JPH02152037A - Optical disk substrate - Google Patents
Optical disk substrateInfo
- Publication number
- JPH02152037A JPH02152037A JP63306059A JP30605988A JPH02152037A JP H02152037 A JPH02152037 A JP H02152037A JP 63306059 A JP63306059 A JP 63306059A JP 30605988 A JP30605988 A JP 30605988A JP H02152037 A JPH02152037 A JP H02152037A
- Authority
- JP
- Japan
- Prior art keywords
- polyformal
- substrate
- copolymer
- optical
- heat resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 title claims abstract description 14
- 229920001577 copolymer Polymers 0.000 claims abstract description 23
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims 4
- 230000000306 recurrent effect Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 24
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- 229930185605 Bisphenol Natural products 0.000 description 6
- 239000002216 antistatic agent Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 5
- -1 phenyl-4-hydroxyphenyl Chemical group 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- YJUUZFWMKJBVFJ-UHFFFAOYSA-N 1,3-dimethylimidazolidin-4-one Chemical compound CN1CN(C)C(=O)C1 YJUUZFWMKJBVFJ-UHFFFAOYSA-N 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 4
- BKTRENAPTCBBFA-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-phenylphenyl)propan-2-yl]-2-phenylphenol Chemical compound C=1C=C(O)C(C=2C=CC=CC=2)=CC=1C(C)(C)C(C=1)=CC=C(O)C=1C1=CC=CC=C1 BKTRENAPTCBBFA-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 3
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 2
- VQCOOYBPEMJQBN-UHFFFAOYSA-N 4-[1-(4-hydroxy-3-phenylphenyl)cyclohexyl]-2-phenylphenol Chemical compound OC1=CC=C(C2(CCCCC2)C=2C=C(C(O)=CC=2)C=2C=CC=CC=2)C=C1C1=CC=CC=C1 VQCOOYBPEMJQBN-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 1
- WXHVQMGINBSVAY-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 WXHVQMGINBSVAY-UHFFFAOYSA-N 0.000 description 1
- BHIIOLWIZLICII-UHFFFAOYSA-N 2-butyl-5-methylphenol Chemical compound CCCCC1=CC=C(C)C=C1O BHIIOLWIZLICII-UHFFFAOYSA-N 0.000 description 1
- LZHCVNIARUXHAL-UHFFFAOYSA-N 2-tert-butyl-4-ethylphenol Chemical compound CCC1=CC=C(O)C(C(C)(C)C)=C1 LZHCVNIARUXHAL-UHFFFAOYSA-N 0.000 description 1
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 1
- ILQWYZZOCYARGS-UHFFFAOYSA-N 4-(4-hydroxy-3-phenylphenyl)sulfonyl-2-phenylphenol Chemical compound OC1=CC=C(S(=O)(=O)C=2C=C(C(O)=CC=2)C=2C=CC=CC=2)C=C1C1=CC=CC=C1 ILQWYZZOCYARGS-UHFFFAOYSA-N 0.000 description 1
- UXKQNCDDHDBAPD-UHFFFAOYSA-N 4-n,4-n-diphenylbenzene-1,4-diamine Chemical compound C1=CC(N)=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 UXKQNCDDHDBAPD-UHFFFAOYSA-N 0.000 description 1
- CYYZDBDROVLTJU-UHFFFAOYSA-N 4-n-Butylphenol Chemical compound CCCCC1=CC=C(O)C=C1 CYYZDBDROVLTJU-UHFFFAOYSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- 239000004255 Butylated hydroxyanisole Substances 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- 229940043253 butylated hydroxyanisole Drugs 0.000 description 1
- ZPFKRQXYKULZKP-UHFFFAOYSA-N butylidene Chemical group [CH2+]CC[CH-] ZPFKRQXYKULZKP-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、光メモリ−ディスク等に用いられる光ディス
ク基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an optical disk substrate used for optical memory disks and the like.
