JPH02142569U - - Google Patents
Info
- Publication number
- JPH02142569U JPH02142569U JP5019789U JP5019789U JPH02142569U JP H02142569 U JPH02142569 U JP H02142569U JP 5019789 U JP5019789 U JP 5019789U JP 5019789 U JP5019789 U JP 5019789U JP H02142569 U JPH02142569 U JP H02142569U
- Authority
- JP
- Japan
- Prior art keywords
- insulating tape
- leads
- tip
- dummy
- dummy lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989050197U JPH0749795Y2 (ja) | 1989-05-01 | 1989-05-01 | キャリアテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989050197U JPH0749795Y2 (ja) | 1989-05-01 | 1989-05-01 | キャリアテープ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02142569U true JPH02142569U (en:Method) | 1990-12-04 |
| JPH0749795Y2 JPH0749795Y2 (ja) | 1995-11-13 |
Family
ID=31568540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989050197U Expired - Lifetime JPH0749795Y2 (ja) | 1989-05-01 | 1989-05-01 | キャリアテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749795Y2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05144889A (ja) * | 1991-11-20 | 1993-06-11 | Fujitsu Ltd | 半導体チツプ搭載フイルムの接続方法 |
| JP2006019450A (ja) * | 2004-06-30 | 2006-01-19 | Sumitomo Metal Micro Devices Inc | 回路基板及び実装後基板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5678569U (en:Method) * | 1979-11-20 | 1981-06-25 | ||
| JPS6169161A (ja) * | 1984-09-12 | 1986-04-09 | Matsushita Electric Ind Co Ltd | フイルムリ−ド |
| JPS6232551U (en:Method) * | 1985-08-13 | 1987-02-26 |
-
1989
- 1989-05-01 JP JP1989050197U patent/JPH0749795Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5678569U (en:Method) * | 1979-11-20 | 1981-06-25 | ||
| JPS6169161A (ja) * | 1984-09-12 | 1986-04-09 | Matsushita Electric Ind Co Ltd | フイルムリ−ド |
| JPS6232551U (en:Method) * | 1985-08-13 | 1987-02-26 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05144889A (ja) * | 1991-11-20 | 1993-06-11 | Fujitsu Ltd | 半導体チツプ搭載フイルムの接続方法 |
| JP2006019450A (ja) * | 2004-06-30 | 2006-01-19 | Sumitomo Metal Micro Devices Inc | 回路基板及び実装後基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0749795Y2 (ja) | 1995-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |