JPH02165945A - Manufacture of heat resistant thermoplastic fiber cloth base material laminated plate - Google Patents
Manufacture of heat resistant thermoplastic fiber cloth base material laminated plateInfo
- Publication number
- JPH02165945A JPH02165945A JP32243788A JP32243788A JPH02165945A JP H02165945 A JPH02165945 A JP H02165945A JP 32243788 A JP32243788 A JP 32243788A JP 32243788 A JP32243788 A JP 32243788A JP H02165945 A JPH02165945 A JP H02165945A
- Authority
- JP
- Japan
- Prior art keywords
- resistant thermoplastic
- heat
- thermoplastic fiber
- resin
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 58
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 33
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 title claims abstract description 18
- 239000004744 fabric Substances 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 238000002844 melting Methods 0.000 claims abstract description 16
- 230000008018 melting Effects 0.000 claims abstract description 16
- 230000009477 glass transition Effects 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 12
- 239000004697 Polyetherimide Substances 0.000 claims abstract description 10
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004696 Poly ether ether ketone Substances 0.000 claims abstract description 8
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 8
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 8
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 7
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 5
- -1 aromatic maleimide compound Chemical class 0.000 claims abstract description 5
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 5
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 238000005553 drilling Methods 0.000 abstract description 2
- 238000009941 weaving Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 3
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、誘電率が低く、しかも耐熱性に優れたプリン
ト配線板用の積層板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a laminate for printed wiring boards that has a low dielectric constant and excellent heat resistance.
（従来の技術）
従来、プリント配線板用の積Ｎ板には、Ｅガラス、Ｄガ
ラス、クォーツガラス、芳香族ポリアミド等の繊維を布
状に製織した基材に熱硬化性樹脂を含浸させたプリプレ
グが用いられていた。(Prior art) Conventionally, laminated boards for printed wiring boards are made by impregnating a thermosetting resin into a base material made of cloth-like fibers such as E glass, D glass, quartz glass, and aromatic polyamide. Prepreg was used.
しかし、近年、高速演算処理化に伴い信号伝送速度の向
上のため、低誘電率の積層板が要求されている、Ｅガラ
スやＤガラスに比べ、クォーツガラス、芳香族ポリアミ
ド繊維は誘電率が約３．７と低く、低誘電率の積層板と
して検討されている。However, in recent years, quartz glass and aromatic polyamide fibers have a dielectric constant of about 100% compared to E glass and D glass, which require laminates with a low dielectric constant to improve signal transmission speeds due to high-speed calculation processing. It has a low dielectric constant of 3.7, and is being considered as a laminate with a low dielectric constant.
（発明が解決しようとする課題）
しかしながら、クォーツガラスを用いた積層板はドリル
加工性に問題があり、ドリル刃が著しく磨耗するという
欠点があった。又、芳香族ポリアミド繊維を用いた積層
板は、はんだ耐熱性の試験において、基材と樹脂の熱膨
張差が大きいため、マイクロクランクが生ずるという問
題点があった。(Problems to be Solved by the Invention) However, the laminated plate using quartz glass has a problem in drill workability, and has the disadvantage that the drill blade is considerably worn. Furthermore, laminates using aromatic polyamide fibers have a problem in that microcranks occur during soldering heat resistance tests due to the large difference in thermal expansion between the base material and the resin.
更に、これらの誘電率に関してもより低くしたいという
要求があった。Furthermore, there has been a demand for lower dielectric constants of these materials.
一方、最近、耐熱熱可塑性繊維として、ポリエーテルエ
ーテルケトン（以下ＰＥＥＫと略す）繊維、ポリエーテ
ルイミド（以下ＰＥＩと略す）繊維、ポリフェニレンス
ルフィド（以下ＰＰＳと略す）繊維が発表されている（
例えば、繊維学会主催のニューチック・８８講演要旨集
等、１９８８年６月１５日）、これらの繊維は融点が２
７０℃以上で耐熱性が高いだけでなく、誘電率も３．１
〜３゜５と低く、前記の積層板用の基材としては最適で
あると考えられる。On the other hand, recently, polyetheretherketone (hereinafter abbreviated as PEEK) fiber, polyetherimide (hereinafter abbreviated as PEI) fiber, and polyphenylene sulfide (hereinafter abbreviated as PPS) fiber have been announced as heat-resistant thermoplastic fibers (
For example, these fibers have a melting point of 2.
