JPH02167329A - Thermosetting resin composition, printed-circuit board using same resin composition and production thereof - Google Patents

Abstract

PURPOSE:To obtain a printed-circuit board having improved signal-transmitting speed by impregnating a thermosetting resin composition comprising respectively specific (iso)cyanate compound and poly(p-hydroxystyrene) derivative in a (non) woven fabric and laminating metallic foil. CONSTITUTION:A (iso)cyanate compound expressed by formula I [R1 is aromatic, alicyclic or mixture of said compounds; A is (iso)cyanate] is mixed with a poly(p-hydroxystyrene) derivative expressed by formula II (R2 is 2-4C alkenyl or unsaturated carboxyl; B is H or residue of polymerization initiator, etc.; X is fluorine or bromine, etc.; m is 1-4; n is >=5) in a weight ratio of 20:80-80:20 to obtain a thermosetting resin composition having low dielectric constant and fire retardance. Said composition is impregnated in (non)woven fabric and the resultant prepregs are laminated, then a metallic foil is laid on, thus heated and pressed to afford a printed-circuit board suitable for an electronic computer.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a thermosetting resin composition and its uses, and particularly to a thermosetting resin composition for printed circuit boards with excellent flame retardancy and its use. The present invention relates to a printed circuit board using the composition.

[Prior Art] Conventionally, resin materials for multicircuit printed circuit boards used in electronic computers, etc., include phenol resin, epoxy resin,
Polyimide resins and the like have been used. However, recent large-scale electronic computers require high-speed calculation performance, and the multilayer printed circuit boards used are also required to have strict characteristics, so new multilayer printed circuit board materials are being developed.

In general, the calculation speed of an electronic computer is greatly affected by the signal transmission speed of the multilayer printed nameplate circuit used therein.

The progress of signal transmission in such a circuit depends on the dielectric constant of the insulating layer, and the lower the dielectric constant, the faster the signal transmission progress. Therefore, by forming the printed circuit board with a low dielectric constant material, the calculation speed of the computer can be improved.

Polytetrafluoroethylene (
PTFE), polybutadiene, etc.

In addition to the above, low dielectric constant materials include cyanate compounds with aromatic, cycloaliphatic, or a combination of these in the main chain (U.S. Patent No. 4,555).
9,399S';) and isothiaphor 1-compound (US Times No. 4,353,769).

[Problems to be Solved by the Invention] However, since PTFE is a thermopolymer resin, when used in a multilayer printed circuit board, there is a problem that PTFE has poor dimensional stability and through-hole reliability. In addition, since there is no suitable solvent, the lamination bonding has had to rely on a hot-melt pressure bonding method. Moreover, the melting temperature is high (250-350℃)
Therefore, there were many problems such as poor workability and difficulty in handling compared to conventional epoxy resin cylinders.

In addition, polybutadiene has a double bond in its side chain 1
．． A resin material that combines 2-polybutadiene and a crosslinked flame retardant made of a difunctional monomer has been developed (Jikai 11).
1”755-1264751 Bow・).

However, if a low-molecular-weight polymer is used in consideration of its impregnability into fibrous base materials, the resulting prepreg has high adhesiveness, making it difficult to cut and store the prepreg), and workability during lamination and attachment. It also affects.

On the other hand, when made into prepreg, products using polymers that have low tackiness (tack-free properties) have a high viscosity of varnish, resulting in fiber quality (poor impregnation into the material, which makes it difficult to prepare prepregs). Therefore, it is difficult to produce high-quality printed circuit boards9;). Furthermore, since the curing reaction is a crosslinking reaction by radical polymerization, the reaction rate is fast and cannot be easily controlled.

Further, polybutadiene has the following problems: it is prone to cracking during molding due to its large shrinkage upon curing, has low mechanical strength and heat resistance, and has low adhesion to the copper foil forming the circuit.

