JPH0216856Y2 - - Google Patents

Info

Publication number
JPH0216856Y2
JPH0216856Y2 JP14504786U JP14504786U JPH0216856Y2 JP H0216856 Y2 JPH0216856 Y2 JP H0216856Y2 JP 14504786 U JP14504786 U JP 14504786U JP 14504786 U JP14504786 U JP 14504786U JP H0216856 Y2 JPH0216856 Y2 JP H0216856Y2
Authority
JP
Japan
Prior art keywords
printed circuit
reflow
reflow oven
claw
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14504786U
Other languages
Japanese (ja)
Other versions
JPS6353360U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14504786U priority Critical patent/JPH0216856Y2/ja
Publication of JPS6353360U publication Critical patent/JPS6353360U/ja
Application granted granted Critical
Publication of JPH0216856Y2 publication Critical patent/JPH0216856Y2/ja
Expired legal-status Critical Current

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  • Tunnel Furnaces (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案はプリント基板のはんだ付けに用いる装
置、特にクリームはんだを塗布したプリント基板
を加熱溶融するためのリフロー炉に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an apparatus used for soldering printed circuit boards, and particularly to a reflow oven for heating and melting printed circuit boards coated with cream solder.

〔従来の技術〕[Conventional technology]

クリームはんだを塗布したプリント基板のはん
だ付けは、上下にヒーターが設置されたトンネル
内を搬送装置が走行するリフロー炉で行つてい
る。
Soldering of printed circuit boards coated with cream solder is carried out in a reflow oven in which a transport device runs through a tunnel with heaters installed above and below.

従来のリフロー炉は搬送装置として無端のメツ
シユベルトが多く使用されてきていたが近時のよ
うにプリント基板の両面に電子部品を搭載した両
面実装基板には、メツシユベルトが電子部品に接
触するため電子部品が位置ずれしてしまつたり、
或いはメツシユベルトが均一加熱を妨げること等
から、最近ではプリント基板を搬送爪で搬送する
ようになつてきた。従来の搬送爪とは第5図に示
すように一対の無端チエーン3,3の相対向する
方向に金属製の太径部5と細径部6の二段になつ
た円柱状のピン4であり、細径部にプリント基板
Pを載置して搬送するようになつている。
Conventional reflow ovens have often used an endless mesh belt as a conveyance device, but in recent years, double-sided printed circuit boards with electronic components mounted on both sides of the printed circuit board have a mesh belt that comes into contact with the electronic components. may be misaligned,
Alternatively, because the mesh belt prevents uniform heating, recently printed circuit boards have been conveyed using conveyor claws. As shown in Fig. 5, the conventional conveying claw is a cylindrical pin 4 made of a pair of endless chains 3, 3, which are arranged in two stages with a large diameter part 5 and a small diameter part 6 made of metal in opposing directions. The printed circuit board P is placed on the narrow diameter portion and transported.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

搬送爪のプリント基板を載置する細径部は長け
れば長い程、プリント基板を安定した状態で載置
することができるが、近時のように電子部品の実
装密度を高めたプリント基板では、その端部まで
電子部品を搭載しており、この場合、細径部が電
子部品に接触してしまつてメツシユベルト同様、
搬送時に電子部品を動かしてしまうことになる。
また、搬送爪が電子部品に接触しないまでも電子
部品のはんだ付け部にあまり接近し過ぎている
と、この部分は熱が搬送爪に吸収されて、温度が
下がり、はんだ付け不良を起こすことにもなる。
この現象は搬送爪が金属製の場合、特に著しく現
れる。
The longer the narrow diameter part of the transport claw on which the printed circuit board is placed, the more stable the printed circuit board can be placed on it. Electronic parts are mounted up to the ends of the belt, and in this case, the narrow diameter part may come into contact with the electronic parts, causing the problem like a mesh belt.
Electronic components will be moved during transportation.
In addition, if the transport claws are too close to the soldering part of the electronic component, even if they do not come into contact with the electronic component, the heat of this part will be absorbed by the transport claw, causing the temperature to drop and causing soldering defects. It will also happen.
This phenomenon is particularly noticeable when the conveying claws are made of metal.