Not only has high heat resistance above 70℃, but also has a dielectric constant of 3.1.
It is as low as ~3°5, and is considered to be optimal as a base material for the above-mentioned laminate.
しかしながら、上記基材に熱硬化性樹脂を含浸させ、通
常の方法で積層板を作製した場合、はんだ耐熱性の試験
において膨れが発生するという問題点が生じた。However, when the base material is impregnated with a thermosetting resin and a laminate is produced by a conventional method, a problem arises in that blistering occurs in a solder heat resistance test.
本発明はかかる状況に鑑みなされたものであって、誘電
率が低く、耐熱性が高く、またドリル加工性も良好な耐
熱熱可塑性繊維布基材積層板の製造方法を提供せんとす
るものである。The present invention was made in view of this situation, and it is an object of the present invention to provide a method for manufacturing a heat-resistant thermoplastic fiber cloth base laminate that has a low dielectric constant, high heat resistance, and good drill workability. be.
（課題を解決するための手段）
本発明者らは、前記問題を解決すべ（検討を行った結果
、耐熱熱可塑性繊維を基材としたプリプレグを、特定の
成形温度で加熱加圧することにより、前記目的を達成し
うろことを見い出し本発明をに至った。(Means for Solving the Problem) The present inventors have found that the above problem can be solved by heating and pressing a prepreg made of heat-resistant thermoplastic fiber as a base material at a specific molding temperature. The inventors have found a way to achieve the above object and have come up with the present invention.
すなわち、本発明の耐熱熱可塑性繊維布基材積層板の製
造方法は、融点が２７０℃以上の耐熱熱可塑性繊維を布
状に製織した基材に、熱硬化性樹脂を含浸させて得られ
るプリプレグを必要枚数積層し、必要に応じてその両面
あるいは片面に銅箔を載置し加熱加圧して積層板を製造
する工程において、加熱温度が、耐熱熱可塑性繊維のガ
ラス転移温度以上で融点以下の温度であることを特長と
する。That is, the method for producing a heat-resistant thermoplastic fiber cloth base material laminate of the present invention uses a prepreg obtained by impregnating a thermosetting resin into a base material obtained by weaving heat-resistant thermoplastic fibers having a melting point of 270° C. or higher into a cloth shape. In the process of manufacturing a laminate by laminating the required number of sheets, placing copper foil on both sides or one side as necessary, and applying heat and pressure, the heating temperature is higher than the glass transition temperature of the heat-resistant thermoplastic fiber and lower than the melting point. It is characterized by temperature.
本発明において耐熱熱可塑性繊とは、融点が２７０℃以
上の熱可塑性繊維である。融点が２７０℃未満の汎用熱
可塑性繊維を用いた場合、はんだ耐熱性試験（２６０℃
のはんだ浴にフロートする）において膨れが生じてしま
う。In the present invention, heat-resistant thermoplastic fibers are thermoplastic fibers with a melting point of 270° C. or higher. When using general-purpose thermoplastic fibers with a melting point of less than 270°C, soldering heat resistance test (260°C
(floating in the solder bath) causes blistering.
この様な耐熱熱可塑性繊維として、ポリエーテルエーテ
ルケトン繊維、ポリエーテルイミド繊維ポリフェニレン
スルフィド繊維等がある。各々の化学構造式を下記に示
す。Examples of such heat-resistant thermoplastic fibers include polyetheretherketone fibers, polyetherimide fibers, and polyphenylene sulfide fibers. The chemical structural formulas of each are shown below.
