JPH02139783U - - Google Patents
Info
- Publication number
- JPH02139783U JPH02139783U JP4834789U JP4834789U JPH02139783U JP H02139783 U JPH02139783 U JP H02139783U JP 4834789 U JP4834789 U JP 4834789U JP 4834789 U JP4834789 U JP 4834789U JP H02139783 U JPH02139783 U JP H02139783U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- sheet members
- card
- lower sheet
- contactless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は本考案の構成を示す断面図、第２図〜
第４図は従来技術を示す図で、第２図および第３
図は斜視図、第４図は断面図。 １……モジユール、７……樹脂充填剤、１０…
…枠部材、１１，１２……シート部材、１３，１
４……ラベル。
第４図は従来技術を示す図で、第２図および第３
図は斜視図、第４図は断面図。 １……モジユール、７……樹脂充填剤、１０…
…枠部材、１１，１２……シート部材、１３，１
４……ラベル。
Claims (1)
- 枠体と、該枠体の上、下にそれぞれ固着された
厚さ一様な合成樹脂製のシート部材と、該上、下
のシート部材間に収納されたＩＣカードモジユー
ルと、前記枠体および上、下のシート部材間の空
間に充填された樹脂充填剤より構成されたことを
特徴とする無接点型ＩＣカードの構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4834789U JPH02139783U (ja) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4834789U JPH02139783U (ja) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02139783U true JPH02139783U (ja) | 1990-11-21 |
Family
ID=31565072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4834789U Pending JPH02139783U (ja) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02139783U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0692077A (ja) * | 1992-09-17 | 1994-04-05 | Mitsubishi Electric Corp | 薄形半導体装置及びその製造方法 |
-
1989
- 1989-04-25 JP JP4834789U patent/JPH02139783U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0692077A (ja) * | 1992-09-17 | 1994-04-05 | Mitsubishi Electric Corp | 薄形半導体装置及びその製造方法 |