JPH02154446A - Automated designing of semiconductor device - Google Patents
Automated designing of semiconductor deviceInfo
- Publication number
- JPH02154446A JPH02154446A JP30803288A JP30803288A JPH02154446A JP H02154446 A JPH02154446 A JP H02154446A JP 30803288 A JP30803288 A JP 30803288A JP 30803288 A JP30803288 A JP 30803288A JP H02154446 A JPH02154446 A JP H02154446A
- Authority
- JP
- Japan
- Prior art keywords
- logic function
- cells
- cell
- semiconductor substrate
- designing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 2
- 238000011156 evaluation Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体集積回路の半導体基板に電位を供給す
るセル(Cell)を、目的とする回路機能を実現する
ための基本的な論理機能セル(Cel l )と共に自
動配置する半導体装置の自動設計方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a cell that supplies a potential to a semiconductor substrate of a semiconductor integrated circuit. The present invention relates to an automatic design method of a semiconductor device that is automatically arranged together with a semiconductor device (Cell).
従来の技術
近年、大規模化する半導体集積回路の設計において、コ
ンピュータを用いた自動設計(自動配置配線)が利用さ
れるようになってきた。2. Description of the Related Art In recent years, automatic design (automatic placement and wiring) using computers has come to be used in the design of semiconductor integrated circuits, which are becoming larger in scale.
以下に、従来の自動設計方法について説明する。A conventional automatic design method will be explained below.
第4図は、従来の自動設計において、使用する論理機能
セルを自動配置する際のフローヂャ−1・である。この
フローチャートのように構成された自動設計における自
動配置方法について、以下にその動作を説明する。FIG. 4 is a flowchart 1 for automatically arranging logic function cells to be used in conventional automatic design. The operation of the automatic placement method in automatic design configured as shown in this flowchart will be described below.
まず設計制約条件の入力の項で、自動設計で実現する半
導体集積回路の制約条件を認識させる。First, in the section on inputting design constraints, students are made aware of the constraints of a semiconductor integrated circuit that will be realized through automatic design.
ここでいう制約条件とは、自動設計する半導体集積回路
の大きさ、すなわち幅、高さなどの領域の制限のことを
示す。次に、目的とする機能を実現するために必要な論
理機能セル101〜121を第5図に示すように複数段
に分けて、ずきまなく配置する。そうして得られた結果
を評価し、設計条件を満足し、かつ、評価項目(配線の
長さのj1価など)′を満たしていれば、自動配置は完
了し、満たしていなけれは評価を満足するように、再度
配置のやり直しを行なう。The constraint conditions here refer to the size of the automatically designed semiconductor integrated circuit, that is, limitations on areas such as width and height. Next, the logic function cells 101 to 121 necessary to realize the desired function are divided into multiple stages and arranged without any gaps, as shown in FIG. Evaluate the results obtained in this way, and if the design conditions are satisfied and the evaluation items (j1 value of wiring length, etc.) are satisfied, automatic placement is completed; if not, evaluation is completed. Re-arrange the layout until you are satisfied.
発明が解決しようとする課題
しかしながら、前記の従来の構成では、例えば、自動設
計で実現しようとする半導体集積回路の横幅がある一定
値に固定されている場合、論理機能ブロックの数と幅に
よっては、一部に大きな空き領域が生じてしまうという
問題点を有していた。Problems to be Solved by the Invention However, in the conventional configuration described above, for example, when the width of a semiconductor integrated circuit to be realized by automatic design is fixed to a certain value, the width may vary depending on the number and width of logical function blocks. However, there was a problem in that a large empty area was left in some parts.
本発明は、上記従来の問題点を解決するもので、空き領
域を減少させると哄に、ラッチアップ対策の強化も実現
することのできる半導体装置の自動設計方法を提供する
ことを目的とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and aims to provide an automatic semiconductor device design method that can not only reduce the free area but also strengthen latch-up countermeasures.
課題を解決するための手段
この目的を達成するために、本発明の自動設計方法は、
半導体基板に電位を供給するセルを、目的とする半導体
集積回路を実現するための基本的な論理機能セルと共に
自動配置することを特徴とする。Means for Solving the Problems To achieve this objective, the automatic design method of the present invention:
It is characterized by automatically arranging cells that supply a potential to a semiconductor substrate together with basic logic function cells for realizing a target semiconductor integrated circuit.
