JPH02146843U - - Google Patents
Info
- Publication number
- JPH02146843U JPH02146843U JP5303389U JP5303389U JPH02146843U JP H02146843 U JPH02146843 U JP H02146843U JP 5303389 U JP5303389 U JP 5303389U JP 5303389 U JP5303389 U JP 5303389U JP H02146843 U JPH02146843 U JP H02146843U
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- heating element
- housing
- mounting member
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5303389U JPH02146843U (da) | 1989-05-10 | 1989-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5303389U JPH02146843U (da) | 1989-05-10 | 1989-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146843U true JPH02146843U (da) | 1990-12-13 |
Family
ID=31573862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5303389U Pending JPH02146843U (da) | 1989-05-10 | 1989-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146843U (da) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037228A (ja) * | 2001-07-25 | 2003-02-07 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2017022296A (ja) * | 2015-07-14 | 2017-01-26 | 千代田インテグレ株式会社 | 熱伝導部材 |
-
1989
- 1989-05-10 JP JP5303389U patent/JPH02146843U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037228A (ja) * | 2001-07-25 | 2003-02-07 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP4503887B2 (ja) * | 2001-07-25 | 2010-07-14 | 三菱電機株式会社 | 半導体装置の製造方法 |
| JP2017022296A (ja) * | 2015-07-14 | 2017-01-26 | 千代田インテグレ株式会社 | 熱伝導部材 |