JPH02154146A - Ultrasonic depth-directional inspection device - Google Patents

Abstract

PURPOSE:To perform efficient inspection at the time of inspecting the depth- directional state of a body by rotating the article by making a depth-directional scan on only detailed measurement points where detailed data are required. CONSTITUTION:The ultrasonic inspection device 20 consists of a probe 22, a Z-directional scanning device 23 which supports and moves a probe 22 in a Z direction, i.e. the depth direction, a rotary driving device 24, an ultrasonic flaw detector 25 which sends transmission pulses to the probe 22 and receives an echo reception signal, a scanning device 23, a driving device 24, and a data processor 26 which controls the flaw detector 25. Further, a measurement result based upon display data from the processor 26 is displayed on a display 27. In this constitution, the driving device 24 is controlled by the processor 26. A work 21 is mounted on a mount base 24a, the rotary driving mechanism 24b rotates the mount base 24a, and a rotational position signal generating circuit 24c generates a rotational angle signal according to the rotation of the mount base 24a and sends it out to the data processor 26. Consequently, the efficient depth-directional inspection is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to an ultra-blind wave depth inspection device, and more specifically, it detects the welding state of a lid portion and a body portion of a cylindrical article in the depth direction. Is there anything you need to know about the welding condition of welded parts that can be inspected in a short period of time? °'1 Regarding the testing device.

[Conventional technology] Super? As a °1 wave measurement method, ultra r゛'1 wave probe r (
In response to the ultrasonic transmission pulse emitted from the probe),
The probe receives the reflected wave from the object to be measured, and the transmitted wave transmitted through the object is received by another probe placed facing the opposite side of the object to be measured. For example, the state of the subject can be determined by placing two transmitting and receiving probes on the same side of the subject and measuring the amount of ultrasound propagated inside the subject. can.

For example, when measuring the nugget diameter of spot welding, a probe unit, which is a split probe that integrates a transmitter and a receiver probe, is applied to the surface of the material to be inspected, and the condition of the material is transmitted. The measurement is carried out using the superconvex wave 61.

- On the other hand, when measuring the welding depth state when a lid part etc. is welded to a cylindrical article (hereinafter referred to as a workpiece), the reflected echo level from the unmolten i1 ffi< The welding condition in the depth direction is measured by this method. For example, when welding a cylindrical workpiece in the circumferential direction, the probe side is set at the welding depth position on the outer periphery of the side surface of the cylinder, which corresponds to the welding depth position, that is, at the welding indoor judgment point. One method is to set the position of the probe so that the ultrasonic waves hit the workpiece, and sample data about the strength of reflected waves (echo level) while rotating the workpiece. There is a method in which data is sampled by scanning sequentially in the horizontal direction.

[Problem to be solved] As described above, when inspecting the 21 welding depth condition of a cylindrical article, the former method of fixing the probe at a predetermined welding depth position does not A single inspection can be done in a relatively short time, and it is easy to check whether welding is done to the installed depth. However, this method does not allow for detailed inspection of the welding state, such as the extent to which the welding state has reached beyond the pass/fail determination point.・
On the other hand, the latter measurement method does not have such drawbacks, but it is possible to sequentially scan from the surface of the article until the distance in the depth direction is covered, and to perform it t4H around the entire circumference. Because it is necessary, it takes too much time to inspect one workpiece, and it is not applicable when inspecting products one by one.

An object of the present invention is to provide an ultra-wave depth direction inspection device that can efficiently inspect the condition of an article in the depth direction by rotating the article.

[Problems to be Solved] The configuration of the ultra-r1 wave depth direction inspection device of the present invention for quickly forming a target is as follows: In an ultra-high-wave depth inspection device that rotates and inspects the condition in the depth direction from the surface from the surrounding side surface, the object to be inspected is stretched around the entire circumference at a predetermined depth. Run to obtain echo reception data and corresponding rotational position data, and then perform 1llll + rotation of a fixed point on the reception data corresponding to conditions that should be measured in more detail in the depth direction based on the obtained echo reception data. The position is determined, and the subject is moved in the depth direction to a measurement point corresponding to the determined rotational position to obtain reception data of echoes of the subject in the depth direction at 1ill fixed points.

