JPH0214204Y2 - - Google Patents
Info
- Publication number
- JPH0214204Y2 JPH0214204Y2 JP1981036376U JP3637681U JPH0214204Y2 JP H0214204 Y2 JPH0214204 Y2 JP H0214204Y2 JP 1981036376 U JP1981036376 U JP 1981036376U JP 3637681 U JP3637681 U JP 3637681U JP H0214204 Y2 JPH0214204 Y2 JP H0214204Y2
- Authority
- JP
- Japan
- Prior art keywords
- intermediate member
- frames
- frame
- tightening
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011810 insulating material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Description
【考案の詳細な説明】 本考案は半導体整流装置の改良に関する。[Detailed explanation of the idea] The present invention relates to improvements in semiconductor rectifiers.
従来複数の半導体整流装置(以下素子という)
を用いる半導体整流装置は、素子と冷却フインま
たは素子、冷未フインおよび絶縁体を交互に積重
ね、この両端に締付板を配設し、この両締付板を
貫通するボルトで締付けて組立てられていた。し
かして素子と冷却フインの締付力は、この種の半
導体整流装置においては重要であり、このためボ
ルトの端部にばねを介在させ、このばねの圧縮力
を所定に保つことにより、上記締付力を最良に保
持するようにしていた。 Conventional multiple semiconductor rectifier devices (hereinafter referred to as elements)
A semiconductor rectifier using a semiconductor rectifier is assembled by stacking elements and cooling fins or elements, uncooled fins, and insulators alternately, providing clamping plates at both ends, and tightening them with bolts that pass through both clamping plates. was. However, the tightening force between the element and the cooling fin is important in this type of semiconductor rectifier, so by interposing a spring at the end of the bolt and maintaining the compressive force of this spring at a specified level, the tightening force is I tried to maintain the best force.
ところで、この半導体整流装置をプラント等で
使用しているとき、素子の不具合その他の原因で
素子の交換が必要となつた場合には、上記ボルト
を外さなければならない。これは全分解と略同じ
状態になり、組立用設備のないプラント等におい
ては、上記締付力を再び所定に確保することが容
易でなく、これが素子の交換作業を困難なものと
していた。 By the way, when this semiconductor rectifier is used in a plant or the like, if the element needs to be replaced due to a malfunction or other cause, the bolts must be removed. This is almost the same state as complete disassembly, and in a plant or the like without assembly equipment, it is not easy to secure the above-mentioned tightening force at a predetermined level again, making it difficult to replace the element.
そこで本考案は、素子と冷却フインとの締付力
を所定に保持するばねの圧縮力を、素子交換前に
ロツクしておき、素子交換後このロツクを解除す
ることにより、所定の締付力の再確保がきわめて
容易な半導体整流装置を提供することを目的とす
る。 Therefore, the present invention locks the compression force of the spring that maintains the clamping force between the element and the cooling fin at a predetermined level before replacing the element, and releases this lock after replacing the element to maintain the predetermined clamping force. An object of the present invention is to provide a semiconductor rectifier device in which it is extremely easy to re-secure.
以下本考案の一実施例を図面について説明す
る。 An embodiment of the present invention will be described below with reference to the drawings.
第1図、第2図および第3図において、1はベ
ース、2はこのベース1の一側に固定された枠
体、3は枠体2と対向しベース1の他側に固定さ
れた枠体、4は適宜な放熱面を有し図示しない端
子を設けた冷却フイン、5は素子、6は中間部
材、7は絶縁座、8は中間部材6に取付けられた
ピボツト部材、9は枠体2に前後進自在にねじ込
まれ先端がピポツト状をなして絶縁座7に当接
し、素子5と冷却フイン4との締付力を調整する
調整ボルト、10は冷却フイン4の両外側に高低
差をもつて配設され、一端が枠体2に固定され他
端が枠体3を貫通してナツト10aで締付けら
れ、さらに中間が中間部材6を貫通した締付けボ
ルト、11は中間部材6と枠体3間の締付けボル
ト10に挿入され、素子5と冷却フイン4に締付
力を付与するばね、12は枠体3を貫通し端部が
中間部材6にねじ込まれた締付力ロツクねじ、1
3は絶縁材より形成され、一側に冷却フイン4の
位置を規制する凸部13aを有し、ベース1に取
付けられた座板、14は絶縁材より形成され、冷
却フイン4の位置を規制する端面14aを有し、
ベース1に取付けられた止板、15(第3図示)
は素子交換治具挿入穴である。 1, 2, and 3, 1 is a base, 2 is a frame fixed to one side of the base 1, and 3 is a frame facing the frame 2 and fixed to the other side of the base 1. 4 is a cooling fin having an appropriate heat dissipation surface and a terminal (not shown); 5 is an element; 6 is an intermediate member; 7 is an insulating seat; 8 is a pivot member attached to the intermediate member 6; 9 is a frame. 2 is an adjustment bolt that is screwed into the bolt so that it can move forward and backward, has a pivot-shaped tip, and contacts the insulating seat 7 to adjust the tightening force between the element 5 and the cooling fin 4; 10 is a height difference on both sides of the cooling fin 4; One end is fixed to the frame 2, the other end passes through the frame 3 and is tightened with a nut 10a, and the middle part passes through the intermediate member 6. A tightening bolt 11 connects the intermediate member 6 and the frame. A spring is inserted into the tightening bolt 10 between the bodies 3 and applies a tightening force to the element 5 and the cooling fin 4; 12 is a tightening force lock screw passing through the frame 3 and having an end screwed into the intermediate member 6; 1
3 is made of an insulating material and has a convex portion 13a on one side for regulating the position of the cooling fin 4; a seat plate attached to the base 1; 14 is made of an insulating material and regulating the position of the cooling fin 4; It has an end surface 14a that
A stop plate attached to the base 1, 15 (as shown in the third figure)
is an element exchange jig insertion hole.