従つて、リフロー炉における搬送爪はできるだ
け短かい方が電子部品への接触や熱影響の点で好
ましいものであるが、あまり短か過ぎると今度は
搬送時の振動や載置時の位置ずれでプリント基板
を落下させてしまうことになる。それ故、搬送爪
はプリント基板に合わせて適宜選択できることが
好ましいものであるが、従来のリフロー炉におけ
る搬送爪は無端チエーンに固定されていたためそ
の取り換えに多大な手間を要していた。
Therefore, it is preferable for the transport claws in a reflow oven to be as short as possible in terms of contact with electronic components and thermal effects, but if they are too short, vibrations during transport and misalignment during placement may occur. This will cause the printed circuit board to fall. Therefore, it is preferable that the transport claws can be appropriately selected according to the printed circuit board, but since the transport claws in conventional reflow ovens are fixed to an endless chain, it takes a lot of effort to replace them.

さらに従来の搬送爪はプリント基板の安定性に
おいても問題があつた。従来の搬送爪は金属棒を
削り出して細径部を形成したものであるため強度
的な面で太径部と細径部の段差があまり付けられ
ない。搬送時は段差となる段部でプリント基板の
移動を押えるものであるが、搬送爪の段差が少な
いと細径部に載置されたプリント基板は搬送時の
振動で簡単に一方の無端チエーンに設置された搬
送爪の太径部に移動してしまい、もう一方の無端
チエーンに設置された搬送爪からはずれて落下し
てしまう。また、搬送爪の段差が少ないと搬送爪
にプリント基板を載置する時に太径部に乗りやす
く、やはり落下させてしまうことになる。
Furthermore, conventional conveying claws have had problems with the stability of printed circuit boards. Conventional conveyance claws are made by cutting out a metal rod to form a small diameter portion, so in terms of strength, there is not much difference in level between the large diameter portion and the small diameter portion. During transportation, the step part that is a step prevents the printed circuit board from moving. However, if the difference in the step of the transport claw is small, the printed circuit board placed on the narrow diameter part will easily move to one of the endless chains due to vibrations during transport. It moves to the large diameter part of the installed conveyance claw, and falls off the conveyance claw installed on the other endless chain. Further, if the height difference in the conveyance claw is small, when the printed circuit board is placed on the conveyance claw, it is easy to ride on the large diameter part, which results in the printed circuit board falling.

〔問題点を解決するための手段〕[Means for solving problems]

本考案はプリント基板の電子部品実装状態に合
つた搬送爪が容易に選択でき、しかも段差を大き
くしてプリント基板搬送時、載置時の安定性を更
に向上させるようにしたものである。
In the present invention, it is possible to easily select a conveying claw that matches the electronic component mounting state of the printed circuit board, and the step height is increased to further improve the stability during conveyance and placement of the printed circuit board.

本考案の特徴とするところは、上下にヒーター
が設置されたトンネル内を一対の無チエーンが回
動しており、該無端チエーンに設置された搬送爪
にプリント基板を載置してトンネル内へ搬送し、
プリント基板のはんだ付けを行うリフロー炉にお
いて、搬送爪は円柱の一端に鍔が設置され、鍔側
端部には円柱の中心位置に孔が穿設されていて、
該孔を無端チエーンに設置された円柱体に取付け
るリフロー炉にある。
The feature of this invention is that a pair of chainless chains rotate inside a tunnel with heaters installed above and below, and the printed circuit board is placed on the conveyor claws installed on the endless chain and transported into the tunnel. transport,
In a reflow oven for soldering printed circuit boards, the transport claw has a flange installed at one end of a cylinder, and a hole is bored at the center of the cylinder at the flange side end.
The hole is attached to a cylindrical body installed in an endless chain in a reflow oven.

〔作用〕[Effect]

着脱自在な搬送爪はプリント基板における電子
部品の実装状態に合わせて適宜選択ができ、また
搬送爪の鍔はプリント基板の安定した搬送を約束
するものである。
The removable transport claw can be selected as appropriate depending on the mounting state of electronic components on the printed circuit board, and the collar of the transport claw ensures stable transport of the printed circuit board.

