JPH02148406U - - Google Patents
Info
- Publication number
- JPH02148406U JPH02148406U JP5936789U JP5936789U JPH02148406U JP H02148406 U JPH02148406 U JP H02148406U JP 5936789 U JP5936789 U JP 5936789U JP 5936789 U JP5936789 U JP 5936789U JP H02148406 U JPH02148406 U JP H02148406U
- Authority
- JP
- Japan
- Prior art keywords
- photodetector
- intensity
- light
- laser interference
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
Description
第１図はこの考案の一実施例によるレーザ干渉
式デポレートモニタを示す図、第２図は従来のレ
ーザ干渉式デポレートモニタを示す図である。図
において、１……レーザ光源、２……ビームスプ
リツタプリズム、３，３ａ，３ｂ……光検出器（
素子）、４……信号処理器、５……薄膜基板、６
……この考案による回転円板。なお、図中同一符
号は同一、又は相当部分を示す。
FIG. 1 is a diagram showing a laser interference type deposit monitor according to an embodiment of this invention, and FIG. 2 is a diagram showing a conventional laser interference type deposit monitor. In the figure, 1... laser light source, 2... beam splitter prism, 3, 3a, 3b... photodetector (
element), 4... Signal processor, 5... Thin film substrate, 6
...A rotating disk based on this idea. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
学手段、光検出器の出力信号から膜厚を算定する
信号処理器を備えたレーザ干渉式デポレートモニ
タにおいて、全反射ミラー及びビームスルーホー
ルから成る光路切換手段を設け、入射光強度及び
反射光強度検出を１つの光検出器で構成したこと
を特徴とするレーザ干渉式デポレートモニタ。 In a laser interference deposition monitor equipped with an optical means for guiding the beam light from a laser light source to a thin film substrate and a signal processor that calculates the film thickness from the output signal of a photodetector, an optical path consisting of a total reflection mirror and a beam through hole is used. A laser interference type deposit monitor characterized in that a switching means is provided and one photodetector is used to detect the intensity of incident light and the intensity of reflected light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5936789U JPH0714804Y2 (en) | 1989-05-22 | 1989-05-22 | Laser interference type deposition monitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5936789U JPH0714804Y2 (en) | 1989-05-22 | 1989-05-22 | Laser interference type deposition monitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02148406U true JPH02148406U (en) | 1990-12-17 |
| JPH0714804Y2 JPH0714804Y2 (en) | 1995-04-10 |
Family
ID=31585800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5936789U Expired - Lifetime JPH0714804Y2 (en) | 1989-05-22 | 1989-05-22 | Laser interference type deposition monitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0714804Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002277218A (en) * | 2001-03-22 | 2002-09-25 | Sharp Corp | Film thickness measuring device and method thereof |
| WO2012141090A1 (en) * | 2011-04-11 | 2012-10-18 | 東京エレクトロン株式会社 | Process monitor apparatus used in substrate processing apparatus, process monitor method, and substrate processing apparatus |
-
1989
- 1989-05-22 JP JP5936789U patent/JPH0714804Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002277218A (en) * | 2001-03-22 | 2002-09-25 | Sharp Corp | Film thickness measuring device and method thereof |
| WO2012141090A1 (en) * | 2011-04-11 | 2012-10-18 | 東京エレクトロン株式会社 | Process monitor apparatus used in substrate processing apparatus, process monitor method, and substrate processing apparatus |
| JP2012220359A (en) * | 2011-04-11 | 2012-11-12 | Tokyo Electron Ltd | Process monitoring device used for substrate processing apparatus, process monitoring method, and substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0714804Y2 (en) | 1995-04-10 |
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