JPH0216071U

JPH0216071U -

Info

Publication number: JPH0216071U
Application number: JP9457288U
Authority: JP
Priority date: 1988-07-19
Filing date: 1988-07-19
Publication date: 1990-02-01

Description

[Brief explanation of drawings]

第１図は本考案実施例のアンローダー部の斜視
図、第２図はコンテナステイツクの斜視図、第３
図はコンテナステイツクをコンテナガイドに取り
付けた図、第４図は第１図のアンローダ部の平面
図、第５図は第４図のアンローダ部の側面図、第
６図は第５図のストツパー部の拡大図、第７図は
従来の自由落下式の半導体パツケージハンドラー
の全体斜視図である。図中、４は徐冷レール部、１１はアンローダー
部、１２はＤＩＰ型半導体パツケージ、１３はコ
ンテナステイツク、１４はアンローダー部本体、
１５は案内部、１６はストツパー部、１８は引張
りコイルバネ、を示す。 Fig. 1 is a perspective view of the unloader section of the embodiment of the present invention, Fig. 2 is a perspective view of the container stack, and Fig. 3 is a perspective view of the unloader section of the embodiment of the present invention.
The figure shows the container stake attached to the container guide, Figure 4 is a plan view of the unloader part in Figure 1, Figure 5 is a side view of the unloader part in Figure 4, and Figure 6 is the stopper in Figure 5. FIG. 7 is an overall perspective view of a conventional free-fall type semiconductor package handler. In the figure, 4 is a slow cooling rail part, 11 is an unloader part, 12 is a DIP type semiconductor package, 13 is a container stick, 14 is an unloader part main body,
15 is a guide portion, 16 is a stopper portion, and 18 is a tension coil spring.

Claims

[Claims for Utility Model Registration] The assembled semiconductor package 12 is automatically supplied to a test device, and based on the test results of the test device, the semiconductor package 12 is placed on one of the rail sections 4 consisting of a plurality of rails. 1. A free-fall type semiconductor package handler for supplying semiconductor packages to two rails, characterized in that an unloader section 11 is provided on an extension of the rail section 4, in which a storage member 13 for a semiconductor package 12 is disposed.