[Function] In this way, first measure the subject from the side at a predetermined depth and around the entire circumference, collect the echo transmission data, and based on that, determine if detailed condition data is required. By scanning only the detailed measurement points in the depth direction, articles can be inspected efficiently in a short time.

Furthermore, the amount of data processing required for the obtained measurement data is also small.

[Example] Hereinafter, the drawings for an example of the present invention are shown in -1jj ((
This will be explained in detail.

FIG. 1 is a block diagram mainly showing a data processing device that performs image processing, etc. of a super delta limb inspection device to which the depth direction inspection device of the present invention is applied, and FIG. 3 is a flowchart of the inspection process of the data processing device, and FIG. 4 is a diagram of the measurement waveform. −・Is an explanatory diagram of a smaller example.

In FIG. 2, 20 is a superfluid for inspecting the weld depth. ″i
Wave+il! In the inspection apparatus, reference numeral 21 denotes a circular one-nok serving as an object to be inspected. The workpiece 21 is composed of a circular root-shaped lid portion 21a and a cylindrical main body 21b,
The lid portion 21a and the main body 21b have 11 circumferential welded portions 2.
1c and are welded to each other.

The super-wave inspection device 20 includes a probe 22, a Z-direction scanning device 23 that supports and moves the probe 22 in the Z direction (depth direction), a rotation drive device 24, and a probe 22.
Sends a transmit pulse to the echo receiver and receives the echo signal.
'J-wave flaw detector 25, Z-direction scanning device 23, and rotational drive mechanism 24, ultra? It is composed of a data processing device 26 that controls the η-wave deep wound device 25, and a display 7 that receives the magnitude data from the data processing device 26 and displays the measurement results in numerical values and graphs.

Here, the rotational drive device 24 includes a mounting table 24a, a rotational drive mechanism 24b, a rotational position signal generation circuit 240, etc., and is controlled by a data processing device 26. The workpiece 21 is placed on the mounting table 24a, and the mounting table 240 is rotated by the rotation drive mechanism 24b.
According to the rotation of a, the rotation angle signal zJ is converted into a rotation position signal °
It is generated by the generating circuit 24C and sent to the data processing device 26.

The data processing device 26, as shown in FIG. 1
- Connected to the wave flaw detector 25 via the A/D conversion circuit 2. The ultrasonic flaw detector 25 is composed of a pulser receiver, etc., receives an echo reception signal from a probe 22 connected to the transmission terminal 11 and the reception terminal 12, amplifies it, and converts it into an analog signal to the A/D conversion circuit 2. Output to.

Al1) The conversion circuit 2 converts each analog signal regarding the transmission (:l wave 2 surface reflected wave, reflected wave from an unwelded part (defect reflected wave, reflected wave from a boundary surface, etc.) obtained from the ultrahigh wave flaw detector 25). are sampled at a high frequency, and these analog outputs are converted into digital values and sent to the bus 1 as manual data values that can be processed by a microprocessor (MPU) 5.
Send to 3.

Connected to the bus 13 are a dial-type numerical value setting circuit 3 for inputting gain dials, cursor dials, etc., and a key input circuit 4 having sheet keys. Receives set values and various key manual inputs.

Therefore, when the gain adjustment value for the ultrasonic flaw detector 25 is manually input using the gain dial, the MPU 5 controls the gain (amplification factor) of the high frequency amplifier of the ultrasonic flaw detector 25,
The gain of the high frequency amplifier is set to the gain corresponding to the gain adjustment value input using the gain dial.

Reference numeral 6 denotes a RAM circuit section connected to the bus 13 and configured to read the RAM, in which digital data regarding A/D-converted echo reception signals and various ablication processing programs are stored. 7 is a ROM, which stores basic processing program information for the MPU 5, and the like.

Reference numeral 8 denotes an interface for the Z-direction scanning device 23, which is connected to the bus 13, and the Z-direction scanning device 23 is connected to the interface. 9 is connected to bus 13,
An interface to the rotary drive device 24, to which the rotary drive device 24 is connected, and the rotation position (1j's) received from the position signal/generation circuit 24b of the rotary drive device 24 is transmitted to the MPU 5 via the bus 13. Transfer to.

10 is a display 2 connected to the bus 13.
7, to which a display 27 is connected and various image data are sent to the MPU.
5, the data is transferred to the display 27 via this interface.

Here, the ROM 7 stores various basic processing programs, including a processing program for controlling the rotation drive device 24 and the Z-direction scanning device 23 to determine the rotation angle of the workpiece 21, the height position, etc. of the probe 22. In addition to these, in particular, all J, ', l side determination processing programs 71 are stored.
, a depth direction measurement processing program 72, a failed echo level position detection program 73, and an echo level display processing program 74 are stored.

Next, the welding condition inspection process will be explained according to the flow shown in FIG.

First, a predetermined processing program stored in the ROM 7 is started, the MPU 5 operates, and the gain is set to the dial algebra number 1.
11, the operator (measuring person) inputs measurement conditions and the like using the gain dial of the setting circuit 3 and the keys of the key input circuit 4. As a result, these input information and ROM
The MPU 5 operates according to the processing program stored in the MPU 7, and under its control, the gain of the ultrasonic flaw detector 25 is set according to the gain dial, and the probe 21 is positioned at the weld pass/fail judgment point corresponding to the welding depth. , the flaw detection function of the device itself occurs.

Therefore, by starting the inspection by manually operating a predetermined key, the entire circumference measurement processing program 71 is first started in step (3) in FIG. The transmission pulse signal is sent out, the rotation drive device 24 is driven, and the workpiece 21 starts rotating. As a result, an echo reception signal (flaw detection waveform) corresponding to the echo from the workpiece 21 obtained from the probe 22 in response to the transmission pulse signal sent out from the ultra-t'f wave deep flaw device 25 is obtained, and this echo reception signal Correspondingly, from the position signal generation circuit 24b of the rotary drive device 24,
An angle signal indicating the rotational position is obtained, and these data are obtained over the entire circumference as the workpiece 21 rotates.

The echo received signal was detected by an ultrasonic flaw detector 25°A/1]
It is A/I converted through the conversion circuit 2, and transferred directly to the RAM circuit section 6 via the bus 13, where it is stored together with the signal indicating the rotational position.

In this case, number 45 indicating the rotational position may be assigned to an address in the memory of the RAM circuit section 6, and only the digitized echo reception signals may be sequentially stored at that address.

Here it is! - As a result, the echo data regarding the welding pass/fail judgment point of the digital value as manually determined by the analog waveform of (a) in FIG. 4 is stored in the RAM circuit section 6 in correspondence with the rotation angle data of the workpiece. Ru.

Here, (a) in FIG. 4 shows that the MPU 5 performs image processing on the echo data of the pass/fail determination point according to the echo level display processing program 74 and the entire circumference measurement processing program 71.
Next, the echo level display program 74 is activated, and the echo level is displayed on the display 27 in accordance with the program, with the vertical axis representing the echo level and the horizontal axis representing the rotational position of the workpiece 21.

As you can see in this echo level display image, it's rotating! , it can be seen that the echo is generated at a rotational position of approximately 66 degrees when viewed from the position (0 degrees).

When such circumferential measurement data has been obtained, the next step is to wait for key human power, and in the next step, based on the key human power information, depth direction measurement of the failing point is performed. Make a fortune-telling judgment. In this step ■, the failing score /! is input manually from the key input circuit 4. When t11 is specified, the reject echo level position detecting programmer 73 is activated and detects the angle of the reject point. and stored in a predetermined area of the RAM circuit section 6. It should be noted that if welding is completed for 1t, such echoes will not occur. In addition, areas where strong echoes appear represent unwelded interfaces. Furthermore, there may be multiple locations where such echoes appear strongly.

In the next step (2), the depth direction measurement processing program 72 is started, and the MPU 5 controls the rotary drive device 24 to move the workpiece 21 from the base position so that the failure point coincides with the probe 22. Rotate it 66 degrees and position it.
The MPU 5 controls the Z-direction scanning device 3, and the probe 22 scans the failure points of the workpiece 21 in the depth direction so as to cover the pass/fail determination points in the depth direction from the surface. Then, the scanned data is stored in a predetermined area of the RAM circuit section 6 along with the position data in the depth direction, and is subjected to image processing and transferred to the display 27. The echo image obtained on the display 27 in this case is shown in FIG. 4(b).

