JPH02146471U - - Google Patents
Info
- Publication number
- JPH02146471U JPH02146471U JP5512489U JP5512489U JPH02146471U JP H02146471 U JPH02146471 U JP H02146471U JP 5512489 U JP5512489 U JP 5512489U JP 5512489 U JP5512489 U JP 5512489U JP H02146471 U JPH02146471 U JP H02146471U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- copper foil
- component mounting
- mounting board
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5512489U JPH02146471U (es) | 1989-05-12 | 1989-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5512489U JPH02146471U (es) | 1989-05-12 | 1989-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146471U true JPH02146471U (es) | 1990-12-12 |
Family
ID=31577798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5512489U Pending JPH02146471U (es) | 1989-05-12 | 1989-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146471U (es) |
-
1989
- 1989-05-12 JP JP5512489U patent/JPH02146471U/ja active Pending