The cyanate compound and isocyanate compound described above can be trimerized in the presence of a catalyst to obtain a cured product with a high crosslink density. In addition, although the cured product has a low dielectric constant and is excellent in dimensional stability and heat resistance, it has the disadvantage that it does not have flame retardancy (flammability), which is an important property for printed circuit boards. be.

One aspect of the present invention is a thermosetting resin composition that provides a flame-retardant cured product with a low dielectric constant, and a printed circuit board using the same.
and its manufacturing method.

[Means for Solving the Problems] The gist of the present invention for solving the above problems is as follows.

(I) General formula (I) % Formula % (I) (wherein R□ is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A is a cyanate group or incyanate group) A cyanate compound or an isocyanate compound represented by (indicates a group).

General formula (■) (wherein, X represents fluorine, bromine, or chlorine, R2 represents an alkenyl group having 2 to 4 carbon atoms or an unsaturated carboxyl group, and B represents a polymerization initiator residue.

Polymerization stop cutting allowance J! ,)I,. , , Q:4M7:”-, which may be the same or different from each other. m is 1
~4. 1. A thermosetting resin composition comprising a poly(p-hydroxystyrene) diquintetramer represented by the formula (n is 5 or more).

(2) The thermosetting resin according to the above item (I), wherein the compounding ratio of the compounds represented by the general formula (I) and the general formula (II) is 20:80 to 8o:20 by weight. Composition.

(3) Adding the thermosetting resin composition described in the preceding paragraph (I) or (2) to a woven fabric or nonwoven fabric of organic fibers or inorganic fibers.
A curable material characterized by being impregnated with 70% by weight.

(4) A printed circuit board having a conductor made of metal foil and an insulating scrap made by impregnating and curing a thermosetting resin composition into a fibrous base material, wherein the thermosetting resin composition has the general formula (I)%. Cyanate represented by the formula %(I) (wherein R□ is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or incyanate group) compound or isocyanate compound, and the general formula (II) (wherein, Good. m is 1 to 4. n is 5 or more)
A poly(p-hydroxystyrene) derivative represented by
A printed circuit board characterized in that it is a thermosetting resin composition containing a compound having l or more N[d-substituted unsaturated imide groups.

(5) In a printed circuit board having a conductor cut from metal foil and an insulation/fl made by impregnating and curing a fibrous material with a thermosetting resin composition, the thermosetting resin composition has the general formula (I) % Formula % (I) (wherein R4 is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or an incyanate group. ) and a cyanate compound or incyanate compound represented by general formula (II) (wherein, X represents fluorine, bromine, or chlorine, R3 is an alkenyl group having 2 to 4 carbon atoms or an unsaturated carboxyl group, , B is a polymerization initiator residue.

Polymerization terminator residue, 1■. , , D2enZH-, which may be the same or different from each other, m is 1 to 4,
A printed circuit board characterized in that it is a thermosetting resin composition containing a poly(p-hydroxystyrene) derivative represented by n=5 or more) and a compound having one or more Nfi-converted unsaturated imide groups.

(6) - Formula (I) % Formula % () (wherein R1 is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or an isocyanate group , ) and a cyanate compound or isocyanate-1 compound represented by the general formula (II) (wherein, X represents fluorine, bromine, or chlorine; and a poly(p-hydroxystyrene) derivative represented by m is 1 to 4 and n is 5 or more) which may be the same or different from each other. Dissolve the prepolymer in a solvent and impregnate it into the fibrous base material.
A method for manufacturing a printed circuit board, comprising the steps of drying to create a prepreg, laminating a plurality of the prepregs, pressurizing them with a conductor metal foil, and heating them.

(7) - Formula (I) %Formula% (wherein R4 is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or an isocyanate group.) A cyanate compound or an isocyanate compound represented by the general formula (■) (wherein, A thermosetting resin composition containing a poly(p-hydroxystyrene) derivative represented by the formula 1m is 1 to 4 and n is 5 or more and a compound having one or more N-substituted unsaturated imide groups is heated. A step of dissolving the prepolymer in a solvent, impregnating it into an #at base material, and drying it to create a prepreg. A step of laminating a plurality of sheets of the prepreg, and further forming a conductor gold Xi! ? A method for manufacturing a printed circuit board, which includes the steps of bonding by applying pressure and heating.

