JPH021560U - - Google Patents
Info
- Publication number
- JPH021560U JPH021560U JP1988077218U JP7721888U JPH021560U JP H021560 U JPH021560 U JP H021560U JP 1988077218 U JP1988077218 U JP 1988077218U JP 7721888 U JP7721888 U JP 7721888U JP H021560 U JPH021560 U JP H021560U
- Authority
- JP
- Japan
- Prior art keywords
- light
- electrical signal
- size range
- laser
- predetermined size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Description
第１図は本考案の実施例を示した光学系構成図
である。
記号の説明：１……レーザビーム、２……レー
ザビームエキスパンダ、３……レーザはんだ付用
対物レンズ、４……基板、５……融着はんだ、６
……光源、７……許容領域、８……フオトセンサ
、９……判定器。
FIG. 1 is a block diagram of an optical system showing an embodiment of the present invention. Explanation of symbols: 1... Laser beam, 2... Laser beam expander, 3... Objective lens for laser soldering, 4... Board, 5... Fusion solder, 6
...Light source, 7...Permissible area, 8...Photo sensor, 9...Judgment device.
Claims (1)
おいて所定の大きさの範囲に融着するレーザはん
だ付装置において、前記所定の大きさの範囲内の
限られた一部の許容領域に向けてビーム光を照射
する発光部と、前記照射されたビーム光の反射光
を所定の方角で受け電気信号に変換して出力する
受光部と、前記出力された電気信号が所定の値よ
り大きいかどうかを判定する手段とを付加して成
ることを特徴とするレーザはんだ付装置。 In a laser soldering device that uses laser light to fuse solder material in a predetermined size range at a desired position on a board, a beam of light is directed to a limited allowable area within the predetermined size range. a light emitting unit that irradiates the beam, a light receiving unit that receives the reflected light of the irradiated beam in a predetermined direction and converts it into an electrical signal and outputs it, and determines whether the output electrical signal is larger than a predetermined value. 1. A laser soldering device characterized by further comprising a means for soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988077218U JPH021560U (en) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988077218U JPH021560U (en) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021560U true JPH021560U (en) | 1990-01-08 |
Family
ID=31302213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988077218U Pending JPH021560U (en) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021560U (en) |
-
1988
- 1988-06-13 JP JP1988077218U patent/JPH021560U/ja active Pending