ポリエーテルエーテルケトン：
ポリエーテルイミド；
４℃であり、ガラス転移温度は１４３℃であり、誘電率
は３．２である。ポリエーテルイミド繊維の融点は約３
２０℃であり、ガラス転移温度は２１７℃であり、誘電
率は３．１である。ポリフェニレンスルフィド繊維の融
点は２８５℃であり、ガラス転移温度は約８５℃であり
、誘電率は３．５である。Polyetheretherketone: Polyetherimide; 4°C, glass transition temperature is 143°C, and dielectric constant is 3.2. The melting point of polyetherimide fiber is approximately 3
20°C, the glass transition temperature is 217°C, and the dielectric constant is 3.1. The melting point of polyphenylene sulfide fiber is 285°C, the glass transition temperature is about 85°C, and the dielectric constant is 3.5.
これらの耐熱熱可塑性繊維は繊維径が５〜５０μのもの
が用いられ、好ましくは１０〜３０ｐｍの範囲である。These heat-resistant thermoplastic fibers have a fiber diameter of 5 to 50 μm, preferably in the range of 10 to 30 pm.
繊維径か細すぎると糸が切れやすくなり、大すぎると基
材としての厚みが厚くなりすぎ、積層板の用途には適さ
なくなる。If the fiber diameter is too small, the threads will break easily, and if it is too large, the thickness of the base material will be too thick, making it unsuitable for use in laminates.
本発明において用いられる熱硬化性樹脂としては、エポ
キシ樹脂、ビスマレイミド樹脂、あるいは後述の特定の
低誘電率樹脂が使用される。エポキシ樹脂としては、ビ
スフェノールＡ型エポキシ樹脂、ノボラック型エポキシ
樹脂、トリフェニルメタントリグリシジルエーテル型エ
ポキシ樹脂等に硬化剤、硬化促進剤を配合したものが用
いられる。ビスマレイミド樹脂としては、ポリアミノビ
スマレイミド樹脂、ビスマレイミドトリアジン樹脂、ビ
スマレイミド、シロキサン樹脂等が用いられる。As the thermosetting resin used in the present invention, epoxy resin, bismaleimide resin, or a specific low dielectric constant resin described below is used. As the epoxy resin, a bisphenol A type epoxy resin, a novolac type epoxy resin, a triphenylmethane triglycidyl ether type epoxy resin, etc. mixed with a curing agent and a curing accelerator are used. As the bismaleimide resin, polyaminobismaleimide resin, bismaleimide triazine resin, bismaleimide, siloxane resin, etc. are used.
特定の低誘電率樹脂としては、（ａ）（Ｐ−ヒドロキシ
スチレン）誘導体のプレポリマと（ｂ）エポキシ変性ポ
リブタジェンと（ｃ）芳香族マレイミド化合物とを含む
低誘電率樹脂が用いられる。As the specific low dielectric constant resin, a low dielectric constant resin containing (a) a prepolymer of a (P-hydroxystyrene) derivative, (b) an epoxy-modified polybutadiene, and (c) an aromatic maleimide compound is used.
更に詳しくは、（ａ）として、一般式（１）（式中、Ａ
はハロゲン基であり、Ｒ，は炭素数２〜４のアルケニル
またはアルケノイルであり、ｍは１〜４、ｎは１〜１０
０の数を示す）で表されるポリ （Ｐ−ヒドロキシスチ
レン）誘導体から成るブリポリマに（ｂ）として下記一
般式（ＩＩ）（式中、Ｂはグリシジルエーテル系エポキ
シのコポリマであり、ｎは４〜１０００数を示す）で表
されるエポキシ変性ポリブタジェンと、（ｃ）として下
記一般式（Ｉ［［）
（式中、Ｒ８は少なくともベンゼン環を１ヶ以上含む芳
香族基、ｎは１〜４）で表わされる芳香族マレイミド化
合物と、必要に応じエポキシ化合物の硬化剤、及びラジ
カル反応開始剤としての有機過酸化物を配合してなる低
誘電率樹脂が用いられる。More specifically, as (a), general formula (1) (wherein A
is a halogen group, R is alkenyl or alkenoyl having 2 to 4 carbon atoms, m is 1 to 4, and n is 1 to 10
The following general formula (II) (where B is a glycidyl ether-based epoxy copolymer and n is 4 1000), and (c) is an epoxy-modified polybutadiene represented by the following general formula (I A low dielectric constant resin is used, which is made by blending an aromatic maleimide compound represented by () with an epoxy compound curing agent and an organic peroxide as a radical reaction initiator, if necessary.