また、着脱自在な搬送爪をテフロンのような耐
熱性樹脂やジルコニアのようなセラミツクで作成
すると温度分布の不均一がなくなる。
Furthermore, if the removable conveying claws are made of heat-resistant resin such as Teflon or ceramic such as zirconia, uneven temperature distribution will be eliminated.

〔実施例〕〔Example〕

リフロー炉1はトンネル式の加熱炉であつて、
トンネル2の上下にはヒーターが設置されてお
り、トンネル内には一対の無端チエーン3,3が
回動している。該無端チエーンには相対向する方
向に金属製のピン4が多数設置されている。第
2,4図に示すピンは太径部5の先端に細径部6
が形成されたものである。本考案リフロー炉では
該ピンに搬送爪を挿着するものであるが、本考案
に使用する搬送爪7は円柱8の一端に鍔9が形成
されており、鍔側の方には円柱8の中心位置に円
柱8と略同一の孔10が穿設されている。第2,
4図に示す実施例の搬送爪は、孔10をピン4の
細径部6と嵌合させることにより取付けが行われ
る。この時、嵌合が強固になつている場合はこの
ままでも良いが、この取付けを更に強固にするた
めには予め孔に熱硬化性接着剤を少量塗布してお
いてから嵌合を行う。第2,4図の実施例では第
5図に示すような従来のピン状搬送爪を用いこれ
に搬送爪7を嵌合してもよい。
The reflow furnace 1 is a tunnel type heating furnace,
Heaters are installed above and below the tunnel 2, and a pair of endless chains 3, 3 are rotating inside the tunnel. A large number of metal pins 4 are installed in the endless chain in opposing directions. The pin shown in FIGS. 2 and 4 has a small diameter portion 6 at the tip of a large diameter portion 5.
was formed. In the reflow oven of the present invention, a transfer claw is inserted into the pin, and the transfer claw 7 used in the present invention has a flange 9 formed at one end of the cylinder 8, and the flange 9 of the cylinder 8 is formed on the flange side. A hole 10 substantially the same as the cylinder 8 is bored at the center position. Second,
The conveyance claw of the embodiment shown in FIG. 4 is attached by fitting the hole 10 with the narrow diameter portion 6 of the pin 4. At this time, if the fitting is already strong, it may be left as is, but in order to make this attachment even stronger, apply a small amount of thermosetting adhesive to the hole beforehand before fitting. In the embodiments shown in FIGS. 2 and 4, a conventional pin-shaped conveying pawl as shown in FIG. 5 may be used and the conveying pawl 7 may be fitted therein.

第3図は他の実施例でピン4は太径部4の先端
の細径部6が牡ネジ11となつており、また搬送
爪7の孔10が牝ネジ12となつている。これら
の取付けは牡ネジ11と牝ネジ12を螺合するだ
けでよく、搬送爪の交換が更に容易となるもので
ある。
FIG. 3 shows another embodiment in which the pin 4 has a narrow diameter portion 6 at the tip of the large diameter portion 4 having a male thread 11, and a hole 10 in the conveying claw 7 having a female thread 12. These can be attached simply by screwing together the male screw 11 and the female screw 12, making it even easier to replace the conveyor claws.

本考案では第4図に示すように円柱8の部分に
プリント基板Pを載置して搬送するものである。
In the present invention, as shown in FIG. 4, a printed circuit board P is placed on a cylindrical column 8 and transported.

〔考案の効果〕[Effect of idea]

