JPH0215738U - - Google Patents
Info
- Publication number
- JPH0215738U JPH0215738U JP9448588U JP9448588U JPH0215738U JP H0215738 U JPH0215738 U JP H0215738U JP 9448588 U JP9448588 U JP 9448588U JP 9448588 U JP9448588 U JP 9448588U JP H0215738 U JPH0215738 U JP H0215738U
- Authority
- JP
- Japan
- Prior art keywords
- header
- lead
- resin
- semiconductor pellet
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9448588U JPH0215738U (me) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9448588U JPH0215738U (me) | 1988-07-15 | 1988-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215738U true JPH0215738U (me) | 1990-01-31 |
Family
ID=31319015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9448588U Pending JPH0215738U (me) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215738U (me) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017154072A1 (ja) * | 2016-03-07 | 2017-09-14 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
-
1988
- 1988-07-15 JP JP9448588U patent/JPH0215738U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017154072A1 (ja) * | 2016-03-07 | 2017-09-14 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JPWO2017154072A1 (ja) * | 2016-03-07 | 2018-05-10 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| US11152275B2 (en) | 2016-03-07 | 2021-10-19 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |