JPH0214750U - - Google Patents
Info
- Publication number
- JPH0214750U JPH0214750U JP9308588U JP9308588U JPH0214750U JP H0214750 U JPH0214750 U JP H0214750U JP 9308588 U JP9308588 U JP 9308588U JP 9308588 U JP9308588 U JP 9308588U JP H0214750 U JPH0214750 U JP H0214750U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- metal wire
- protective element
- leads
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Emergency Protection Circuit Devices (AREA)
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988093085U JPH0433630Y2 (enEXAMPLES) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988093085U JPH0433630Y2 (enEXAMPLES) | 1988-07-15 | 1988-07-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0214750U true JPH0214750U (enEXAMPLES) | 1990-01-30 |
| JPH0433630Y2 JPH0433630Y2 (enEXAMPLES) | 1992-08-12 |
Family
ID=31317535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988093085U Expired JPH0433630Y2 (enEXAMPLES) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0433630Y2 (enEXAMPLES) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018097986A (ja) * | 2016-12-09 | 2018-06-21 | 矢崎総業株式会社 | 導体ユニットの固定構造 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5958734A (ja) * | 1982-09-27 | 1984-04-04 | 松下電器産業株式会社 | チツプ型ヒユ−ズおよびその製造法 |
| JPS59141648U (ja) * | 1983-03-14 | 1984-09-21 | ロ−ム株式会社 | 半導体装置用保護素子 |
-
1988
- 1988-07-15 JP JP1988093085U patent/JPH0433630Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5958734A (ja) * | 1982-09-27 | 1984-04-04 | 松下電器産業株式会社 | チツプ型ヒユ−ズおよびその製造法 |
| JPS59141648U (ja) * | 1983-03-14 | 1984-09-21 | ロ−ム株式会社 | 半導体装置用保護素子 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018097986A (ja) * | 2016-12-09 | 2018-06-21 | 矢崎総業株式会社 | 導体ユニットの固定構造 |
| US10158204B2 (en) | 2016-12-09 | 2018-12-18 | Yazaki Corporation | Fixing structure of conductor unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0433630Y2 (enEXAMPLES) | 1992-08-12 |