光ディスク基板は透明性に優れると共に光学的歪みの小
さいものであることが必要とされる。特にデジタル信号
を利用して情報の読み取り又は書き込みを行う光ディス
クにおいては、光学的歪みは実成形品において位相差と
して20nm以下であることが要求される。また光ビー
ムを基板の記縁膜に絞り込むために光ビームは基板中を
斜めに進行する。このとき斜め入射の光ビームは大きな
位相差を示し、これが情報の読み取り又は書き込み時に
エラーを発生する原因となる。Optical disc substrates are required to have excellent transparency and low optical distortion. Particularly in optical discs in which information is read or written using digital signals, optical distortion is required to be 20 nm or less as a phase difference in actual molded products. Further, in order to focus the light beam onto the recording film of the substrate, the light beam travels obliquely through the substrate. At this time, the obliquely incident light beam exhibits a large phase difference, which causes errors when reading or writing information.
従来、光ディスク基板はポリメチルメタクリレートや2
,2−ビス(4−ヒドロキシフェニル)プロパンを原料
とするポリカーボネートなどが用いられている。しかし
ながら、前者は光学的特性には優れているが、耐熱性、
耐湿性、耐衝撃性において十分な性能を有していない。Conventionally, optical disc substrates have been made of polymethyl methacrylate or 2
, polycarbonate made from 2-bis(4-hydroxyphenyl)propane, etc. are used. However, although the former has excellent optical properties, it has poor heat resistance and
Does not have sufficient performance in terms of moisture resistance and impact resistance.
また、後者は、耐熱性、耐湿性、耐衝撃性などにおいて
優れているものの、光学的歪みが大きく、これに起因し
て複屈折が大きくなり、情報の読み取り感度の低下やエ
ラーが発生するという難点がある。In addition, although the latter has excellent heat resistance, moisture resistance, and impact resistance, it has large optical distortion, which increases birefringence and reduces information reading sensitivity and causes errors. There are some difficulties.
スフ基板を提供することを目的とするものである。The purpose is to provide a short circuit board.
本発明者らは前記目的を達成するために鋭意研究を重ね
た結果、芳香核の密度の高い特定構造を有する芳香族ポ
リホルマール共重合体よりなる光ディスク基板により前
記目的が達成されることを見出し、この知見に基づいて
本発明を完成するに至った。As a result of extensive research to achieve the above object, the present inventors have discovered that the above object can be achieved by an optical disc substrate made of an aromatic polyformal copolymer having a specific structure with a high density of aromatic nuclei. Based on this knowledge, the present invention was completed.
すなわち、本発明は下記の式で表される繰り返し単位を
有するポリホルマール共重合体を成形してなる光ディス
ク基板を提供するものである。That is, the present invention provides an optical disc substrate formed by molding a polyformal copolymer having a repeating unit represented by the following formula.
本発明は、耐熱性、耐湿性、耐衝撃性に優れると共に、
流動性に優れた樹脂により成形された、光学的歪み、特
に斜め入射の複屈折が低減された読み取り又は書き込み
時のエラーの少ない光デイCH3C)13
あり、繰り返し単位Iと繰り返し単位■のモル比をp:
qとするとき、(p/ (p+q) ) x 100は
95〜5で、(q/ (p+q))X100は5〜95
である。〕
本発明に用いられるポリホルマール共重合体のジクロロ
メタンを溶媒とする0、5d1/gfi度の20°Cに
おける還元粘度〔ηsp/c )は通常、0.20〜1
.00cU/g、好ましくは0.25〜0.50d/g
である。還元粘度が0.20 a/ g未満では成形品
の機械的強度が十分でなく、1.0Odl/gを超える
と流動性が低下し成形体の光学的強度が低下することが
ある。The present invention has excellent heat resistance, moisture resistance, and impact resistance, and
Optical device molded from resin with excellent fluidity, with reduced optical distortion, especially birefringence at oblique incidence, and fewer errors during reading or writing CH3C) 13), with a molar ratio of repeating unit I to repeating unit ■ p:
When q, (p/ (p+q)) x 100 is 95 to 5, and (q/ (p+q)) x 100 is 5 to 95.
It is. ] The reduced viscosity [η sp/c ) of the polyformal copolymer used in the present invention at 20°C of 0.5 d1/gfi when dichloromethane is used as a solvent is usually 0.20 to 1.