作用
この構成によって、空き領域を減少させると共に、半導
体基板に電位を供給するセルにより、ラッチアップ対策
の強化も実現することができる。Effect: With this configuration, it is possible to reduce the vacant area and to strengthen the latch-up countermeasures by using the cells that supply potential to the semiconductor substrate.
実施例
以下、本発明の一実施例について、第1図〜第3図を参
照しながら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3.
第1図は、本発明の一実施例における半導体装置の自動
設計方法の自動配置のフローチャートである。このフロ
ーチャートに示される本実施例の半導体装置の自動設計
方法の自動配置方法について以下にその動作を説明する
。FIG. 1 is a flowchart of automatic placement of a method for automatically designing a semiconductor device according to an embodiment of the present invention. The operation of the automatic placement method of the automatic semiconductor device design method of this embodiment shown in this flowchart will be described below.
まず、設計制約条件を入力し、次に目的とする機能を実
現するために必要な論理機能セルを複数段に分けて、す
きまな(配置する。次に、与えられた設計IU約条件(
集積回路の輻2高さ)の制限範囲まで論理機能セルを分
散させる。そして、得られた結果を評価し、設計制約条
件、評価項目を満たすまで、再配置と論理機能セルの分
散を繰り返す。その後、論理機能セルを分散さゼること
によって生じた領域に、半導体基板に電位を供給するセ
ルを配置することで、自動配置が完了する。First, design constraints are input, and then the logic function cells necessary to realize the desired function are divided into multiple stages and arranged with gaps.Next, given design IU constraints (
Logic function cells are distributed to the limited range of the integrated circuit (radius 2 height). Then, the obtained results are evaluated, and the rearrangement and distribution of logic function cells are repeated until the design constraints and evaluation items are satisfied. Thereafter, automatic placement is completed by placing cells that supply potential to the semiconductor substrate in the area created by dispersing the logic function cells.
第2図に本実施例での最終配置結果を示す。第2図から
明らかなように、論理機能セル101〜121は複数段
に分けて配置され、それらの間に半導体基板に電位を供
給するセル201〜206が配置される。その結果、第
5図に示した従来例のような大きな空き領域は生しない
。FIG. 2 shows the final placement results in this example. As is clear from FIG. 2, the logic function cells 101 to 121 are arranged in multiple stages, and the cells 201 to 206 that supply a potential to the semiconductor substrate are arranged between them. As a result, a large empty area as in the conventional example shown in FIG. 5 does not occur.
第3図(a)、(b)は第2図の一部を拡大して示した
平面図およびそのA−A ’断面図であり、半導体基板
に電位を供給するセル201内のN領域(N領域301
およびN十領域302 ) let Vool::、P
領域(P−領域401.P+領域402)はGNDに接
続されている。FIGS. 3(a) and 3(b) are a plan view showing an enlarged part of FIG. N area 301
and N ten area 302) let Vool::,P
The regions (P- region 401.P+ region 402) are connected to GND.
また、設計制約条件で幅、高さなどの領域の指定がなく
、論理機能セルの配置結果で領域を決定する場合は、配
置結果より領域の算出を行ない、その算出した領域まで
論理機能セルの分散を行なう。その後は同様に、論理機
能セルを分散させることにより生じた空き領域に、半導
体基板電位供給セルを配置することで自動配置が完了す
る。In addition, if the design constraints do not specify areas such as width and height, and the area is determined based on the placement results of logical function cells, calculate the area from the placement results and extend the logical function cells up to the calculated area. Perform dispersion. Thereafter, automatic placement is completed by placing semiconductor substrate potential supply cells in the vacant areas created by dispersing the logic function cells.
以上のように、本実施例によれば、−度装置した論理機
能セルを設計制約範囲まで分散させ、その結果生じた領
域に半導体基板電位供給セルを配置したことにより、む
だな空き領域を減少させると共に、半導体基板への電位
の供給が強化されることにより、ラッチアップ対策の強
化を行なうことができる。As described above, according to this embodiment, by distributing the logic function cells that have been deactivated within the design constraint range and arranging the semiconductor substrate potential supply cells in the resulting area, wasted free space is reduced. At the same time, by strengthening the supply of potential to the semiconductor substrate, measures against latch-up can be strengthened.
