JPH02148800A - Method and apparatus for securing of electronic component - Google Patents

Abstract

PURPOSE:To secure an electronic component to a board without increasing a mounting impossible region by inserting the component having a rectangular sectional shape of a lead into the board, and then rotating the lead in a holding state by the chuck of an electronic component securing device. CONSTITUTION:The leads of an inserted electronic component 2 are held by chuck pawls 4, a frame 6 is raised by a cylinder 7, the interval of rollers 8 is broadened, and the upper ends of the chucks 4 are closed to hold the leads. Then, when a cylinder 15 is driven, a rack 14 is moved in a direction of an arrow (a), a housing 13 is rotated, and the pawls 4 are rotated in a lead holding state. Thus, the component 2 is secured to a board by twisting the leads. Accordingly, the component can be secured in a state not interfering with other component without increasing its mounting impossible region.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component fixing method for fixing an electronic component inserted into a board to the board, and an apparatus therefor.

(Prior Art) Recently, with the aim of improving the automation rate, there has been a trend toward automatic mounting of electronic components such as volumes and IFT coils whose lead wires have a rectangular cross-sectional shape. The problem of fixing these electronic components to the board has been solved by bending the lead wires of the inserted electronic components.

FIG. 7 shows an example of an electronic component in which the cross-sectional shape of the lead wire is rectangular. In the same figure.

21 is an IFT coil, and 22 is a trimmer capacitor. This type of electronic component fixing method had a configuration shown in FIG. In other words, the lead wire of the electronic component 23 is connected to the board 2.
4, the clincher 25 is fixed by bending the lead wire of the electronic component 23;
It had a drive means 26 for moving 25.

(Problem M to be solved by the invention) However, under such a configuration, when electronic components are mounted on both sides of the board, a clincher is used as shown in FIG.
There are drawbacks such as an increase in the unmountable area due to the movement of the lead wire 25, and interference with other electronic components due to the bending of the lead wire. A solution to this problem is to fix the electronic components by cutting and bending the lead wires, but this has the drawback of increasing costs in terms of productivity for mounting the electronic components.

It is an object of the present invention to eliminate the conventional drawbacks, to prevent the unmountable area from increasing even when the cross-sectional shape of the lead wire of an electronic component is rectangular, and to prevent interference with other electronic components from occurring. An object of the present invention is to provide an electronic component fixing method and an apparatus for fixing an electronic component to a substrate.

(Means for Solving the Problems) The method and device for fixing an electronic component of the present invention is a method of fixing a lead wire of an electronic component whose cross-sectional shape is rectangular after inserting it into a board. A first step of inserting the electronic component into the board, a second step of holding the lead wire of the inserted electronic component, and a second step of rotating the lead wire holder around the central axis of the lead wire while holding the lead wire. It consists of three steps and a fourth step of releasing the holding of the wires 1 to 1.

In addition, after inserting an electronic component whose lead wire has a rectangular cross-sectional shape into a board, there is a lead wire holder that can hold the lead wire of the electronic component, and a lead wire holder that can hold the lead wire. It is provided with a rotation means for rotating around a central axis.

(Function) With the above-described configuration, the present invention allows the lead wire of an electronic component whose cross-sectional shape is rectangular to be inserted into a double-sided mounting board without increasing the unmountable area, and without increasing the area where other electronic components can be mounted. Electronic components can be fixed to a board in a state where interference with the components is unlikely to occur.

(Example) An example of the present invention will be described based on FIGS. 1 to 6.

FIG. 1 is a sectional view showing an outline of the electronic component fixing device of the present invention. In the figure, an electronic component 2 is inserted into a board 3 by an insertion device 1. Reference numeral 4 designates a pair of chuck claws that hold the lead wires of the inserted electronic component 2, and are rotatable about a pin 5 as a fulcrum. The frame 6 is fixed to a cylinder 7 and transmits driving force to the chuck jaws 4 through rollers 8. 9 is a spring for lowering the frame 6, and 10 is a spring for opening the chuck claws 4.

