JPH02142547U - - Google Patents
Info
- Publication number
- JPH02142547U JPH02142547U JP1989051905U JP5190589U JPH02142547U JP H02142547 U JPH02142547 U JP H02142547U JP 1989051905 U JP1989051905 U JP 1989051905U JP 5190589 U JP5190589 U JP 5190589U JP H02142547 U JPH02142547 U JP H02142547U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- package
- ground electrode
- view
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989051905U JPH02142547U (enExample) | 1989-05-01 | 1989-05-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989051905U JPH02142547U (enExample) | 1989-05-01 | 1989-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02142547U true JPH02142547U (enExample) | 1990-12-04 |
Family
ID=31571752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989051905U Pending JPH02142547U (enExample) | 1989-05-01 | 1989-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02142547U (enExample) |
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1989
- 1989-05-01 JP JP1989051905U patent/JPH02142547U/ja active Pending