.. 00cU/g, preferably 0.25-0.50d/g
It is. If the reduced viscosity is less than 0.20 a/g, the molded article will not have sufficient mechanical strength, and if it exceeds 1.0 Odl/g, the fluidity may decrease and the optical strength of the molded article may decrease.
繰り返し単位(1)と繰り返し単位(II)の共重合組
成(p/ (p+q))xl 00が95より大きくな
ると、流動性が低く高温での成形が必要となり、成形歪
みが大きくなり、5未満であると耐熱性が低下する。If the copolymer composition of repeating unit (1) and repeating unit (II) (p/ (p+q)) If so, the heat resistance will decrease.
本発明のポリホルマール共重合体は、例えば、4.4′
−ジヒドロキシテトラフェニルメタンと2.2−ビス(
3−フェニル−4−ヒドロキシフェニル)プロパン、■
−フェニルー1.1−ビス(3−フェニル−4−ヒドロ
キシフェニル)エタン、1.1−ビス(3−フェニル−
4−ヒドロキシフェニル)シクロヘキサン、ビス(3−
フェニル−4−ヒドロキシフェニル)スルホンから選ば
れる少なくとも1種以上のビスフェノールとからなる混
合ビスフェノールを原料として、この混合ビスフェノー
ルとメチレンシバライドとを、?各課中で、アルカリ金
属水酸化物の存在下で反応させることによって得ること
ができる。The polyformal copolymer of the present invention is, for example, 4.4'
-dihydroxytetraphenylmethane and 2,2-bis(
3-phenyl-4-hydroxyphenyl)propane, ■
-Phenyl-1,1-bis(3-phenyl-4-hydroxyphenyl)ethane, 1,1-bis(3-phenyl-
4-hydroxyphenyl)cyclohexane, bis(3-
Using a mixed bisphenol consisting of at least one type of bisphenol selected from phenyl-4-hydroxyphenyl) sulfone as a raw material, this mixed bisphenol and methylene cybaride are prepared from ? In each section, it can be obtained by reacting in the presence of an alkali metal hydroxide.
メチレンシバライドとしてはジクロロメタン、ジブロモ
メタン、ショートメタンが用いられるが、好ましくはジ
クロロメタンが用いられる。Dichloromethane, dibromomethane, and short methane are used as methylene cybaride, and dichloromethane is preferably used.
また、アルカリ金属水酸化物としては、水酸化ナトリウ
ム、水酸化カリウム等が用いられる。Further, as the alkali metal hydroxide, sodium hydroxide, potassium hydroxide, etc. are used.
また、溶媒としては、例えばN−メチルピロリドン、N
、N−ジメチルホルムアミド、ジメチルアセトアミド、
ジメチルイミダゾリジノン、スルホラン、ジメチルスル
ホキシドが用いられる。Further, as a solvent, for example, N-methylpyrrolidone, N-methylpyrrolidone,
, N-dimethylformamide, dimethylacetamide,
Dimethylimidazolidinone, sulfolane, and dimethylsulfoxide are used.
各反応物の使用量は、ビスフェノール1に対して重量比
でメチレンシバライドが好ましくは1.05〜5となる
ように、アルカリ金属水酸化物が好ましくは2.1〜3
.0、さらに好ましくは2.2〜2゜8となるように用
いられ、溶媒はビスフェノールの濃度が好ましくは0.
1〜3モル/I!、、さらに好ましくは0.5〜2上2
モルとなるように用いられる。The amount of each reactant to be used is such that the weight ratio of methylene cybaride to 1 of bisphenol is preferably 1.05 to 5, and the alkali metal hydroxide is preferably 2.1 to 3.
.. The concentration of bisphenol in the solvent is preferably 0.0, more preferably 2.2 to 2.8.
1-3 mol/I! , more preferably 0.5 to 2 or above 2
It is used to give moles.
反応は通常20〜150°C2好ましくは50〜100
°Cの温度の範囲で行われる。反応時間は反応温度によ
り左右されるが、通常1〜20時間、好ましくは3〜7
時間である。The reaction is usually carried out at 20-150°C2, preferably at 50-100°C.
