JPH02154475A - Manufacture of photodetector - Google Patents
Manufacture of photodetectorInfo
- Publication number
- JPH02154475A JPH02154475A JP63309346A JP30934688A JPH02154475A JP H02154475 A JPH02154475 A JP H02154475A JP 63309346 A JP63309346 A JP 63309346A JP 30934688 A JP30934688 A JP 30934688A JP H02154475 A JPH02154475 A JP H02154475A
- Authority
- JP
- Japan
- Prior art keywords
- package
- resin
- light receiving
- light
- photodetector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 238000005498 polishing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Optical Head (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はデジタルオーディオディスク（ＤＡＤ）、ビデ
オティスフ（ＶＤ）等の信号検出等において使用されて
いるモールドタイプの受光装置等に関し、特に、光学的
に平滑な受光面を有する受光装置の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mold type light receiving device used in signal detection of digital audio discs (DAD), video discs (VD), etc., and particularly, The present invention relates to a method of manufacturing a light receiving device having an optically smooth light receiving surface.
受光装置はパッケージとして用いる樹脂に透明樹脂を用
いその表面に段差、キズ等かあれは光の散乱により光学
特性に影響を与えるため、パッケージ表面を鏡面に仕上
げる必要がある。The light-receiving device uses a transparent resin as a package, and the package surface must be finished to a mirror finish because any steps, scratches, etc. on the surface will scatter light and affect the optical characteristics.
従来、受光装置はｐｎ接合等を有する受光素子３を作製
し、これを電極端子と共にトランスファーモールドやキ
ャスティングモールドによって樹脂内に封入してパッケ
ージ２を成形した後、パッケージ表面のキズ、気泡、成
形時に使用する離型剤による小さな波状の段差等、光学
特性に大きな影響を与える要因を除いて品質１歩留を向
−卜させるために第３図に示すようにパッケージ表面の
パフ研磨を行なって作製していた。Conventionally, in a light receiving device, a light receiving element 3 having a pn junction or the like is manufactured, and this is encapsulated in resin together with an electrode terminal by transfer molding or casting molding to form a package 2. After that, the package 2 is molded to remove scratches, air bubbles, etc. on the surface of the package. The package surface is manufactured by puff polishing as shown in Figure 3 in order to eliminate factors that greatly affect the optical properties, such as small wavy steps caused by the mold release agent used, and to improve the quality 1 yield. Was.
上述した従来の受光装置のモールドパッケージの表面仕
上げ方法はモールド時の離型剤や樹脂の特性によりパッ
ケージ表面状態への影響が太きく、パッケージ表面をハ
フ研磨している。しかし、ハフ研磨を行なっても第３図
に示すように、樹脂内部にあった小さな気泡か研磨され
ることによってパッケージの表面に現われ、研磨の効果
が少なく、むだなＴ数が多くなっていた。このなめ、製
品歩留か悪く単価か高くなるという欠点があった。In the above-mentioned conventional surface finishing method for a molded package of a light receiving device, the package surface condition is greatly affected by the properties of the mold release agent and resin during molding, and the package surface is huff-polished. However, even if Hough polishing was performed, as shown in Figure 3, small air bubbles inside the resin were polished and appeared on the surface of the package, resulting in less polishing effect and a large number of wasted T. . This disadvantage had the disadvantage of poor product yield and high unit price.
本発明は、１〜ランスフアーモールドやキャステインク
モールドにより発生したパッケージ表面の小さな凹凸に
樹脂を埋め、パッケージの表面を鏡面状態に什−Ｆけた
受光素子を提供するものである。The present invention provides a light-receiving element in which small irregularities on the surface of a package caused by lance-force molding or cast ink molding are filled with resin to make the surface of the package mirror-like.
本発明は、１）「ｌ接合等を有する受光素子を作製し、
これをモールドパッケージ内に封入した後、モールドパ
ッケージの表面に、パッケージの樹脂と同し屈折率か又
はそれより小さい屈折率の反応性樹脂を設け、この樹脂
を鏡面仕上げされた平板で加圧すると同時に加熱又は光
照射することによりパッケージ表面にある小さなキズ、
気泡、波状の段差等を埋めて鏡面状態を作り出すという
構成となっている。The present invention consists of: 1) producing a light-receiving element having an l-junction, etc.;
After encapsulating this in a molded package, a reactive resin with a refractive index equal to or lower than that of the resin of the package is provided on the surface of the molded package, and this resin is pressed with a mirror-finished flat plate. Small scratches on the package surface caused by heating or light irradiation at the same time.
The structure is such that it fills in air bubbles, wavy steps, etc. to create a mirror surface.
〔実施例〕
次に、本発明について図面を参照して説明する。第１図
に受光装置の製造工程の概略図を示す。[Example] Next, the present invention will be described with reference to the drawings. FIG. 1 shows a schematic diagram of the manufacturing process of the light receiving device.