The present invention provides a compound containing at least one cyanate or isocyanate represented by the formula -
The inventors have discovered that by blending a crosslinked flame retardant represented by Tl), a resin composition with excellent flame retardancy can be obtained without impairing the dielectric constant, leading to the present invention.

In the present invention, the compound represented by formula (I) includes bisphenol-A-dicyanate (4,4'-dicyanate diphenylpropane), bisphenol-A-dicyanate (4,4'-dicyanate diphenylpropane),
-diisocyanate (4,4'-diisocyanate diphenylpropane), tetramethylxylene diisocyanate, tetramethylxylene diisocyanate, diphenylmethane dicyanate, diphenylmethane diisocyanate, R1 is 4,4'-dihydroxydiphenyl oxide, resorcinol, 4°4' -thiodiphenol 3.3
',5.5'tetrabromobisphenol-A-2,2
'6.6'-tel-labromobisphenol-A, 3-
Phenylbisphenol-A, 4.4'dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 2.2
', 4.4'-tetrahydroxybiphenylmethane, 2
．． 2',6゜6'-tetramethyl-3,3',5.5'
-Te1-Labromobisphenol-A, 5,5'-dimethoxybisphenol-A, bisphenol-A of dicyclopentadiene, cyanate and isocyanate of bisphenol of tricyclopentadiene, polyisocyanate of phenol-formaldehyde condensation product, polyisocyanate of phenol-formaldehyde condensate, There are polycyanates and polyisocyanates of condensates of cyclopentadiene, polycyanates and polyisocyanates of 2.2', 4.4'-tetrahydroxydiphenylmethane, and polyisocyanates 1-'5, which are -
Can be used for more than m.

In addition, as a compound represented by the general formula (n), poly(p
-vinyl bromophenyl allyl ether), poly(p-
(vinyl bromophenyl isopropenyl ether), poly(p-vinyl bromophenyl 1, l'-dimethylbutenyl ether), poly(p-vinyl bromophenyl allyl ester), and the like.

Here, n of compound (II) is 5 or more, and this value is determined by the tRs, molecular weight, and (I) and (I) of compound (I) used together.
Although it depends on the composition ratio of T), it is preferably between 5 and 100.

If n is too large, the viscosity of the resin will be high and impregnation into the base material will be poor, leading to the generation of voids during adhesion of debris. On the other hand, if it is less than 5, the retention stability as a compound is poor).Resin flow: FJJ properties are too good, and the resin flows away during piling and adhesion.

The compounding ratio of the above compounds (I) and (II) is 2 by weight.
The range may be from 0:80 to 80:20. If the former compounding ratio is large, the flame retardance will be insufficient, and if the latter compounding ratio is large, the characteristics as a low dielectric constant material will not be fully exhibited.

Next, a method for manufacturing a laminate according to the present invention will be explained.

First, a varnish is prepared by dissolving a mixture of the compounds of general formulas (I) and (II) in a predetermined blending ratio in an organic solvent. At this time, heating may be applied to promote dissolution.

A resin composition consisting of the above compounds (I) and (II),
As a crosslinking aid, a compound containing one or more N-substituted unsaturated imides can be blended.

The above-mentioned compounds having an N-converted unsaturated imide group include, for example, 0-1m-11)-phenylmaleimide, phenylcitraconimide, phenylitaconimide, phenylnasic imide, phenylmethylendomethylenetetrahydrophthalimide, N.

N'-P-phenylene bismaleimide, N, N'-P-
Phenylenebismethylendomethylenetetrahydrophthalimide, N,N'-P-phenylenebiscitraconimide, N,N'-P-phenylenebisitaconimide,
N, N'-m-xylene bismaleimide, N, N'-m
-Phenylene bismaleimide, N,N'-(methylene di-P-phenylene)bismaleimide, N,N'-4,4
'-Diphenylthioether bismaleimito, N.