It is carried out in the temperature range of °C. The reaction time depends on the reaction temperature, but is usually 1 to 20 hours, preferably 3 to 7 hours.
It's time.
また、反応系にはp−t−ブチルフェノール等の重合度
調節剤を加えて反応を行うこともある。Further, the reaction may be carried out by adding a degree of polymerization regulator such as pt-butylphenol to the reaction system.
本発明においては、前記ポリホルマール共重合体をその
まま成形してもよいが、光学的性質を撰なわない範囲で
、必要に応じ酸化防止剤、′R燃剤、紫外線吸収剤、帯
電防止剤、滑剤など通常ポリホルマールに添加される添
加剤を配合することができる。In the present invention, the polyformal copolymer may be molded as it is, but as long as the optical properties are not affected, antioxidants, 'R' fuel agents, ultraviolet absorbers, antistatic agents, lubricants, etc. may be added as necessary. Additives such as those normally added to polyformal can be added.
使用される酸化防止剤としては、例えば、2゜6−ジー
t−ブチル−p−クレゾール、ブチル化ヒドロキシアニ
ソール、2.6−ジーt−ブチル−4−エチルフェノー
ル、ステアリル−β−(3゜5−ジ−t−ブチル−4−
ヒドロキシフェニル)プロピオネート、2.2′−メチ
レンビス(4−メチル−6−t−ブチルフェノール)、
2.2’メチレン−ビス(4−エチル−6−t−ブチル
フェノール)、4.4’−チオビス(3−メチル−6−
L−ブチルフエノール)、4.4’〜ブチリデンビス(
3−メチル−6−t−ブチルフェノール)、テトラキス
〔メチレン−3−(3’、5−ジ−t−ブチル−4−ヒ
ドロキシフェニル)プロピオネート]メタン、1,1.
3−1−リス(2−メチル−4−ヒドロキシ−5−t−
ブチルフェニル)ブタン等のフェノール系化合物、フェ
ニル−β−ナフチルアミン、N N’ −ジフェニル
−p−フェニレンジアミン等のアミン系化合物、トリス
(ノニルフェニル)ホスファイト、トリフェニルフォス
ファイト、トリオクタデシルフォスファイト、ジフェニ
ルイソデシルフォスファイト等のリン系化合物、ジラウ
リルチオジプロピオネート、シミリスチルチオジプロピ
オネート、ジステアリルチオジプロピオネート等の硫黄
化合物などが挙げられる。Examples of the antioxidants used include 2゜6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-4-ethylphenol, stearyl-β-(3゜5-di-t-butyl-4-
hydroxyphenyl) propionate, 2,2'-methylenebis(4-methyl-6-t-butylphenol),
2.2'methylene-bis(4-ethyl-6-t-butylphenol), 4.4'-thiobis(3-methyl-6-
L-butylphenol), 4.4'~butylidene bis(
3-methyl-6-t-butylphenol), tetrakis[methylene-3-(3',5-di-t-butyl-4-hydroxyphenyl)propionate]methane, 1,1.
3-1-Lis(2-methyl-4-hydroxy-5-t-
phenolic compounds such as butylphenyl)butane, amine compounds such as phenyl-β-naphthylamine, N N'-diphenyl-p-phenylenediamine, tris(nonylphenyl)phosphite, triphenylphosphite, triotadecylphosphite, Examples include phosphorus compounds such as diphenylisodecyl phosphite, sulfur compounds such as dilaurylthiodipropionate, simiristylthiodipropionate, and distearylthiodipropionate.
使用される紫外線吸収剤としては、例えば、フェニルサ
リシレート、p−t−プチルフェニルサリシレート等の
サリチル酸系紫外線吸収剤、2゜4−ジヒドロキシベン
ゾフェノン、2−ヒドロキシ−4−メトキシベンゾフェ
ノン等のベンゾフェノン系紫外線吸収剤、2− (2’
−ヒドロキシ−5′−メチルフェニル)ベンゾトリアゾ
ール、2−(2′−ヒドロキシ−5′−t−ブチルフェ
ニル)ベンゾトリアゾール等のベンゾトリアゾール系紫
外線吸収剤等が挙げられる。Examples of the UV absorbers used include salicylic acid UV absorbers such as phenyl salicylate and pt-butylphenyl salicylate, and benzophenone UV absorbers such as 2°4-dihydroxybenzophenone and 2-hydroxy-4-methoxybenzophenone. agent, 2- (2'
Examples include benzotriazole ultraviolet absorbers such as -hydroxy-5'-methylphenyl)benzotriazole and 2-(2'-hydroxy-5'-t-butylphenyl)benzotriazole.