本考案リフロー炉は搬送爪が着脱可能となつて
おり、プリント基板に合わせて搬送爪を適宜選択
できるため、搭載電子部品への接触不具合やはん
だ付け部に対する熱影響等がないばかりか、プリ
ント基板の移動を押さえる段部が大きなフランジ
であることから、プリント基板搬送時の振動や載
置時の位置ずれによるプリント基板の落下も起こ
らないという従来にない優れた効果を有してい
る。
The reflow oven of the present invention has removable transport claws, and the transport claws can be selected appropriately according to the printed circuit board.This not only prevents contact problems with mounted electronic components and thermal effects on soldered parts, but also allows the printed circuit board to be easily removed. Since the stepped portion that suppresses the movement of the board is a large flange, the printed board does not fall due to vibration during transport or misalignment when placed, which is an excellent effect never seen before.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案リフロー炉の斜視図、第2図は
搬送爪の取付けを説明する要部拡大斜視図、第3
図は他の実施例における搬送爪の取付けを説明す
る要部拡大斜視図、第4図は本考案リフロー炉の
要部拡大正面図、第5図は従来のリフロー炉の要
部拡大正面図である。 1……リフロー炉、2……トンネル、3……無
端チエーン、4……ピン、5……太径部、6……
細径部、7……搬送爪、8……円柱、9……鍔、
10……孔、11……牡ネジ、12……牝ネジ。
Figure 1 is a perspective view of the reflow oven of the present invention, Figure 2 is an enlarged perspective view of the main parts explaining the installation of the conveyor claw, and Figure 3
The figure is an enlarged perspective view of the main part to explain the installation of the conveyance claw in another embodiment, FIG. 4 is an enlarged front view of the main part of the reflow oven of the present invention, and FIG. 5 is an enlarged front view of the main part of the conventional reflow oven. be. 1... Reflow oven, 2... Tunnel, 3... Endless chain, 4... Pin, 5... Large diameter part, 6...
Narrow diameter part, 7... Conveyance claw, 8... Cylinder, 9... Tsuba,
10...hole, 11...male screw, 12...female screw.

Claims (1)

【実用新案登録請求の範囲】 (1) 上下にヒーターが設置されたトンネル内を一
対の無端チエーンが回動しており、該無端チエ
ーンに設置された搬送爪にプリント基板を載置
してトンネル内へ搬送し、プリント基板のはん
だ付けを行うリフロー炉において、搬送爪は円
柱の一端に鍔が形成され、鍔側端部には円柱の
中心位置に孔が穿設されていて、該孔を無端チ
エーンに設置されたピンに取付けることを特徴
とするリフロー炉。 (2) 前記搬送爪の鍔側に穿設した孔と無端チエー
ンに設置したピンへの取付けは接着剤を用いて
行うことを特徴とする実用新案登録請求の範囲
第(1)項記載のリフロー炉。 (3) 前記搬送爪の鍔側に穿設した孔は牝ネジであ
り、無端チエーンに設置した円柱部は牡ネジで
あつて、これらの取付けは螺合によつて行うこ
とを特徴とする実用新案登録請求の範囲第(1)項
記載のリフロー炉。 (4) 前記搬送爪は耐熱性樹脂、セラミツク等の非
金属材料であることを特徴とする実用新案登録
請求の範囲第(1)項乃至第(3)項記載のリフロー
炉。
[Scope of Claim for Utility Model Registration] (1) A pair of endless chains rotates inside a tunnel in which heaters are installed above and below, and a printed circuit board is placed on the conveyor claws installed on the endless chains and moved through the tunnel. In a reflow oven for soldering printed circuit boards, the conveying claw has a flange formed at one end of the cylinder, and a hole is bored at the center of the cylinder at the flange side end. A reflow oven characterized by being attached to a pin installed in an endless chain. (2) Reflow reflow according to claim 1 of the utility model registration claim, characterized in that attachment to the hole drilled in the collar side of the conveying claw and the pin installed in the endless chain is performed using an adhesive. Furnace. (3) The hole drilled in the flange side of the conveying claw is a female thread, and the cylindrical part installed in the endless chain is a male thread, and these are attached by screwing. A reflow oven according to claim (1) of patent registration. (4) The reflow oven according to claims (1) to (3) of the utility model registration, wherein the conveying claws are made of a non-metallic material such as heat-resistant resin or ceramic.
JP14504786U 1986-09-24 1986-09-24 Expired JPH0216856Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14504786U JPH0216856Y2 (en) 1986-09-24 1986-09-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14504786U JPH0216856Y2 (en) 1986-09-24 1986-09-24

Publications (2)

Publication Number Publication Date
JPS6353360U JPS6353360U (en) 1988-04-09
JPH0216856Y2 true JPH0216856Y2 (en) 1990-05-10

Family

ID=31056222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14504786U Expired JPH0216856Y2 (en) 1986-09-24 1986-09-24

Country Status (1)

Country Link
JP (1) JPH0216856Y2 (en)

Also Published As

Publication number Publication date
JPS6353360U (en) 1988-04-09

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