JPH02146450U - - Google Patents
Info
- Publication number
- JPH02146450U JPH02146450U JP1989055274U JP5527489U JPH02146450U JP H02146450 U JPH02146450 U JP H02146450U JP 1989055274 U JP1989055274 U JP 1989055274U JP 5527489 U JP5527489 U JP 5527489U JP H02146450 U JPH02146450 U JP H02146450U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bonded
- central region
- heat spreader
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055274U JPH02146450U (zh) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055274U JPH02146450U (zh) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146450U true JPH02146450U (zh) | 1990-12-12 |
Family
ID=31578077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989055274U Pending JPH02146450U (zh) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146450U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018510499A (ja) * | 2015-02-05 | 2018-04-12 | トゥー‐シックス・インコーポレイテッド | ダイヤモンドと金属又は金属合金との交互パターンを有する複合基板 |
-
1989
- 1989-05-16 JP JP1989055274U patent/JPH02146450U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018510499A (ja) * | 2015-02-05 | 2018-04-12 | トゥー‐シックス・インコーポレイテッド | ダイヤモンドと金属又は金属合金との交互パターンを有する複合基板 |