上記、熱硬化性樹脂を、溶媒に溶かしてフェスとし、耐
熱熱可塑性繊維布に含浸後、加熱乾燥して溶媒を除去し
、プリプレグを得る。あるいは熱硬化性樹脂を無溶媒の
状態で加２！！溶融させ、耐熱熱可塑性繊維布に含浸さ
せても良い。The above thermosetting resin is dissolved in a solvent to form a face, impregnated into a heat-resistant thermoplastic fiber cloth, and then heated and dried to remove the solvent to obtain a prepreg. Or add thermosetting resin without solvent! ! It may be melted and impregnated into a heat-resistant thermoplastic fiber cloth.
この様にして得られたプリプレグを必要枚数積層し、必
要に応じてその両面あるいは片面に銅箔を′Ｒ置し、加
熱加圧して積層板を製造する。A required number of prepregs thus obtained are laminated, copper foil is placed on both or one side of the prepreg as required, and a laminate is produced by heating and pressing.
本発明において、上記工程での加熱温度は、耐熱熱可塑
性繊維のガラス転移温度以上で融点以下の温度でおこな
う必要がある。更に好ましくはガラス転移温度の５０℃
以上で融点の５０℃以下の範囲である。加熱温度がガラ
ス転移温度より低いと、はんだ耐熱性試験において膨れ
が生じてしまう。又、加熱温度が融点より高いと、耐熱
熱可塑性繊維も溶融し、積層板にそり、ねじれが発生す
る。In the present invention, the heating temperature in the above step must be higher than the glass transition temperature and lower than the melting point of the heat-resistant thermoplastic fiber. More preferably, the glass transition temperature is 50°C.
The melting point is within the range of 50° C. or lower. If the heating temperature is lower than the glass transition temperature, swelling will occur in the solder heat resistance test. Furthermore, if the heating temperature is higher than the melting point, the heat-resistant thermoplastic fibers will also melt, causing warpage and twisting in the laminate.
又、上記積層工程での加圧圧力は、５〜１００ｋｆｒ／
ｃＩＡの範囲であり、樹脂の溶融粘度等を考慮し設定さ
れる。In addition, the pressurizing pressure in the above lamination process is 5 to 100 kfr/
It is within the range of cIA, and is set in consideration of the melt viscosity of the resin, etc.
（作用）
本発明によって得られる積層板の誘電率が低くなるのは
、基材として誘電率の低い耐熱熱可塑性繊維を用いてい
るからであり、使用する熱効果性樹脂の低誘電率を低く
することにより、更に積層板として低誘電率化がはかれ
る。また、積層工程での加熱温度を、耐熱熱可塑性繊維
のガラス転移温度以上で融点以下の温度に設定すること
により、はんだ耐熱性試験において膨れが発生しなくな
る理由は明らかではないが、基材と樹脂との密着性が増
すためではないかと考えられる。(Function) The dielectric constant of the laminate obtained by the present invention is low because heat-resistant thermoplastic fibers with a low dielectric constant are used as the base material, and the low dielectric constant of the heat-effect resin used is reduced. By doing so, the dielectric constant of the laminate can be further reduced. Additionally, it is unclear why blistering does not occur in the solder heat resistance test by setting the heating temperature in the lamination process to a temperature above the glass transition temperature and below the melting point of the heat-resistant thermoplastic fiber, but This is thought to be due to increased adhesion with the resin.
（実施例）
以下、本発明を実施例によりさらに詳細に説明するが、
本発明はこれらの例によってなんら限定されるものでは
ない。(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited in any way by these examples.
実施例１
単糸径２１μ−〇ＰＰＳ繊維（奇人−社製 ２００７４
８タイプ）を用い、Ｍ当り７０ｇｒになる措な平織タイ
プのＰＰＳ繊維布基材に、エポキシ樹脂フェスＶＥ−６
７Ｎ （ＦＲ−４用エポキシ樹脂、日立化成工業■製）
を含浸させ、１７０℃で加熱乾燥させて溶媒を除去し、
プリプレグＡを作製した。Example 1 Single yarn diameter 21μ-〇PPS fiber (manufactured by Kijin-sha 20074
8 types), epoxy resin face VE-6 is applied to a plain weave type PPS fiber cloth base material with a weight of 70 gr per M.