使用される帯電防止剤としては、例えば、ポリオキシエ
チレンアルキルアミン、ポリオキシエチレンアルキルア
ミド等の非イオン系帯電防止剤、アルキルスルホネート
、アルキルベンゼンスルボネート等のアニオン系帯電防
止剤、第4級アンモニウムクロライド、第4級アンモニ
ウムサルフェート等のカチオン系帯電防止剤、アルキル
ヘタイン型、アルキルイミダシリン型等の両性帯電防止
剤等が挙げられる。Examples of the antistatic agent used include nonionic antistatic agents such as polyoxyethylene alkylamine and polyoxyethylene alkylamide, anionic antistatic agents such as alkyl sulfonate and alkylbenzene sulfonate, and quaternary ammonium chloride. , cationic antistatic agents such as quaternary ammonium sulfate, and amphoteric antistatic agents such as alkyl hetain type and alkylimidacilline type.
ポリホルマール共重合体の成形は、通常260〜400
°C1好ましくは280〜350°Cで行われる。26
0°C未満では、樹脂の溶融が不十分となり、流動性低
下の結果光学的歪みを生じたり、樹脂の充填が不完全と
なり転写性に問題を生ずることがある。また、400°
Cを超える高温では、樹脂の分解により黄変など着色が
生じたり、分子量が低下し、シルバーストリークが発生
したりして、成形品の透明性を損なうことがある。Molding of polyformal copolymer is usually 260 to 400
C1 Preferably carried out at 280-350°C. 26
If the temperature is less than 0°C, the melting of the resin will be insufficient, resulting in decreased fluidity, resulting in optical distortion, or incomplete filling of the resin, which may cause problems in transferability. Also, 400°
At high temperatures exceeding C, the resin may decompose, resulting in yellowing or other discoloration, a decrease in molecular weight, and silver streaks, which may impair the transparency of the molded product.
金型温度は通常80〜140°C1好ましくは100〜
120°Cで行われる。80°C未満では、残留応力の
ために、複屈折が生じやすくなり、また140 ’Cを
超えると成形品が変形することがある。Mold temperature is usually 80 to 140°C, preferably 100 to
Performed at 120°C. If the temperature is less than 80°C, birefringence tends to occur due to residual stress, and if it exceeds 140'C, the molded product may be deformed.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
共重合体はNMRスペクトル分析により、次の繰り返し
単位からなると認められた。The copolymer was found to consist of the following repeating units by NMR spectrum analysis.
実施例1
反応器に4.4′−ジヒドロキシテトラフェニルメタン
845g (2,4mo I)、2.2−ビス(3−フ
ェニル−4−ヒドロキシフェニル)プロパン228g
(0,6mo I)、水酸化ナトリウム316 g (
7,9mo I) 、ジクロロメタン383g(4,5
mol)、溶媒の1,3−ジメチル−4=イミダゾリジ
ノン3.02、及び分子量調節剤のp−t−ブチルフェ
ノール10 g (0,067m。Example 1 845 g of 4,4'-dihydroxytetraphenylmethane (2,4mo I) and 228 g of 2,2-bis(3-phenyl-4-hydroxyphenyl)propane were added to the reactor.
(0,6mo I), 316 g of sodium hydroxide (
7,9mo I), dichloromethane 383g (4,5
mol), 3.02 mol of 1,3-dimethyl-4-imidazolidinone as a solvent, and 10 g (0,067 m) of pt-butylphenol as a molecular weight regulator.
1)を入れ、攪拌下80°Cで6時間反応を行った。1) was added, and the reaction was carried out at 80°C for 6 hours with stirring.
