JPH02146434U - - Google Patents

Info

Publication number
JPH02146434U
JPH02146434U JP1989055906U JP5590689U JPH02146434U JP H02146434 U JPH02146434 U JP H02146434U JP 1989055906 U JP1989055906 U JP 1989055906U JP 5590689 U JP5590689 U JP 5590689U JP H02146434 U JPH02146434 U JP H02146434U
Authority
JP
Japan
Prior art keywords
adhesive
pin body
plate
fixed
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989055906U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989055906U priority Critical patent/JPH02146434U/ja
Publication of JPH02146434U publication Critical patent/JPH02146434U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第1図a,bは本考案の一実施例を示す正面図
及び側面図、第2図は第1図に示すピン本体の部
分的な拡大断面図、第3図a,bは従来の一例を
示す正面図及び側面図である。 1……ピン本体、2……スキージ、3……接着
剤、4……皿、5……アクチユエータ、6……ベ
ース、7……駆動源、8……バルブ、9……エア
チユーブ、10……被転写物、11……ブロツク
、12……穴、21……ピン、22……スキージ
、23……接着剤、24……皿、25……アクチ
ユエータ、26……ベース、27……駆動源、2
8……被転写物。

Claims (1)

    【実用新案登録請求の範囲】
  1. 中空で片側が閉じておりかつ側面に穴を有する
    円柱形のピン本体と、前記ピン本体の先端内部に
    接続固定されかつ先端が平面でありかつ多孔質材
    でできているブロツクと、圧縮空気の送付をON
    /OFFするバルブと、前記ピン本体の側面の穴
    と前記バルブとを継ぐエアチユーブと、接着剤を
    供給する丸形凹状の皿と、前記皿に接続されかつ
    本体がベースに固定された回転駆動用のアクチユ
    エータと、前記皿の内側底面より一定のすき間を
    あけて前記ベースに固定されたスキージと、前記
    ピン本体を取り付け固定しかつ前記接着剤の供給
    された前記皿と前記接着剤を転写する被転写物と
    の間をX方向とZ方向に駆動する駆動源とを含む
    ことを特徴とする接着剤転写機構。
JP1989055906U 1989-05-15 1989-05-15 Pending JPH02146434U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989055906U JPH02146434U (ja) 1989-05-15 1989-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989055906U JPH02146434U (ja) 1989-05-15 1989-05-15

Publications (1)

Publication Number Publication Date
JPH02146434U true JPH02146434U (ja) 1990-12-12

Family

ID=31579269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989055906U Pending JPH02146434U (ja) 1989-05-15 1989-05-15

Country Status (1)

Country Link
JP (1) JPH02146434U (ja)

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