発明の効果
本発明は、論理機能セルと共に、半導体基板電位供給セ
ルを自動配置したことにより、むだな空き領域を減少さ
せると共に、ラッチアップ対策の強化をはかることがで
き、更に、論理機能セルを設計制約条件の制限範囲まで
分散させたことで、配置後に行なう論理機能セル間の配
線の集中をも分散させることができるという効果を得る
ことができる優れた半導体装置の自動設計方法を実現で
きるものである。Effects of the Invention By automatically arranging semiconductor substrate potential supply cells together with logic function cells, the present invention can reduce wasted free space and strengthen latch-up countermeasures. An excellent automatic semiconductor device design method that can achieve the effect of dispersing the concentration of wiring between logic function cells after placement by distributing it to the limited range of design constraints. It is.
第1図は本発明の一実施例における半導体装置の自動設
計方法のフローチャー1・を示ず図、第2図は同実施例
における自動配置結果を示す図、第3図(a)、 (b
)は第2図の要部を示す平面図および断面図、第4図は
従来の自動設計方法のフローチャートを示す図、第5図
は従来例の自動配置結果を示す図である。
101〜121・・・・・・論理機能セル、201〜2
06・・・・・・半導体基板電位供給セル。
代理人の氏名 弁理士 粟野重孝 ばか1名第
図FIG. 1 is a diagram that does not show flowchart 1 of an automatic design method for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a diagram showing automatic placement results in the same embodiment, and FIGS. b
) are a plan view and a sectional view showing the main parts of FIG. 2, FIG. 4 is a flowchart of the conventional automatic design method, and FIG. 5 is a diagram showing the automatic arrangement result of the conventional example. 101-121...Logic function cells, 201-2
06...Semiconductor substrate potential supply cell. Name of agent: Patent attorney Shigetaka Awano Idiot 1 Figure
Claims (2)
理機能セルを、定められた領域内に複数段に分けて隣接
して配置した後、前記論理機能セルを領域の制限まで分
散させ、分散により生じた空き領域に半導体基板に電位
を供給するセルを自動配置することを特徴とする半導体
装置の自動設計方法。(1) Logic function cells that realize basic logic functions in a defined shape are arranged adjacently in multiple stages within a defined area, and then the logic function cells are distributed to the limit of the area. . A method for automatically designing a semiconductor device, characterized in that cells that supply a potential to a semiconductor substrate are automatically placed in empty areas created by dispersion.
し行なうことで最適化を計った領域であることを特徴と
する特許請求の範囲第1項記載の半導体装置の自動設計
方法。(2) The method for automatically designing a semiconductor device according to claim 1, wherein the determined area is an area that has been optimized by repeatedly arranging logic function cells.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30803288A JPH02154446A (en) | 1988-12-06 | 1988-12-06 | Automated designing of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30803288A JPH02154446A (en) | 1988-12-06 | 1988-12-06 | Automated designing of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02154446A true JPH02154446A (en) | 1990-06-13 |
Family
ID=17976065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30803288A Pending JPH02154446A (en) | 1988-12-06 | 1988-12-06 | Automated designing of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02154446A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0485853A (en) * | 1990-07-26 | 1992-03-18 | Matsushita Electron Corp | Semiconductor integrated circuit device |
WO1999034445A1 (en) * | 1997-12-26 | 1999-07-08 | Hitachi, Ltd. | Semiconductor integrated circuit |
-
1988
- 1988-12-06 JP JP30803288A patent/JPH02154446A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0485853A (en) * | 1990-07-26 | 1992-03-18 | Matsushita Electron Corp | Semiconductor integrated circuit device |
US7321252B2 (en) | 1997-11-21 | 2008-01-22 | Renesas Technology Corporation | Semiconductor integrated circuit |
WO1999034445A1 (en) * | 1997-12-26 | 1999-07-08 | Hitachi, Ltd. | Semiconductor integrated circuit |
US6337593B1 (en) | 1997-12-26 | 2002-01-08 | Hitachi, Ltd. | Semiconductor integrated circuit |
US6483374B1 (en) | 1997-12-26 | 2002-11-19 | Hitachi, Ltd. | Semiconductor integrated circuit |
US6600360B2 (en) | 1997-12-26 | 2003-07-29 | Hitachi, Ltd. | Semiconductor integrated circuit |
US6707334B2 (en) | 1997-12-26 | 2004-03-16 | Hitachi, Ltd. | Semiconductor integrated circuit |
US6987415B2 (en) | 1997-12-26 | 2006-01-17 | Renesas Technology Corporation | Semiconductor integrated circuit |
US7046075B2 (en) | 1997-12-26 | 2006-05-16 | Renesas Technology Corporation | Semiconductor integrated circuit |
US7598796B2 (en) | 1997-12-26 | 2009-10-06 | Renesas Technology Corporation | Semiconductor integrated circuit including charging pump |
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