反応終了後、生成物を冷却しジクロロメタン101を加
えて希釈し、0.01規定の塩酸、及び水で洗浄し、有
機層を分離した。これをアセトンにおとしてポリホルマ
ール共重合体を得た。得られたこのポリホルマール共重
合体の還元粘度(ηsp/c)は0.29 di/ g
であった。またガラス転移温度(Tg)は、147.2
°Cであった。溶融時の光弾性係数(Cm)を測定した
結果は、1’、000X 10−” cni/dyne
であった。この溶融時の光弾性係数は樹脂をキャビログ
ラフで溶融紡糸して巻き取り、その際、糸にかかる応力
を横軸に取り、その糸の複屈折を縦軸にとった時の直線
の傾きを指すものである。After the reaction was completed, the product was cooled, diluted with 101 g of dichloromethane, washed with 0.01 N hydrochloric acid and water, and the organic layer was separated. This was converted into acetone to obtain a polyformal copolymer. The reduced viscosity (ηsp/c) of this polyformal copolymer obtained was 0.29 di/g.
Met. In addition, the glass transition temperature (Tg) is 147.2
It was °C. The result of measuring the photoelastic coefficient (Cm) during melting is 1',000X 10-"cni/dyne
Met. This photoelastic coefficient during melting refers to the slope of a straight line when the resin is melt-spun and wound using a cavilograph, and the stress applied to the thread is taken on the horizontal axis and the birefringence of the thread is taken on the vertical axis. It is something.
さらにこのポリホルマール共重合体を340°Cにおい
て射出成形して得た直径130mmの光ディスク基板に
ついて、その中心より60調の位置で垂直及び30°の
斜め入射の複屈折を測定した。Further, for an optical disk substrate having a diameter of 130 mm obtained by injection molding this polyformal copolymer at 340° C., the birefringence at normal incidence and at an oblique incidence of 30° was measured at a position 60 degrees from the center.
この複屈折の値は、垂直−10nm、斜め入射+25r
+m(ダブルパルス)であった。また透湿度、吸水率、
及び鉛筆硬度とともに、これらの結果はまとめて表1に
示した。The value of this birefringence is -10 nm perpendicular, +25 r at oblique incidence.
+m (double pulse). In addition, moisture permeability, water absorption rate,
These results are summarized in Table 1 together with the hardness and pencil hardness.
実施例2
反応器に4.4′−ジヒドロキシテトラフェニルメタン
634g (1,8mol)、2.2−ビス(3−フェ
ニル−4−ヒドロキシフェニル)プロパン456 g
(1,2mo 1) 、水酸化ナトリウム316 g
(7,9mo 1) 、ジクロロメタン383g(4,
5mol)、溶媒の1.3−ジメチル−4−イミダゾリ
ジノン3.01、及び分子tt1節剤のp−t−ブチル
フェノール10 g (0,067m。Example 2 634 g (1,8 mol) of 4,4'-dihydroxytetraphenylmethane and 456 g of 2,2-bis(3-phenyl-4-hydroxyphenyl)propane were added to the reactor.
(1,2mo 1), 316 g of sodium hydroxide
(7,9mo 1), dichloromethane 383g (4,
5 mol), 1,3-dimethyl-4-imidazolidinone 3.01 as a solvent, and 10 g (0,067 m) of pt-butylphenol as a molecular tt1 moderator.
l)を入れ、実施例1と同様の手法で重合及び後処理を
行った。得られたポリホルマール共重合体はNMRスペ
クトル分析により、次の繰り返し単位からなると認めら
れた。1), and polymerization and post-treatment were carried out in the same manner as in Example 1. The resulting polyformal copolymer was found to consist of the following repeating units by NMR spectrum analysis.
このポリホルマール共重合体の還元粘度〔ηsp/c)
は0.30d17gであった。またこのポリホルマール
共重合体の光学的性質、耐熱性などの物性値は表1に示
す通りである。Reduced viscosity of this polyformal copolymer [ηsp/c]
was 0.30d17g. Further, physical properties such as optical properties and heat resistance of this polyformal copolymer are shown in Table 1.