7N (Epoxy resin for FR-4, manufactured by Hitachi Chemical)
impregnated with and dried by heating at 170°C to remove the solvent,
Prepreg A was produced.
プリプレグへの１枚の厚さは約０．１７ ａｓであった
。The thickness of one sheet of prepreg was about 0.17 as.
このプリプレグＡを８枚積層し、その両面に電解銅箔Ｔ
ＳＴＯ−３５（片面粗化電解銅箔、厚さ３５趨、古河サ
ーキットフォイル■製）を載置し、更にこれらを２枚の
鏡板ではさみ、加熱加圧成形した。加熱温度は１７０℃
で、加熱時間は９０分。Eight sheets of this prepreg A are laminated, and electrolytic copper foil T is placed on both sides.
STO-35 (single-sided roughened electrolytic copper foil, thickness 35 mm, manufactured by Furukawa Circuit Foil ■) was placed, which was then sandwiched between two mirror plates and molded under heat and pressure. Heating temperature is 170℃
And the heating time is 90 minutes.
圧力は４０ ｋｇ ｆ ／−であった、得られた両面銅
張積層板は板厚が１６ｍで、ボイド、カスレ、ソリ、ネ
ジレのない積層板であった。この積層板の主な特性を表
１示す。The pressure was 40 kg f/-. The obtained double-sided copper-clad laminate had a thickness of 16 m, and was free from voids, scratches, warpage, and twisting. Table 1 shows the main properties of this laminate.
実施例２
単糸径２１μのＰＥＥＫ繊維（奇人−社製２００／４８
タイプ）を用い、Ｍ当りｌｏｏｇｒになる様な平織タイ
プのＰＥＥＫ繊維布基材に、ポリアミノビスマレイミド
ワニスＶｌ−６８Ｎ（ポリアミノビスマレイミド樹脂１
日立化成工業■製）を含浸させ、１７０℃で加熱乾燥さ
せて溶媒を除去し、プリプレグＢを作製した。このプリ
プレグＢを用いて実施例１と同様に加熱加圧成形し、板
厚１．６曹１の積層板を得た。但し、加熱温度は２００
°Ｃで、加熱時間は１２０分、圧力は４０ｋｇｆ／ｃｄ
とした。Example 2 PEEK fiber with a single yarn diameter of 21 μm (manufactured by Kijin-sha 200/48
polyamino bismaleimide varnish Vl-68N (polyamino bismaleimide resin 1
(manufactured by Hitachi Chemical Co., Ltd.) was impregnated, and the solvent was removed by heating and drying at 170° C. to prepare prepreg B. This prepreg B was heated and pressed in the same manner as in Example 1 to obtain a laminate having a thickness of 1.6 mm. However, the heating temperature is 200℃.
°C, heating time 120 minutes, pressure 40kgf/cd
And so.
この積層板の主な特性を表１に示す。Table 1 shows the main properties of this laminate.
実施例３
単糸径３６趨のＰＥＩ繊維（奇人側社製 ２２５／ｌＢ
タイプ）を用い、Ｍ当り１００ｇｒになる様な平織タイ
プのＰＥＩ繊維布基材に、実施例２と同様にしてＶｌ−
６８Ｎを含浸させ、プリプレグＣを作製した。このプリ
プレグＣを用いて実施例１と同様に加熱加圧成形し、板
厚１．５ ｓｎの積層板を得た。但し、加熱温度は２７
０℃で、加熱時間は１２０分、圧力は４０ ｋｇ ｆ
／ ｃｄとし、雰囲気は１Ｔｏｒｒの真空雰囲気下とし
た。この積層板の主な特性を表１に示す。Example 3 PEI fiber with a single yarn diameter of 36 (225/1B manufactured by Kijin Kaisha)
In the same manner as in Example 2, Vl-
Prepreg C was prepared by impregnating it with 68N. This prepreg C was heated and pressed in the same manner as in Example 1 to obtain a laminate having a thickness of 1.5 sn. However, the heating temperature is 27
At 0℃, heating time is 120 minutes, pressure is 40 kgf
/ cd, and the atmosphere was a vacuum atmosphere of 1 Torr. Table 1 shows the main properties of this laminate.