N'-4,4'-didiphenyl ether bismaleimide, N,N'-methylenebis(3-chloro-phenylene)
maleimide, N, N'-(sulfonyldi)-phenylene)bismaleimide, N.

N'-4,4'-diphenylcyclohexane bismaleimide, 2,2-bis(4-(/1-maleimidophenoxy)phenyl)propane, 2,2-bis(4-(4-maleimidophenoxy)phenyl)-1 ,1,1,3,3
, 3-hexafluoropropane, 2,2-bis(4-(
4-maleimido-2-trifluoromethylphenoxy)
phenyl]-1,1,1,3,3.3-hexafluoropropane bismaleimide is also obtained by the following formula (I[I) obtained by reacting a condensate of aniline and aldehyde with maleic anhydride. Examples of the polyvalent maleimide organic solvent (where p is an integer of 1 to 10) include toluene, xylene, methyl ethyl ketone, and methyl isobutyl ketone.

methanol, ethanol, 3-methoxypropertool,
Examples include N,N-dimethylformamide, N-methylpyrrolidone, dimethylsulfoxide, and trichloroethylene, but any material that can uniformly mix and dissolve the above compounds may be used.

Appropriate amounts of a cyanate group and isocyanate trimerization reaction catalyst and a radical polymerization initiator are added to the prepared varnish to obtain a varnish for impregnation.

The trimerization catalysts include cobalt naphthenate, cobalt octenoate, zinc octenoate, potassium acetate, sodium acetate, sodium cyanide, sodium cyanate,
Isocyanic acid, metal salts such as sodium boronate, salts such as sodium methoxide, sodium hydroxide, pyridine, etc.
Examples include tertiary amines such as triethylamine, Lewis acids such as aluminum chloride, bromine trifluoride, ferric chloride, titanium chloride, and zinc chloride.

In addition, as a radical polymerization initiator, benzoyl peroxide, dicumyl peroxide, methyl ethyl ketone peroxide, t-butyl peroxide dilaurate, di-butyl peroxy phthalate, dibenzyl peroxide, 2,5-dimethyl-2, There are 5-di(t-butylperoxy)hexyne-3 and the like, and these are used in an amount of 0.1 to 10 parts by weight per 100 parts by weight of the resin composition.

Next, a fibrous base material is impregnated or coated with the impregnating varnish obtained above and dried at room temperature to 170°C to obtain a non-tacky prepreg. The drying temperature at this time is determined by the solvent and radical polymerization initiator used.

Next, a predetermined number of sheets of the obtained prepreg were stacked to form 100 sheets.
~250℃, preferably 120~250℃~10
A laminate is obtained by heating and curing under a pressure of 0 kgf/cm2.

As the above-mentioned fibrous base material, those that are generally used as adhesive materials can be used.

"Inorganic fibrous material" (Material: 5in2, Ag2O
, etc., C glass, C glass, A glass, S
Glass, D glass, YM-31-A glass, and Q glass fiberglass woven or nonwoven fabrics using quartz are available. Further, as the organic fiber, there is a woven fabric or non-woven fabric of aramid fiber whose main component is a polymer compound having an aromatic polyamide-imide skeleton.

Furthermore, depending on the purpose and use, an inorganic filler such as silica or an organic filler such as purple oleoethylene powder or polyamide powder may be added to the composition of the present invention. In particular, it is important to select the filler having a dielectric constant of 3.3 or less in order to achieve the object of the present invention.

[Function] The reason why the thermosetting resin composition of the present invention has a low dielectric constant and is flame retardant is that the cyanate and isocyanate compound represented by the general formula (I) have a low dielectric constant. However, the polymeric cross-linked flame retardant represented by the general formula (II) is a material with an unexpectedly low dielectric constant, and even when copolymerized with the cyanate or isocyanate compound, it has a flame retardant property of 51 ( i, and the electrical properties are not impaired.