実施例3
反応器に4.4′−ジヒドロキシテトラフェニルメタン
422g (1,2mo 1)、1.1−ビス(3−フ
ェニル−4−ヒドロキシフェニル)シクロヘキサン77
8 g (1,8mo 1) 、水酸化ナトリウム31
6 g (7,9mo 1) 、ジクロロメタン383
g (4,5mo 1) 、溶媒の1.3−ジメチル
−4〜イミダゾリジノン3.01及び分子量調加削であ
るp−t−ブチルフェノール10g(0゜067mol
)を入れ、実施例1と同様の手法で重合及び後処理を行
った。得られたポリホルマール共重合体はNMRスペク
トル分析により、次の繰り返し単位からなると認められ
た。Example 3 422 g (1,2 mo 1) of 4,4'-dihydroxytetraphenylmethane and 77 g of 1,1-bis(3-phenyl-4-hydroxyphenyl)cyclohexane were placed in a reactor.
8 g (1,8 mo 1), sodium hydroxide 31
6 g (7,9 mo 1), dichloromethane 383
g (4,5 mo 1), the solvent 1,3-dimethyl-4-imidazolidinone 3.01, and the molecular weight adjustment pt-butylphenol 10 g (0°067 mol
), and polymerization and post-treatment were performed in the same manner as in Example 1. The resulting polyformal copolymer was found to consist of the following repeating units by NMR spectrum analysis.
−1,1−ビス(3−フェニル−4−ヒドロキシフェニ
ル)エタン1061g (2,4mol)、水酸化ナト
リウム316g (7,9mol)、ジクロロメタン3
83 g (4,5mo 1) 、溶媒の1.3−ジメ
チル−4−イミダゾリジノン3.02、及び分子量調節
剤であるp−t−ブチルフェノール10 g (0,0
67mo l)を入れ、実施例1と同様の手法で重合及
び後処理を行った。得られたポリホルマール共重合体は
NMRスペクトル分析により、次の繰り返し単位からな
ると認められた。-1,1-bis(3-phenyl-4-hydroxyphenyl)ethane 1061g (2.4mol), sodium hydroxide 316g (7.9mol), dichloromethane 3
83 g (4,5 mo 1), 1,3-dimethyl-4-imidazolidinone 3.02 as a solvent, and 10 g (0,0
67 mol), and polymerization and post-treatment were performed in the same manner as in Example 1. The resulting polyformal copolymer was found to consist of the following repeating units by NMR spectrum analysis.
このポリホルマール共重合体の還元粘度〔ηsp/c)
は0.33dl/gであった。またこのポリホルマール
共重合体の光学的性質、耐熱性などの物性値は表1に示
す通りである。Reduced viscosity of this polyformal copolymer [ηsp/c]
was 0.33 dl/g. Further, physical properties such as optical properties and heat resistance of this polyformal copolymer are shown in Table 1.
実施例4
反応器に4.4′−ジヒドロキシテトラフェニルメタン
211 g (0,6mo 1)、1−フェニルこのポ
リホルマール共重合体の還元粘度〔ηsp/c)は0.
30clf/gであった。またこのポリホルマール共重
合体の光学的性質、耐熱性などの物性値は表1に示す通
りである。Example 4 211 g (0.6 mo 1) of 4,4'-dihydroxytetraphenylmethane and 1-phenyl were placed in a reactor. The reduced viscosity of this polyformal copolymer [ηsp/c] was 0.
It was 30clf/g. Further, physical properties such as optical properties and heat resistance of this polyformal copolymer are shown in Table 1.
実施例5
反応器に4,4′−ジヒドロキシテトラフェニルメタン
528g (1,5mo I)、ビス(3−フェニル−
4−ヒドロキシフェニル)スルホン603g(1,5m
of)、水酸化ナトリウム316g(7,9mol)、
ジブロモメタン782g(4,5mol)、溶媒の1.
