JPH021584U - - Google Patents
Info
- Publication number
- JPH021584U JPH021584U JP7918188U JP7918188U JPH021584U JP H021584 U JPH021584 U JP H021584U JP 7918188 U JP7918188 U JP 7918188U JP 7918188 U JP7918188 U JP 7918188U JP H021584 U JPH021584 U JP H021584U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- solder
- utility
- metal plate
- solder material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims 1
- 238000010276 construction Methods 0.000 description 3
Landscapes
- Building Environments (AREA)
- Laminated Bodies (AREA)
Description
第１図は第１実施例の斜視図、第２図は同施工
状態の断面図、第３図は第２実施例の斜視図、第
４図は同施工状態の断面図、第５図は複層半田材
の一例を示す全体の正面図である。
Ａ，Ｂ…複層半田材、１…金属薄板の層、２，
２１，２２…半田の層、３，４…接合される金属
薄板、５…接合位置。
Fig. 1 is a perspective view of the first embodiment, Fig. 2 is a sectional view of the same construction state, Fig. 3 is a perspective view of the second embodiment, Fig. 4 is a sectional view of the same construction state, and Fig. 5 is a sectional view of the same construction state. FIG. 2 is an overall front view showing an example of a multilayer solder material. A, B...Multi-layer solder material, 1... Layer of thin metal plate, 2,
21, 22...Solder layer, 3, 4...Metal thin plate to be joined, 5...Joining position.
Claims (1)
の層と、この金属薄板の層の少なくとも一方の面
に施した半田の層と、を備えたことを特徴とする
複層半田材。 (2) 半田の層にはペーストを含むことを特徴と
する第１請求項記載の複層半田材。[Claims for Utility Model Registration] (1) A utility model characterized by comprising a layer of a thin metal plate such as a metal foil or a metal film, and a layer of solder applied to at least one surface of the layer of the thin metal plate. Multi-layer solder material. (2) The multilayer solder material according to claim 1, wherein the solder layer contains paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7918188U JPH021584U (en) | 1988-06-15 | 1988-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7918188U JPH021584U (en) | 1988-06-15 | 1988-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021584U true JPH021584U (en) | 1990-01-08 |
Family
ID=31304066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7918188U Pending JPH021584U (en) | 1988-06-15 | 1988-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021584U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62220269A (en) * | 1986-03-20 | 1987-09-28 | Tdk Corp | Soldering method |
-
1988
- 1988-06-15 JP JP7918188U patent/JPH021584U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62220269A (en) * | 1986-03-20 | 1987-09-28 | Tdk Corp | Soldering method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH021584U (en) | ||
| JPS58188841U (en) | Structure of paper bag opening part | |
| JPS61192497U (en) | ||
| JPH0469429U (en) | ||
| JPH0259881U (en) | ||
| JPS62182725U (en) | ||
| JPH0464542U (en) | ||
| JPH02146146U (en) | ||
| JPS63114660U (en) | ||
| JPS6167124U (en) | ||
| JPH0329446U (en) | ||
| JPS6265259U (en) | ||
| JPS6265258U (en) | ||
| JPH0256168U (en) | ||
| JPH03102767U (en) | ||
| JPH0337715U (en) | ||
| JPH0282525U (en) | ||
| JPH01151089U (en) | ||
| JPH028170U (en) | ||
| JPS623770U (en) | ||
| JPS6250988U (en) | ||
| JPH0248298U (en) | ||
| JPS6078428U (en) | Laminate profile | |
| JPH0391196U (en) | ||
| JPH0332966U (en) |