なお冷却フイン4には、第4図、第5図および
第6図に示すように、素子5の当接面に水平直径
方向に、底面が傾斜した溝4aを設ける。また座
板13に凹部を設けて導電部となる冷却フイン間
の絶縁距離が長くなるようにする。 As shown in FIGS. 4, 5, and 6, the cooling fins 4 are provided with grooves 4a whose bottom surfaces are inclined in the horizontal diametrical direction on the contact surface of the element 5. Further, a recessed portion is provided in the seat plate 13 so that the insulation distance between the cooling fins serving as a conductive portion is increased.
次に素子を交換する手順を説明する。 Next, the procedure for exchanging elements will be explained.
まず締付力ロツクねじ12を回転してばね11
の圧縮力を中間部材6と枠体3で保持する。これ
によつてばね11の締付力が素子5や冷却フイン
4に殆ど作用しないようになる。即ちばね11の
締付力をロツクする。 First, rotate the tightening force lock screw 12 to release the spring 11.
This compressive force is held by the intermediate member 6 and the frame 3. As a result, the tightening force of the spring 11 hardly acts on the element 5 or the cooling fins 4. That is, the tightening force of the spring 11 is locked.
次に調整ボルト9を回転して後退(第1図およ
び第2図で右側に移動)させ、冷却フイン4と素
子5を離間させて不良の素子を交換する。ここで
締付けボルト10の一方がベース1に対し低い位
置にあるので、素子5を略水平方向に移動すれば
外すことができ、従来のように同位置に締付ボル
トが配設されていて、素子を斜上方へ移動するこ
とに比較して作業がきわめて容易となる。 Next, the adjusting bolt 9 is rotated and moved backward (moved to the right in FIGS. 1 and 2) to separate the cooling fin 4 and the element 5, and the defective element is replaced. Here, since one of the tightening bolts 10 is located at a lower position with respect to the base 1, it can be removed by moving the element 5 in a substantially horizontal direction, and the tightening bolt 10 is disposed at the same position as in the conventional case. The work is much easier than moving the element diagonally upward.
また冷却フイン4と素子5が密着して離間させ
ることが困難なときは、冷却フイン4の溝4aに
適宜の工具を挿入して軽く外力を加えれば、容易
に両者を離間させることができる。新しい素子を
組込んだ後に調整ボルト9を前の状態に戻し、こ
の後締付力ロツクねじ12をゆるめれば再び初期
の締付力が付加される。 Further, when the cooling fins 4 and the element 5 are in close contact with each other and it is difficult to separate them, they can be easily separated by inserting an appropriate tool into the grooves 4a of the cooling fins 4 and applying a light external force. After installing the new element, return the adjustment bolt 9 to its previous state and then loosen the tightening force locking screw 12 to apply the initial tightening force again.
以上のように本考案は構成されているから、組
立用設備のないプラント等においても、素子の交
換が容易にでき、しかもこの種の半導体整流装置
において重要である素子と冷却フインの締付力を
容易に製作所期の所定の値に復元できるので、プ
ラントの保守作業を容易にすると共に、交換作業
期間を短縮してプラントの稼動効率を向上し、も
つて投下資本の有効活用を図かることができる。 Since the present invention is constructed as described above, the elements can be easily replaced even in plants without assembly equipment, and the tightening force between the elements and cooling fins is important in this type of semiconductor rectifier. can be easily restored to the predetermined value at the factory, making plant maintenance work easier, shortening the replacement work period, improving plant operating efficiency, and making effective use of invested capital. Can be done.