3−ジメチル−4−イミダゾリジノン3.0!!、、及
び分子量調節剤であるp −L−ブチルフェノール10
g (0,067mo 1)を入れ、実施例1と同様
の手法で重合及び後処理を行った。得られた重合体はN
MRスペクトル分析により、次の繰り返し単位からなる
と認められた。Example 5 528 g (1,5 mo I) of 4,4'-dihydroxytetraphenylmethane, bis(3-phenyl-
4-hydroxyphenyl) sulfone 603g (1,5m
of), 316 g (7.9 mol) of sodium hydroxide,
782 g (4.5 mol) of dibromomethane, 1.
3-dimethyl-4-imidazolidinone 3.0! ! , , and the molecular weight regulator p-L-butylphenol 10
g (0,067 mo 1) was added, and polymerization and post-treatment were performed in the same manner as in Example 1. The obtained polymer is N
According to MR spectrum analysis, it was found to consist of the following repeating units.
このポリホルマール樹脂の光学的性質、耐熱性などの物
性値は表1に示す通りである。Physical properties such as optical properties and heat resistance of this polyformal resin are shown in Table 1.
比較例1
比較のための樹脂として、ビスフェノール人を原料とす
る市販のポリカーボネート樹脂を実施例1と同様にして
光学的性質、耐熱性などの物性値を測定し表1に示した
。Comparative Example 1 As a comparative resin, a commercially available polycarbonate resin made from bisphenol was measured in the same manner as in Example 1, and its physical properties such as optical properties and heat resistance were measured and are shown in Table 1.
このB15A−PCの還元粘度(ηsp/c)は0゜3
8a/gであった。The reduced viscosity (ηsp/c) of this B15A-PC is 0°3
It was 8a/g.
比較例2
比較のための樹脂として、市販のポリメチルメタフリレ
ートを実施例1と同様にして光学的性質、耐熱性などの
物性値を測定し表1に示した。Comparative Example 2 As a resin for comparison, commercially available polymethyl methacrylate was used in the same manner as in Example 1, and its physical properties such as optical properties and heat resistance were measured and are shown in Table 1.
〔発明の効果]
本発明によれば、良好な耐熱性、耐湿性、耐衝撃性を有
するのみならず、光学的歪み、特に斜め入射の複屈折が
低減された、読み取り又は書き込み時のエラーの少ない
光ディスク基板が得られる。[Effects of the Invention] The present invention not only has good heat resistance, moisture resistance, and impact resistance, but also reduces optical distortion, especially birefringence at oblique incidence, and prevents errors during reading or writing. Fewer optical disk substrates can be obtained.
Claims (1)
マール共重合体を成形してなる光ディスク基板。 ▲数式、化学式、表等があります▼〔 I 〕 ▲数式、化学式、表等があります▼〔II〕 〔式中、Xは▲数式、化学式、表等があります▼▲数式
、化学式、表等があります▼、▲数式、化学式、表等が
あります▼又は−SO_2−であり、繰り返し単位 I
と繰り返し単位IIのモル比をp:qとするとき、〔p/
(p+q)〕×100は95〜5で、〔q/(p+q)
〕×100は5〜95である。〕[Claims] 1. An optical disc substrate formed by molding a polyformal copolymer having a repeating unit represented by the following formula. ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [ I ] ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [ II ] [In the formula, X is ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ There are ▼, ▲There are mathematical formulas, chemical formulas, tables, etc.▼ or -SO_2-, repeating unit I
When the molar ratio of repeating unit II is p:q, [p/
(p+q)]×100 is 95-5, [q/(p+q)
]×100 is 5 to 95. ]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63306059A JPH02152037A (en) | 1988-12-05 | 1988-12-05 | Optical disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63306059A JPH02152037A (en) | 1988-12-05 | 1988-12-05 | Optical disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02152037A true JPH02152037A (en) | 1990-06-12 |
Family
ID=17952554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63306059A Pending JPH02152037A (en) | 1988-12-05 | 1988-12-05 | Optical disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02152037A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6163513A (en) * | 1997-04-25 | 2000-12-19 | Nec Corporation | Track servo control apparatus for optical disk |
-
1988
- 1988-12-05 JP JP63306059A patent/JPH02152037A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6163513A (en) * | 1997-04-25 | 2000-12-19 | Nec Corporation | Track servo control apparatus for optical disk |
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