[Example] Next, the present invention will be explained by examples.

[Example 1] As a cyanate compound represented by general formula (I), XU
-71787 (manufactured by Dow Chemical Company) and as a flame retardant,
Poly(p-vinylbromophenyl methacrylate) represented by general formula (II) (average molecular weight: 6600.Formula (
In II), m is about 1°5 and n is about 20) are mixed at a weight ratio of 1:l, and heated and dissolved at 60°C for 30 minutes using N,N-dimethylformamide as a solvent to reduce the solid content. 5
A 0% by weight varnish was manufactured by yA.

After cooling the varnish, use it as a radical polymerization initiator.

2.5-di(t-butylperoxy)hexyne-3 (manufactured by Kuchimoto Bokusai Co., Ltd.) at 0.5 parts by weight per 100 parts by weight of varnish solid content.
Furthermore, 1 part by weight of cobalt naphthenate was added as a cyanate trimerization catalyst per 100 parts by weight of the XU-71787.

Apply this varnish to glass cloth (Nitto Suke layer E glass).

50 μm thick) and coated at 150°C in the atmosphere.

It was dried for 10 minutes to obtain a prepreg. 2 of the prepreg
A laminate was obtained by heating and curing 0 fR layers at 30 kgf/cm'' at 130°C for 40 minutes, at 170°C for 1 hour, and at 200°C for 1 hour.

Further, the varnish is thinly applied onto a polyethylene terephthalate film and dried at 150° C. for 10 minutes. The powdered resin composition thus obtained was placed in a 150 mm x 100 mm
It was press-molded to a size of x2 mmt and cured under the same conditions as the prepreg to obtain a resin plate.

[Example 2] A laminate and a resin board were produced in the same manner as in Example 1, except that 2,2-bis(4,4'-dicyanatophenyl)propane was used as the cyanate compound.

[Example 3] Ditrifluorobis(4,4'
Example 1 except that -dicyanatophenyl)methane was used.
A jet board and a resin board were prepared in the same manner as above.

[Example 4] The same procedure as in Example was carried out except that 2,2-bis(4,4'-dicyanatophenyl)propane was used as the cyanate compound and poly(p-vinyl bromophenyl acrylate) was used as the flame retardant. Laminated plates and resin plates were created.

[Example 5] 2,2-bis(4,4'-dicyanatophenyl)propane as a cyanate compound, poly(p-vinyl bromophenyl acrylate) as a flame retardant (average molecular weight: 6)
600. m is about 2. n is about 20), and aromatic bismaleimide 2,2-(4-(4-maleimidophenoxy)phenyl)propane in a weight ratio of 4:4, respectively.
:2 was dissolved in N,N-dimethylformamide, and a laminate and a resin board were produced in the same manner as in Example 1 except for the following.

[Example 6] 2,2-bis(4゜4'-
A vL plywood board and a resin board were prepared in the same manner as in Example 1, except that diisocyanatophenyl)propane was used.

[Example 7] Poly(p-vinyl bromophenyl acrylate) as a flame retardant (average molecular weight: 3300.m is about 2, n is about 1)
A laminate plate and a resin plate were produced in the same manner as in Example 1, except that Example 1 was used.

[Example 8] The same procedure as in Example 1 was carried out, except that poly(p-vinyl bromophenyl allyl ether) (average molecular weight: 8800.m was about 1.8.n was about 30) as the flame retardant. Product Jf
A l plate and a resin plate were created.

[Example 9] 2,2-bis(4゜4'-
diisocyanatophenyl) propane and poly(p-vinyl bromophenyl acrylate) (average molecular weight: 6600.m is approximately 2.n is approximately 20) as a flame retardant.
A laminate board and a resin board were created in the same manner as in Example 1.

[Example 10] A laminate and a resin board were produced in the same manner as in Example 1, except that dicyclopentanedicyanate was used as the cyanate compound.

[Example 11] A laminate and a resin board were produced in the same manner as in Example 1, except that tricyclopentanedicyanate was used as the cyanate compound.