Reference numeral 11 denotes a frame that supports the unit and moves up and down with respect to the base 12. (However, the means for vertically driving the unit is not shown.) 13 is a housing to which the chuck claw 4 is attached. The rack 14 is fixed to the cylinder 15 and is slidable. Rack 14 is housing 1
3, the housing 1
Rotate 3.

Next, the operation will be explained.

FIG. 1 shows a state in which an electronic component 2 is inserted into a board 3 by an insertion device 1. As shown in FIG. FIG. 2 is a sectional view taken along line A- in FIG. 1. FIG. 3 shows a state in which the lead wire of the inserted electronic component 2 is held by the chuck claws 4.

As the cylinder 7, which is the driving means, rises, the frame 6 rises, the distance between the rollers 8 increases, and the pin 5
The Tosa end of the chuck jaw 4 closes using the fulcrum as a fulcrum to hold the lead wire. While holding the lead wire of electronic component 2,
When the cylinder 15 is driven, the rack 14 moves in the direction of arrow a, the housings 13 rotate through the pinions in the housing 13, and the housing 13 rotates with the chuck claw 4 holding the lead wire, and accordingly The chuck jaws 4 also rotate. Figure 4 shows the state after rotation.

FIG. 5 shows the state of the rack after rotation. FIG. 6 shows a state in which the entire unit is lowered while the lead wire is held and rotated by the rotating means, and the chuck claws 4 are released from the lead wire.

As described above, according to this embodiment, by providing a lead wire holder capable of holding the lead wire of an electronic component and a rotating means for rotating the holder with respect to the central axis of the lead wire, the electronic component can be It is fixed to the board by the lead wire screw.

(Effects of the Invention) According to the present invention, after an electronic component whose lead wire has a rectangular cross-sectional shape is inserted into a board, a lead wire holding portion capable of holding the lead wire of the electronic component and a lead wire holding portion that can hold the lead wire By providing a rotation means for rotating the lead wire holding section around the center axis of the lead wire in the state of The electronic component can be fixed to the board without increasing the amount of noise and in a state where interference with other electronic components is less likely to occur, which has a great practical effect.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of an electronic component fixing device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1, and FIG.
The figure is a sectional view showing the state in which the lead wire of the electronic component shown in FIG. 1 is held, FIG. 4 is a sectional view showing the state in which the lead wire of the electronic component shown in FIG. Fig. 4 is a sectional view taken along line B-B, Fig. 6 is a sectional view showing the state in which the lead wire of the electronic component shown in Fig. 4 is held and released from the rotated state, and Fig. 7 is the cross-sectional shape of the lead wire. is a perspective view showing an example of a rectangular electronic component, FIG. 8 is a cross-sectional view showing interference with other electronic components caused by bending an inserted electronic component using conventional technology, and FIG. 9 is a conventional electronic component. FIG. 3 is a schematic cross-sectional view of the fixing device. 1... Insertion device, 2... Electronic component, 3...
Board, 4... Chuck hole, 5... Fulcrum bottle,
6.11...Frame, 7.15...Cylinder,
8...Roller, 9...Compression spring, 10
...Tension spring, 12...Base, 13...Housing, 14...Rack. Patent applicant Matsushita Electric Industrial Co., Ltd. Figure 1 Figure 2 Figure 5 Figure 3 Figure 6 Figure 4

Claims (2)

[Claims] (1) A method in which an electronic component whose lead wire has a rectangular cross section is inserted into a board and then fixed, the first step being inserting the electronic component into the board, and holding the inserted lead wire of the electronic component. a second step of rotating the lead wire holding section around the central axis of the lead wire while holding the lead wire; and a fourth step of releasing the holding of the lead wire. A method for fixing electronic components, characterized by: (2) After inserting an electronic component whose lead wire has a rectangular cross-sectional shape into a board, a lead wire holder that can hold the lead wire of the electronic component, and a lead wire holder that can hold the lead wire of the electronic component; An electronic component fixing device characterized by being provided with a rotation means for rotating a lead wire around a central axis thereof.