JPH02150209U - - Google Patents
Info
- Publication number
- JPH02150209U JPH02150209U JP5933889U JP5933889U JPH02150209U JP H02150209 U JPH02150209 U JP H02150209U JP 5933889 U JP5933889 U JP 5933889U JP 5933889 U JP5933889 U JP 5933889U JP H02150209 U JPH02150209 U JP H02150209U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- substrate
- dividing
- grooves
- presser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 6
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5933889U JPH0541554Y2 (en, 2012) | 1989-05-23 | 1989-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5933889U JPH0541554Y2 (en, 2012) | 1989-05-23 | 1989-05-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02150209U true JPH02150209U (en, 2012) | 1990-12-25 |
| JPH0541554Y2 JPH0541554Y2 (en, 2012) | 1993-10-20 |
Family
ID=31585748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5933889U Expired - Lifetime JPH0541554Y2 (en, 2012) | 1989-05-23 | 1989-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0541554Y2 (en, 2012) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011152702A (ja) * | 2010-01-27 | 2011-08-11 | Kyocera Corp | 基板分割装置および基板分割方法 |
| JP2012124300A (ja) * | 2010-12-08 | 2012-06-28 | Tokyo Seimitsu Co Ltd | ウェーハ破断方法およびウェーハ破断装置 |
-
1989
- 1989-05-23 JP JP5933889U patent/JPH0541554Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011152702A (ja) * | 2010-01-27 | 2011-08-11 | Kyocera Corp | 基板分割装置および基板分割方法 |
| JP2012124300A (ja) * | 2010-12-08 | 2012-06-28 | Tokyo Seimitsu Co Ltd | ウェーハ破断方法およびウェーハ破断装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0541554Y2 (en, 2012) | 1993-10-20 |