[Example 12] Xu-71787 was used as a cyanate compound, and poly(p-vinyl bromophenyl methafrylate) was used as a flame retardant (average molecular weight: 27000.m was about 4.n was about 90
) was used in a weight ratio of 7:3, but in the same manner as in Example 1 to produce a laminate and a resin board.

[Comparative Example 1] To cyanate compound XU-71787 (73,100 parts by weight, 1 part by weight of cobalt naphthenate was added and dissolved in N,N-methylformamide to prepare a varnish. Using the varnish, the same procedure as in Example 1 was carried out. Laminated plates and resin plates were created.

[Comparative Example 2] A laminate was obtained in the same manner as in Example 1 using polyimide material MCL-I67 (Hitachi Chemical MB).

[Comparative example, 3] Epoxy modified polybutadiene EP-50 (manufactured by Nippon Soda)
and flame retardant crosslinking agent poly(p-vinyl bromophenyl methacrylate) [average molecular i: 6600° m in formula (n) is about 1.5. n is approximately 20), and the weight ratio is 20:
Mix at 80°C and heat dissolve at 60°C for 30 minutes using N,N-dimethylformamide as a solvent to reduce the solid content to 50°C.
% by weight of varnish was prepared.

To the varnish, 2 parts by weight of 2,5-di(t-butylperoxy)hexyne-3 (Nippon Juzo M) was added to 100 parts by weight of the solid content of the varnish, and dicyandiamide (manufactured by Wako Pure Chemical Industries, Ltd.) was added as an epoxy curing agent. 2 parts by weight were added. Using the varnish thus obtained, a resin plate and a laminate were obtained in the same manner as in Example 1.

[Comparative Example 4] XU-71787 was used as the cyanate compound, and brominated epoxy resin Araldite 8011 (
(manufactured by Ciba Geigi) at a weight ratio of 1:1, 50% by weight.
A methyl isobutyl ketone solution was prepared. After adding 1 part by weight of cobalt naphthenate and dicyandiamide to the solution based on the solid content of the varnish, a resin plate and a laminate were obtained in the same manner as in Example 1.

[Method for measuring properties of resin plates and laminates] ■ Specific dielectric constant I 5-C-6481 The relative dielectric constant at I z was measured using LP Impedance Analyzer 4192A (manufactured by Hewlett Paracard). .

■ Using bending strength autograph DDS-5000 (manufactured by Shimadzu Corporation), a sample of width 50 mm x length 45 mm x thickness 2 mm was measured at room temperature and 180°C with a distance between fulcrums of 30 mm.
, was measured at a deflection rate of 2 mm/min.

■ Thermal decomposition start temperature The powder sample Long is measured using a high-speed differential thermal balance TGD-700.
10 in the atmosphere using 0I-IR (Japan Vacuum Riko type)
Thermal loss was measured by increasing the temperature at a rate of °C/min, and was determined from the temperature at which the weight loss started.

(2) Moisture absorption rate According to JIS-C-6481, moisture was absorbed at 65° C. and 95% RH, and the moisture absorption rate (%) was determined from the saturated moisture absorption amount.

■ Using a sample with a thermal expansion coefficient of 6 mm x 6 mm, the thermal physical test equipment v1TM
A-150o (manufactured by Nippon Guzenriko Co., Ltd.) was used to raise the temperature at a rate of 2°C/min, and the temperature was determined from a thermal expansion curve in the range of 50 to 220°C.

■ Flame retardant Evaluation was made by the direct method according to the UL-94 standard.

■ Cut out a sample of a specified size from a beer-strength copper-clad laminate and pass the JIS-
41 was determined according to C-6481.

Table 1 shows the properties of the laminates produced in Examples 1 to 12 and Comparative Examples 1 to 4. Similarly, the properties of the resin plate are shown in Table 2.