第1図は本考案の一実施例を示す平面図、第2
図は第1図の正面図、第3図は第1図の側面図、
第4図は第2図の−線に沿つて矢印方向に見
た断面図、第5図は第4図の−線に沿つて矢
印方向に見た側面図、第6図は第4図の−線
に沿つて矢印方向に見た断面図である。
1……ベース、2,3……枠体、4……冷却フ
イン、5……素子、10……締付けボルト、11
……ばね、12……締付力ロツクねじ。
Fig. 1 is a plan view showing one embodiment of the present invention;
The figure is a front view of figure 1, figure 3 is a side view of figure 1,
Fig. 4 is a cross-sectional view taken along the - line in Fig. 2 in the direction of the arrow, Fig. 5 is a side view taken along the - line in Fig. 4 in the direction of the arrow, and Fig. 6 is a sectional view of Fig. 4. It is a sectional view taken along the - line in the direction of the arrow. DESCRIPTION OF SYMBOLS 1... Base, 2, 3... Frame body, 4... Cooling fin, 5... Element, 10... Tightening bolt, 11
...Spring, 12...Tightening force locking screw.
Claims (1)
に設けられた1対の枠体と、該枠体の一方に一端
が固定され他端が中間部材及び前記枠体の他方に
貫通して設けられその端部にナツトが取付けられ
且つ段違い状に設けられる1対のボルトと、前記
中間部材と前記他方の枠体との間の前記ボルトに
貫通されて設けられる1対の皿バネと、前記他方
の枠体の貫通孔を通し前記中間部材に固定される
ピボツト部材のネジ穴に螺合される締付力ロツク
用ボルトと、前記中間部材と前記一方の枠体との
間に設けられる半導体素子と冷却フインとを交互
に積層した積層体と、前記一方の枠体に螺合して
設けられその端部が前記積層体に当接し、積層体
の圧接力を調整する調整ボルトから成り、前記締
付力ロツク用ボルトを締付けることにより、前記
積層体に加わる圧接力を無くするようにしたこと
を特徴とする半導体整流装置。 A base disposed horizontally, a pair of frames provided at both ends of the base, one end fixed to one of the frames and the other end penetrating through an intermediate member and the other of the frames. a pair of bolts having nuts attached to their ends and provided in a staggered manner; a pair of disc springs passing through the bolts between the intermediate member and the other frame body; a tightening force locking bolt that passes through a through hole in a frame and is screwed into a screw hole of a pivot member that is fixed to the intermediate member; and a semiconductor element that is provided between the intermediate member and the one frame. and cooling fins alternately stacked, and an adjustment bolt that is screwed onto one of the frames and whose end abuts against the laminate to adjust the pressure contact force of the laminate; A semiconductor rectifying device characterized in that the pressing force applied to the laminate is eliminated by tightening a tightening force locking bolt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981036376U JPH0214204Y2 (en) | 1981-03-17 | 1981-03-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981036376U JPH0214204Y2 (en) | 1981-03-17 | 1981-03-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57150956U JPS57150956U (en) | 1982-09-22 |
JPH0214204Y2 true JPH0214204Y2 (en) | 1990-04-18 |
Family
ID=29833617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981036376U Expired JPH0214204Y2 (en) | 1981-03-17 | 1981-03-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0214204Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979465A (en) * | 1972-12-06 | 1974-07-31 | ||
JPS50103635A (en) * | 1974-01-23 | 1975-08-15 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5130919Y2 (en) * | 1971-09-22 | 1976-08-03 |
-
1981
- 1981-03-17 JP JP1981036376U patent/JPH0214204Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979465A (en) * | 1972-12-06 | 1974-07-31 | ||
JPS50103635A (en) * | 1974-01-23 | 1975-08-15 |
Also Published As
Publication number | Publication date |
---|---|
JPS57150956U (en) | 1982-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2107869C (en) | Method and apparatus for fabricating high fin density heatsinks | |
US3467891A (en) | Combination electrical,mechanical,and thermal connector assembly | |
JP3946416B2 (en) | LGA clamp mechanism | |
US4884331A (en) | Method of manufacturing heat sink apparatus | |
DE102014106570A1 (en) | Power semiconductor module with switching device and arrangement hereby | |
JPH0214204Y2 (en) | ||
WO2009050130A2 (en) | Chip cooling device having wedge element | |
JPS6327861B2 (en) | ||
US3740618A (en) | Semiconductor unit and method of manufacture thereof | |
DE9302754U1 (en) | Cooling fin arrangement for an integrated circuit | |
US20160227667A1 (en) | Apparatus and method for heat sink assembly | |
JPH1030856A (en) | Cooling device | |
JP2988807B2 (en) | Semiconductor stack | |
JP2577425Y2 (en) | Semiconductor stack | |
JPH10107466A (en) | Heat sink and manufacture thereof | |
JPS5843775Y2 (en) | flat semiconductor device | |
JPH0727996B2 (en) | Semiconductor device with cooling device | |
JPH0214203Y2 (en) | ||
JPS626701Y2 (en) | ||
JPS60257552A (en) | Semiconductor device | |
JP2539612Y2 (en) | Mounting structure of electric parts | |
JPS58112353A (en) | Take-out method for semiconductor element in semiconductor stack | |
JPS5828364Y2 (en) | rectifier stack | |
JPS5846177B2 (en) | semiconductor equipment | |
JPH0229728Y2 (en) |