JPH02167329A - Thermosetting resin composition, printed-circuit board using same resin composition and production thereof - Google Patents

Thermosetting resin composition, printed-circuit board using same resin composition and production thereof

Info

Publication number
JPH02167329A
JPH02167329A JP1252748A JP25274889A JPH02167329A JP H02167329 A JPH02167329 A JP H02167329A JP 1252748 A JP1252748 A JP 1252748A JP 25274889 A JP25274889 A JP 25274889A JP H02167329 A JPH02167329 A JP H02167329A
Authority
JP
Japan
Prior art keywords
resin composition
printed
circuit board
iso
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1252748A
Other versions
JPH0826116B2 (en
Inventor
Junichi Katagiri
Akira Nagai
Masahiro Ono
Masao Suzuki
Akio Takahashi
Original Assignee
Hitachi Chem Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP24697888 priority Critical
Priority to JP63-246978 priority
Application filed by Hitachi Chem Co Ltd, Hitachi Ltd filed Critical Hitachi Chem Co Ltd
Priority to JP1252748A priority patent/JPH0826116B2/en
Publication of JPH02167329A publication Critical patent/JPH02167329A/en
Publication of JPH0826116B2 publication Critical patent/JPH0826116B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Abstract

PURPOSE: To obtain a printed-circuit board having improved signal-transmitting speed by impregnating a thermosetting resin composition comprising respectively specific (iso)cyanate compound and poly(p-hydroxystyrene) derivative in a (non) woven fabric and laminating metallic foil.
CONSTITUTION: A (iso)cyanate compound expressed by formula I [R1 is aromatic, alicyclic or mixture of said compounds; A is (iso)cyanate] is mixed with a poly(p-hydroxystyrene) derivative expressed by formula II (R2 is 2-4C alkenyl or unsaturated carboxyl; B is H or residue of polymerization initiator, etc.; X is fluorine or bromine, etc.; m is 1-4; n is ≥5) in a weight ratio of 20:80-80:20 to obtain a thermosetting resin composition having low dielectric constant and fire retardance. Said composition is impregnated in (non)woven fabric and the resultant prepregs are laminated, then a metallic foil is laid on, thus heated and pressed to afford a printed-circuit board suitable for an electronic computer.
COPYRIGHT: (C)1990,JPO&Japio
JP1252748A 1988-09-30 1989-09-28 Thermosetting resin composition and a printed circuit board using the same Expired - Lifetime JPH0826116B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP24697888 1988-09-30
JP63-246978 1988-09-30
JP1252748A JPH0826116B2 (en) 1988-09-30 1989-09-28 Thermosetting resin composition and a printed circuit board using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1252748A JPH0826116B2 (en) 1988-09-30 1989-09-28 Thermosetting resin composition and a printed circuit board using the same

Publications (2)

Publication Number Publication Date
JPH02167329A true JPH02167329A (en) 1990-06-27
JPH0826116B2 JPH0826116B2 (en) 1996-03-13

Family

ID=26538004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1252748A Expired - Lifetime JPH0826116B2 (en) 1988-09-30 1989-09-28 Thermosetting resin composition and a printed circuit board using the same

Country Status (1)

Country Link
JP (1) JPH0826116B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006001305A1 (en) * 2004-06-23 2008-04-17 日立化成工業株式会社 Prepreg for printed wiring board, metal foil-clad laminate, printed wiring board, and method for producing multilayer printed wiring board
US8492898B2 (en) 2007-02-19 2013-07-23 Semblant Global Limited Printed circuit boards
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006001305A1 (en) * 2004-06-23 2008-04-17 日立化成工業株式会社 Prepreg for printed wiring board, metal foil-clad laminate, printed wiring board, and method for producing multilayer printed wiring board
US8492898B2 (en) 2007-02-19 2013-07-23 Semblant Global Limited Printed circuit boards
US9648720B2 (en) 2007-02-19 2017-05-09 Semblant Global Limited Method for manufacturing printed circuit boards
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method

Also Published As

Publication number Publication date
JPH0826116B2 (en) 1996-03-13

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