Table 1 Table 2 [Example 13] As a cyanate compound represented by general formula (I), XU
-71787 (manufactured by Dow Chemical) and as a flame retardant, -
Poly(p-vinyl bromophenyl methacrylate-1~) represented by formula (■) [average molecular weight: 6600. Expression (■
), m is approximately 1.5°, n is approximately 20], and the weight ratio is 1
= 1, heated to 60°C for 30 minutes using N,N-dimethylformamide as a solvent, and dissolved to a solid content of 50.
% varnish by weight! 15I was manufactured.

After cooling the varnish, 2.5-
Di(L-butylperoxy)hexyne-3 (NOF f
M) was added in an amount of 0.5 part by weight per 9,100 parts by weight of the varnish, and 1 part by weight of cobalt naphthenate as a cyanate trimerization catalyst was added per 10,000 parts by weight of the XU-71787.

Apply the varnish to glass cloth (Nitto Sukelayer E glass: thickness 50
μm) and dried in the air at 150° C. for 10 minutes to prepare a prepreg sheet.

Next, 50 μm thick copper foil (TSTO copper foil, manufactured by Furukawa Circuit Co., Ltd.) was placed on both sides of the prepreg sheet, and heated in a press under the same conditions as in the previous example.

Pressure was applied to obtain a double-sided copper-clad laminate.

Figure 1 shows the manufacturing process.

An inner circuit was formed by baking etching resist, etching, and drilling holes on the top and bottom of this copper-clad laminate.

Figure 2 shows this inner circuit, the interior F11 path formation 1 of the indigo board.
)? A schematic diagram of a cross section after i is shown.

Next, the 11 boards on which these circuits were formed and the prepreg sheet 1 were interposed between them, and pressurized in a press.
Heating was performed and the multicircuit circuit plate was <:+>.

The obtained multilayer circuit J, (circuit formed on the outermost R'J on the board,
In addition, the formation of throughholes is carried out. 'l got a printed circuit board.

Figure 3 shows the manufacturing process diagram of this multi-R4 circuit printed board,
A cross-sectional perspective view of the obtained multilayer circuit printed board is shown.

[Effects of the Invention] The thermosetting resin composition of the present invention has a small relative dielectric constant of 3.5 or less and is flame retardant, making it excellent as an insulating material for electronic devices. .

Furthermore, the printed circuit board formed using the thermosetting resin composition of the present invention has a relative dielectric constant of 3.5 or less, and has a dielectric constant of 3.5 or less, which is higher than that of the printed circuit board formed using polyimide, which is a conventional flame-retardant resin material. It is much smaller than .7. Therefore, it has the effect of significantly increasing signal transmission speed, and is also excellent for use in printed circuit boards of electronic computers and the like.

[Brief explanation of the drawing]

Figure 1 is a manufacturing process diagram for double-sided copper-clad laminates, Figure 2 is a multi-Jf
FIG. 3 is a schematic cross-sectional view of each inner circuit board of the one-circuit printed board before and after the internal circuit is formed, and FIG. 3 is a manufacturing process diagram of the multilayer circuit printed board and a cross-sectional perspective view of the obtained multilayer circuit printed board. 1... Uncured resin, 2... Glass cloth, 3...
Prepreg, 4... Copper foil, 5... Hot plate, 6... Copper clad laminate, 7... Cured resin, 8... Inner layer circuit board,
9...Multilayer printed circuit board, 10...Printed circuit, 11...Inner layer circuit, 12...Through hole. Chapter ■ Qin? Lower...

Claims (7)