まず、ｐｎ接合を形成したフォトタイオート作製した後
、第１国Ａに示すように、フォトタイオート３を電極端
子５と共にエボキン樹脂てモールドしてパッケージ２内
に封入する。次いてパッケージ表面に０．１ｍｍ厚の熱
硬化樹脂（本実施例ではアクリル樹脂を使用）７を塗布
する（第］国Ｂ）。この後、第１図Ｃに示すように表面
９を鏡面仕上げした金属板８で熱硬化樹脂を加圧しなが
ら加熱することによって第１図りのようにキズ気泡，段
差を樹脂７で埋めたなめらかな平面を有する受光装置が
出来上る。First, after producing a phototire with a pn junction formed therein, the phototire 3 and the electrode terminal 5 are molded with Evokin resin and sealed in the package 2, as shown in the first example A. Next, a thermosetting resin (acrylic resin is used in this example) 7 is applied to the package surface to a thickness of 0.1 mm (Country B). After that, as shown in Fig. 1C, by heating the thermosetting resin while pressurizing it with a metal plate 8 whose surface 9 has been finished to a mirror finish, the scratches, bubbles, and steps are filled with the resin 7 as shown in Fig. 1C. A light receiving device having a flat surface is completed.
第２図は本発明の第２の実施例により作られた受光装置
の断面図である。この実施例では受光素子３の受光面に
対応する位置のパッケージ表面に凹部を設けこの凹部内
に第１の実施例と同様熱硬化樹脂７を圧入した。本構造
では、受光素子の受光部上面に位置するパッケージの領
域が薄くなるなめ、内部気泡の影響か小さく出来る利点
かある。FIG. 2 is a sectional view of a light receiving device made according to a second embodiment of the present invention. In this embodiment, a recess was provided on the package surface at a position corresponding to the light-receiving surface of the light-receiving element 3, and a thermosetting resin 7 was press-fitted into the recess as in the first embodiment. This structure has the advantage that the area of the package located above the light-receiving part of the light-receiving element is thinner, so that the influence of internal air bubbles can be reduced.
以上説明したように本発明は熱硬化性樹脂をパッケージ
表面に置き、加熱することによって樹脂を溶かし、表面
の凹凸を埋め、鏡面状態に仕上けることにより、従来性
なっていた表面研磨を廃山てき更に歩留向ト、光学特性
の向−Ｌが実現できる。As explained above, the present invention places a thermosetting resin on the package surface and heats it to melt the resin, fill in the unevenness of the surface, and finish it in a mirror-like state, thereby eliminating the conventional surface polishing process. Furthermore, it is possible to achieve improvements in yield and optical properties.
製熱圧着用の平板。A flat plate for thermocompression.
第１図は本発明の実施例の概略図、第２図は本発明によ
り得られた受光装置の縦断面図、第３図は従来のパフ研
磨による受光面仕上げの方法を示す図である。
２・・・パッケージ、３・・・受光素子、５・・電極端
子、７・・熱硬化樹脂、８・金属又はプラスチック第２
図FIG. 1 is a schematic diagram of an embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a light receiving device obtained according to the present invention, and FIG. 3 is a diagram showing a conventional method of finishing the light receiving surface by puff polishing. 2... Package, 3... Light receiving element, 5... Electrode terminal, 7... Thermosetting resin, 8... Metal or plastic second
figure
Claims (1)
入する工程と、前記パッケージ表面に紫外線硬化樹脂あ
るいは熱硬化性樹脂又は熱軟化性樹脂の反応性材料を受
光部表面に設けて、これを加熱又は紫外線照射すると共
に鏡面仕上げされた平板を圧接し、受光面全体に薄く広
げて固着する工程とを少くとも有することを特徴とする
受光装置の製造方法。A process of molding a light receiving element with a light-transmitting resin and encapsulating it in a package, and providing a reactive material such as an ultraviolet curing resin, a thermosetting resin, or a thermosoftening resin on the surface of the light receiving part on the surface of the package. A method for manufacturing a light receiving device, comprising at least the steps of heating or irradiating with ultraviolet rays and press-fitting a mirror-finished flat plate, spreading it thinly over the entire light receiving surface and fixing it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309346A JPH02154475A (en) | 1988-12-06 | 1988-12-06 | Manufacture of photodetector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63309346A JPH02154475A (en) | 1988-12-06 | 1988-12-06 | Manufacture of photodetector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02154475A true JPH02154475A (en) | 1990-06-13 |
Family
ID=17991904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63309346A Pending JPH02154475A (en) | 1988-12-06 | 1988-12-06 | Manufacture of photodetector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02154475A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04313245A (en) * | 1991-04-11 | 1992-11-05 | Mitsui High Tec Inc | Manufacture of semiconductor device |
| US7026654B2 (en) * | 2002-04-05 | 2006-04-11 | Canon Kabushiki Kaisha | Package for optical semiconductor |
| JP2007149905A (en) * | 2005-11-28 | 2007-06-14 | Sony Corp | Photoelectric conversion element package and manufacturing method thereof |
| JP2009054420A (en) * | 2007-08-27 | 2009-03-12 | Fujifilm Corp | Manufacturing method for flexible substrate for electronic device, manufacturing method for electronic device, and electronic device manufactured by the method |
-
1988
- 1988-12-06 JP JP63309346A patent/JPH02154475A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04313245A (en) * | 1991-04-11 | 1992-11-05 | Mitsui High Tec Inc | Manufacture of semiconductor device |
| US7026654B2 (en) * | 2002-04-05 | 2006-04-11 | Canon Kabushiki Kaisha | Package for optical semiconductor |
| JP2007149905A (en) * | 2005-11-28 | 2007-06-14 | Sony Corp | Photoelectric conversion element package and manufacturing method thereof |
| JP2009054420A (en) * | 2007-08-27 | 2009-03-12 | Fujifilm Corp | Manufacturing method for flexible substrate for electronic device, manufacturing method for electronic device, and electronic device manufactured by the method |
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