JPH0215706U - - Google Patents
Info
- Publication number
- JPH0215706U JPH0215706U JP9393888U JP9393888U JPH0215706U JP H0215706 U JPH0215706 U JP H0215706U JP 9393888 U JP9393888 U JP 9393888U JP 9393888 U JP9393888 U JP 9393888U JP H0215706 U JPH0215706 U JP H0215706U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- fixing
- view
- electrical elements
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は従来のリード線付き電気素子列を印刷
配線基板に装着した概略図、第２図ないし第７図
は本考案の実施例に関するもので、第２図はリー
ド線付き電気素子列の一実施例を基板に装着した
概略図、第３図Ａは上記実施例と同様の実施例の
斜視図、Ｂは同ピツチプレートの平面図、第４図
Ａは他の実施例の斜視図、Ｂは同ピツチプレート
の平面図、第５図は固着手段として接着層を用い
た実施例の斜視図、第６図は接着層を用いた他の
実施例の斜視図、第７図はさらに異なる実施例の
斜視図である。
１……抵抗、２，３……電極、４……リード線
、５……接続線、６……棒状絶縁体、７……ピツ
チプレート、８……挿通孔、９……切欠き溝、１
０……リード線付き電気素子列、１１……接着剤
層、１２……プラスチツク材、１３……印刷配線
基板。
Figure 1 is a schematic diagram of a conventional electrical element array with lead wires mounted on a printed wiring board, Figures 2 to 7 relate to embodiments of the present invention, and Figure 2 shows an electrical element array with lead wires. A schematic view of one embodiment mounted on a board, FIG. 3A is a perspective view of an embodiment similar to the above embodiment, B is a plan view of the same pitch plate, FIG. 4A is a perspective view of another embodiment, B is a plan view of the same pitch plate, FIG. 5 is a perspective view of an embodiment using an adhesive layer as a fixing means, FIG. 6 is a perspective view of another embodiment using an adhesive layer, and FIG. 7 is a still different example. It is a perspective view of an example. 1... Resistor, 2, 3... Electrode, 4... Lead wire, 5... Connection wire, 6... Rod-shaped insulator, 7... Pitch plate, 8... Insertion hole, 9... Notch groove, 1
0...Electric element array with lead wires, 11...Adhesive layer, 12...Plastic material, 13...Printed wiring board.
Claims (1)
ード線を固着し、他方の電極に接続線を固着して
複数の電気素子を一列に連接したリード線付き電
気素子列において、前記複数のリード線付き電気
素子に、リード線の先端部が等間隔に配置される
ように、前記接続線による固着とは別に、これら
を一体に固定する手段を施したことを特徴とする
リード線付き電気素子列。 In an electrical element array with lead wires, in which a plurality of electrical elements are connected in a row by fixing a lead wire to one electrode of an electrical element having electrodes at both ends and fixing a connecting wire to the other electrode, the plurality of lead wires An array of electrical elements with lead wires, characterized in that the electrical elements with lead wires are provided with means for fixing them together in addition to fixing with the connection wires so that the tips of the lead wires are arranged at equal intervals. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9393888U JPH0215706U (en) | 1988-07-18 | 1988-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9393888U JPH0215706U (en) | 1988-07-18 | 1988-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215706U true JPH0215706U (en) | 1990-01-31 |
Family
ID=31318424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9393888U Pending JPH0215706U (en) | 1988-07-18 | 1988-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215706U (en) |
-
1988
- 1988-07-18 JP JP9393888U patent/JPH0215706U/ja active Pending