[Claims] 1. General formula (I) A-R_1-A(I) (wherein R_1 is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or an isocyanate group. cyanate compound or isocyanate compound represented by general formula (II) ▲Mathematical formula, chemical formula, table, etc.▼ (In the formula, group or unsaturated carboxyl group, and B is either a polymerization initiator residue, ▲ there are mathematical formulas, chemical formulas, tables, etc. ▼ polymerization terminator residues, H, ▲ there are mathematical formulas, chemical formulas, tables, etc. ▼ and may be the same or different from each other. m is 1 to 4, n
is 5 or more) poly(p-hydroxystyrene)
A thermosetting resin composition comprising a derivative. 2. The thermosetting resin composition according to claim 1, wherein the compounding ratio of the compound represented by the general formula (I) and the general formula (II) is 20:80 to 80:20 by weight. . 3. 40 to 40% of the thermosetting resin composition according to claim 1 or 2 is applied to a woven fabric or nonwoven fabric of organic fibers or inorganic fibers.
A curable material characterized by being impregnated with 70% by weight. 4. A printed circuit board having a conductor made of metal foil and an insulating layer made by impregnating and curing a thermosetting resin composition into a fibrous base material, wherein the thermosetting resin composition has the general formula (I) A-R_1- A cyanate compound or isocyanate represented by A(I) (wherein R_1 is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or an isocyanate group) Compounds and general formula (II) ▲Mathematical formulas, chemical formulas, tables, etc.▼ (In the formula, In addition, B is a polymerization initiator residue, a polymerization terminator residue, H,
▲There are mathematical formulas, chemical formulas, tables, etc.▼, and they can be the same or different. m is 1 to 4, n
is 5 or more) poly(p-hydroxystyrene)
A printed circuit board characterized in that it is a thermosetting resin composition containing a derivative and a compound having one or more N-substituted unsaturated imide groups. 5. A printed circuit board having a conductor made of metal foil and an insulating layer made by impregnating and curing a thermosetting resin composition into a fibrous base material, wherein the thermosetting resin composition has the general formula (I) A-R_1- A cyanate compound represented by A(I) (wherein R_1 is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or an isocyanate group) or Isocyanate compounds and general formula (II) ▲Mathematical formulas, chemical formulas, tables, etc.▼ (In the formula, , B is a polymerization initiator residue, a polymerization terminator residue, H
, ▲Mathematical formulas, chemical formulas, tables, etc.▼, and may be the same or different from each other. m is 1-4, n is 5
A printed circuit board characterized in that it is a thermosetting resin composition containing a poly(p-hydroxystyrene) derivative represented by the above) and a compound having one or more N-substituted unsaturated imide groups. 6. General formula (I) A-R_1-A(I) (wherein R_1 is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or an isocyanate group. cyanate compound or isocyanate compound represented by general formula (II) ▲Mathematical formula, chemical formula, table, etc.▼ (In the formula, group or unsaturated carboxyl group, and B is a polymerization initiator residue, a polymerization terminator residue, H
, ▲Mathematical formulas, chemical formulas, tables, etc.▼, and may be the same or different from each other. m is 1 to 4, n
is 5 or more) poly(p-hydroxystyrene)
A step of heating a thermosetting resin composition containing a derivative to create a prepolymer, a step of dissolving the prepolymer in a solvent, impregnating it into a fibrous base material, and drying it to create a prepreg, laminating a plurality of sheets of the prepreg. , a method for manufacturing a printed circuit board, including a process of applying a pressure and heating to a metal foil for a conductor. 7. General formula (I) A-R_1-A(I) (wherein R_1 is selected from the group consisting of aromatic, cycloaliphatic and hybrids thereof, and A represents a cyanate group or an isocyanate group. cyanate compound or isocyanate compound represented by general formula (II) ▲Mathematical formula, chemical formula, table, etc.▼ (In the formula, group or unsaturated carboxyl group, and B is a polymerization initiator residue, a polymerization terminator residue, H
, ▲Mathematical formulas, chemical formulas, tables, etc.▼, and may be the same or different from each other. m is 1 to 4, n
is 5 or more) poly(p-hydroxystyrene)
A step of heating a thermosetting resin composition containing a derivative and a compound having one or more N-substituted unsaturated imide groups to create a prepolymer, dissolving the prepolymer in a solvent, impregnating it into a fibrous base material, and drying it. A method for producing a printed circuit board, comprising the steps of: creating a prepreg by using the prepreg; laminating a plurality of sheets of the prepreg, and bonding the prepreg to a metal foil for a conductor by applying pressure and heating.