実施例４
実施例２で用いたものと同じＰＥＥＫｍ維布基材に、臭
素化ポリ （Ｐ−ヒドロキシスチレン）のメタクリル酸
エステル（分子量７０００〜１２０００、臭素含有率４
２％）３０重量部、クレゾールノボラソクエボキシで変
性したポリブタジェン（エポキシ当１５７５ ｇｒ／ｅ
ｑ） ３０重量部、２゜２° −ビス（４−４−（マレ
イミドフェノキシ）フェニル）プロパン４０重量部、ジ
シアンジアミド ０．８２重量部、２，５−ジメチル−
２，５ジ（ｔ−ブチルパーオキシ）ヘキシン（３）０．
５重量部、メチルイソブチルケトン１００重量部、ジメ
チルホルムアミド１５０重量部からなる低誘電率樹脂ワ
ニスを含浸させ、１６０℃で加熱乾燥させて溶媒を除去
し、プリプレグＤを作製した。Example 4 A brominated poly (P-hydroxystyrene) methacrylate ester (molecular weight 7000-12000, bromine content 4) was added to the same PEEKm textile substrate as used in Example 2.
2%) 30 parts by weight of polybutadiene modified with cresol noborazoquevoxy (1575 gr/e per epoxy)
q) 30 parts by weight, 40 parts by weight of 2°2°-bis(4-4-(maleimidophenoxy)phenyl)propane, 0.82 parts by weight of dicyandiamide, 2,5-dimethyl-
2,5 di(t-butylperoxy)hexyne (3) 0.
Prepreg D was prepared by impregnating a low dielectric constant resin varnish consisting of 5 parts by weight, 100 parts by weight of methyl isobutyl ketone, and 150 parts by weight of dimethyl formamide, and heating and drying at 160° C. to remove the solvent.
このプリプレグＤを用いて実施例２と同様に２０θ℃で
加熱加圧成形し、板厚１．６■−の積層板を得た。この
積層板の主な特性を表１に示す。Using this prepreg D, heating and pressure molding was carried out at 20[theta]C in the same manner as in Example 2 to obtain a laminate having a thickness of 1.6 .mu.m. Table 1 shows the main properties of this laminate.
比較例１
実施例４において、ＰＥＥＫ繊維布基材のかわりに、実
施例３で用いたＰＥＩ維布基布基材用する以外は実施例
４と同様にして積層板を作製した。（ＰＥＩ繊維のガラ
ス転移温度が２１７℃に対し、加熱温度は２００℃と低
い条件）この積層板の主な特性を表１に示す。Comparative Example 1 A laminate was produced in the same manner as in Example 4, except that the PEI fiber fabric base material used in Example 3 was used instead of the PEEK fiber fabric base material. (The glass transition temperature of PEI fiber is 217°C, whereas the heating temperature is low at 200°C) The main characteristics of this laminate are shown in Table 1.
比較例２
基材として、従来のＥガラスを用いたＦＲ４グレードの
銅張積層板ＭＣＬ−Ｅ−６７（日立化成工業■製）の主
な特性を表１に示す。Comparative Example 2 Table 1 shows the main characteristics of an FR4 grade copper-clad laminate MCL-E-67 (manufactured by Hitachi Chemical Co., Ltd.) using conventional E glass as a base material.
（発明の効果）
表１に示す結果からも明らかなように、本発明によれば
誘電率が低く、しかも耐熱性に優れ、ドリル加工性も良
好な耐熱熱可塑性繊維布基材積層板の製造方法を提供す
ることができ、その工業的価値は大である。(Effects of the Invention) As is clear from the results shown in Table 1, according to the present invention, a heat-resistant thermoplastic fiber cloth base laminate having a low dielectric constant, excellent heat resistance, and good drilling workability can be produced. The method can be provided, and its industrial value is great.
