のカバーや機構部品
など導電性が要求される成形部品の製造方法として有効
であるとともに、成形品を例えばペレット状に射出する
ことKより、導電性樹脂成形材料を製造することも容易
でちゃ、このような成形側斜を提供することKよって導
電性フィラーなどを含まない均質な低抵抗性樹脂成形品
をポリエステル成形材料を用いるのと同様に射出成形ま
たは圧縮成形することができる。In addition, this manufacturing method is effective as a method for manufacturing molded parts that require electrical conductivity, such as covers and mechanical parts for electrical equipment, and it is also possible to use conductive resin molding materials rather than injecting molded products into pellets, for example. It is also easy to produce a homogeneous, low-resistance resin molded product that does not contain conductive fillers etc. by injection molding or compression in the same way as using polyester molding materials. Can be molded.
この発明は前述のように、ポリエステル系の熱可塑性成
形材料にオレフィン系成形材料を1ないし20重量%の
範囲で射出成形機のホッパー中でドライブレンドした後
、射出成形を行うよう構成した。その結果、二種類の成
形材料はそれぞれ絶縁材料であるにも拘らず、射出成形
された成形品または成形材、科はその体積固有抵抗が1
0’Ω−era カら1010Ω−傷オーダに大幅に下
がり、導電性フィラーを用いた従来の成形材料または成
形品とは組成の異なる新丸な低抵抗樹脂成形材料および
その成形品を提供することができる。As described above, the present invention is configured such that an olefin molding material is dry blended with a polyester thermoplastic molding material in a range of 1 to 20% by weight in the hopper of an injection molding machine, and then injection molding is performed. As a result, although the two types of molding materials are insulating materials, the volume resistivity of injection molded products or molding materials is 1.
To provide a new low-resistance resin molding material and a molded product thereof, which has a significantly lower resistance from 0'Ω-era to 1010Ω-era and has a composition different from conventional molding materials or molded products using conductive fillers. Can be done.
また、その製造方法も二種類の安定した品質の成形材料
をホッパー内でドライブレンドした後直ちに射出成形す
る簡単な操作で帯電防止機能を有する成形品が得られる
ので、導電性フィラーという異質な材料を配合すること
によって生ずる成形性に対する悪影響や成形品の機械的
特性の低下などが排除されて均質かつ表面状態のよい成
形品が容易に得られるとともに1導電性フイラーやその
配合材料を用いる場合に比べ材料選択の自由度が増し、
経済性の面でも有利になるなどの利点が得られる。In addition, the manufacturing method is simple: two types of molding materials of stable quality are dry blended in a hopper, and then immediately injection molded. Molded products with antistatic properties can be obtained by a simple operation. This eliminates the negative effects on moldability and deterioration of the mechanical properties of molded products caused by blending, making it easy to obtain molded products with a homogeneous and good surface condition. Compared to this, the degree of freedom in material selection increases,
Advantages such as economical advantages can be obtained.
さらに、発明方法により例えばベレット状の低抵抗性樹
脂成形材料を提供することによシ、帯電防止機能が求め
られる成形品の適用範囲、の拡大に貢献できるとともに
、成形条件の工夫によって内部は低抵抗性2表面は絶縁
性を有する成形品やその逆の構成の成形品を得ることも
可能である。Furthermore, by providing a pellet-shaped low-resistance resin molding material using the method of the invention, it is possible to contribute to expanding the scope of application of molded products that require antistatic function, and by devising molding conditions, the internal It is also possible to obtain a molded product having an insulating property on the resistive 2 surface, or a molded product having the opposite configuration.
Claims (1)
成形材料を1ないし20重量%の割合でドライブレンド
した後、射出成形を行うことを特徴とする低抵抗性樹脂
成形材の製造方法。1) A method for producing a low-resistance resin molding material, which comprises dry blending an olefin molding material with a polyester thermoplastic molding material at a ratio of 1 to 20% by weight, and then performing injection molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32315088A JPH02169661A (en) | 1988-12-21 | 1988-12-21 | Production of lowly resistant molding resin article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32315088A JPH02169661A (en) | 1988-12-21 | 1988-12-21 | Production of lowly resistant molding resin article |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02169661A true JPH02169661A (en) | 1990-06-29 |
Family
ID=18151643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32315088A Pending JPH02169661A (en) | 1988-12-21 | 1988-12-21 | Production of lowly resistant molding resin article |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02169661A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011231286A (en) * | 2010-04-30 | 2011-11-17 | Sekisui Plastics Co Ltd | Polylactic acid-based resin foam molded article |
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1988
- 1988-12-21 JP JP32315088A patent/JPH02169661A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011231286A (en) * | 2010-04-30 | 2011-11-17 | Sekisui Plastics Co Ltd | Polylactic acid-based resin foam molded article |
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