In (b), the vertical axis represents the intensity of the echo, and the horizontal axis represents the depth (distance) from the surface. and distance, 12 s
corresponds to the position of the pass/fail judgment point. Further, in this image, it can be seen that an echo is generated at a position λ1 of +]ii from the position λS of the pass/fail determination point. Therefore, the fourth
At the point Jll where the echo level becomes high in (b) of the figure, the welding depth has been reached to a depth of Jll, and beyond that point Jll, the echo level becomes high.
This indicates that no welding has been done.

In this way, the failed program 1. Detailed data on t can be obtained. The process then returns to step ■, and if there are multiple failure points, the processes from step ■ to step ■ are repeated for the multiple failure points to obtain detailed data of the welding condition at each failure point. are sequentially collected and stored in the RAM circuit section 6 and displayed on the display 27.

First, rotate the workpiece 21 as described below, and set the echo level per revolution at rotational position A and No. 1 (
Enter the angle (+T';
1-'11-) is calculated, and the rotary drive device 24 is controlled so that the part of the calculated angle becomes the measurement position. Then, at that position, the Z force scanning device 23 scans the probe 22 in the welding depth direction, inputs the echo level in synchronization with the rotational position signal, and displays the input data on the display 27.

This makes it possible to check the echo level distribution in the welding depth direction in detail from the display 27.

As a result, it is possible to obtain detailed data of only one necessary location in a short time without having to scan the entire circumference in the depth direction. In addition, detailed data of failed points can be obtained from f'J.
By doing so, the distance of insufficient welding can be determined, and products that have been welded close to the failure point can be treated as passed, and some of the rejected products can be saved, thereby increasing the product yield. It can be directed in the opposite direction.

As described above, in the examples, welding is mainly explained, but the joining state is not limited to that by welding, and the measurement target is not only the joining state but also the joining state. , it may also be one that performs measurements exclusively for defects.

In addition, in the example, a cylindrical workpiece is used as an example, but
The workpiece to be inspected is not limited to a cylindrical one. Furthermore, it is of course possible to rotate the probe side of the workpiece as the object without rotating the workpiece side.

[Effects of the Invention] -1-1 In this invention, first, the object to be examined is fixed from the side at a predetermined depth, and echo reception data is obtained. By scanning in the depth direction only at detailed measurement points where detailed condition data is required, it is possible to inspect articles etc. efficiently in a short time. Furthermore, the amount of data processing required for the obtained measurement data is also small.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of a data processing device of an ultrasonic inspection apparatus to which the ultrasonic depth inspection apparatus of the present invention is applied, centering on a 9-minute block, and Fig. 2 is an overall configuration of the ultrasonic inspection apparatus. FIG. 3 is a flowchart of the inspection process of the data processing device, and FIG. 4 is an explanatory diagram showing an example of the measurement waveform. DESCRIPTION OF SYMBOLS 1... Data processing part, 2... A/D conversion circuit, 3.
...Dial type numerical value setting circuit, 4...Key input circuit,
5... Microprocessor (MPU), 6... RA
M circuit section, 7... ROM 18... Z direction scanning device interface, 9... Rotary drive device interface, 10... Display interface, 20...
・Ultrasonic inspection device, 21...Work, 22...Probe, 23...Z
Directional scanning device, 24...Rotary drive device, 25...Super, 57 wave deep wound device, 26...Data processing device, 27...
・Display, 71... Full circumference measurement processing program,
72...Depth direction 6111 constant processing program, 73.
...Failure echo level position detection program, 74...
-Echo level display processing program. Patent applicant II\γ Construction Machinery Co., Ltd.

Claims (1)

[Claims] (1) In an ultrasonic depth inspection device that rotates the object relative to the ultrasonic probe and inspects the condition in the depth direction from the surface from the surrounding side surface, a predetermined depth position is used. Conditions for scanning the entire circumference of the object to obtain echo reception data and rotational position data corresponding thereto, and performing further detailed measurements in the depth direction based on the obtained echo reception data. The rotational position of the measurement point for the received data corresponding to the received data is determined, and the object is scanned in the depth direction for the measurement point corresponding to the obtained rotational position, and the measurement point is determined in the depth direction of the object at the measurement point. An ultrasonic depth direction inspection device characterized by obtaining received data of echoes.