Claims (5)
織した基材に、熱硬化性樹脂を含浸させて得られるプリ
プレグを必要枚数積層し、必要に応じてその両面あるい
は片面に銅箔を載置し、加熱加圧して積層板を製造する
工程において、加熱温度が耐熱熱可塑性繊維のガラス転
移温度以上で融点以下の温度であることを特徴とする耐
熱熱可塑性繊維布基材積層板の製造方法。1. A necessary number of prepregs obtained by impregnating a thermosetting resin on a base material made of cloth-like fabric made of heat-resistant thermoplastic fibers with a melting point of 270°C or higher are laminated, and copper foil is placed on both or one side as necessary. Production of a heat-resistant thermoplastic fiber cloth base laminate, characterized in that the heating temperature is above the glass transition temperature of the heat-resistant thermoplastic fiber and below the melting point in the process of producing the laminate by placing the heat-resistant thermoplastic fibers on the glass transition temperature and below the melting point of the heat-resistant thermoplastic fibers. Method.
，ポリエーテルイミド，ポリフェニレンスルフィドのう
ちのいずれかの繊維である請求項１に記載の耐熱熱可塑
性繊維布基材積層板の製造方法。2. 2. The method for producing a heat-resistant thermoplastic fiber cloth base laminate according to claim 1, wherein the heat-resistant thermoplastic fiber is any one of polyetheretherketone, polyetherimide, and polyphenylene sulfide.
載の耐熱熱可塑性繊維布基材積層板の製造方法。3. The method for producing a heat-resistant thermoplastic fiber cloth base laminate according to claim 1, wherein the thermosetting resin is an epoxy resin.
１に記載の耐熱熱可塑性繊維布基材積層板の製造方法。4. The method for producing a heat-resistant thermoplastic fiber cloth base laminate according to claim 1, wherein the thermosetting resin is a bismaleimide resin.
）誘導体のプレポリマと（ｂ）エポキシ変性ポリブタジ
エンと（ｃ）芳香族マレイミド化合物とを含む低誘電率
樹脂である請求項１に記載の耐熱熱可塑性繊維布基材積
層板の製造方法。5. The thermosetting resin according to claim 1, wherein the thermosetting resin is a low dielectric constant resin containing (a) a prepolymer of a (P-hydroxystyrene) derivative, (b) an epoxy-modified polybutadiene, and (c) an aromatic maleimide compound. A method for producing a plastic fiber cloth base laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32243788A JPH02165945A (en) | 1988-12-21 | 1988-12-21 | Manufacture of heat resistant thermoplastic fiber cloth base material laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32243788A JPH02165945A (en) | 1988-12-21 | 1988-12-21 | Manufacture of heat resistant thermoplastic fiber cloth base material laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02165945A true JPH02165945A (en) | 1990-06-26 |
Family
ID=18143664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32243788A Pending JPH02165945A (en) | 1988-12-21 | 1988-12-21 | Manufacture of heat resistant thermoplastic fiber cloth base material laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02165945A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006225484A (en) * | 2005-02-16 | 2006-08-31 | Murata Mfg Co Ltd | Composite dielectric material and electronic component |
| WO2014036712A1 (en) * | 2012-09-07 | 2014-03-13 | 广东生益科技股份有限公司 | Composite material, high frequency circuit substrate made from the same, and production method thereof |
| JP2018104828A (en) * | 2016-12-22 | 2018-07-05 | 株式会社ダイセル | Reinforcing fiber, nonwoven fabric and fiber-reinforced resin |
-
1988
- 1988-12-21 JP JP32243788A patent/JPH02165945A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006225484A (en) * | 2005-02-16 | 2006-08-31 | Murata Mfg Co Ltd | Composite dielectric material and electronic component |
| WO2014036712A1 (en) * | 2012-09-07 | 2014-03-13 | 广东生益科技股份有限公司 | Composite material, high frequency circuit substrate made from the same, and production method thereof |
| JP2018104828A (en) * | 2016-12-22 | 2018-07-05 | 株式会社ダイセル | Reinforcing fiber, nonwoven fabric and fiber-reinforced resin |
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