JPH02138430U - - Google Patents
Info
- Publication number
- JPH02138430U JPH02138430U JP4694789U JP4694789U JPH02138430U JP H02138430 U JPH02138430 U JP H02138430U JP 4694789 U JP4694789 U JP 4694789U JP 4694789 U JP4694789 U JP 4694789U JP H02138430 U JPH02138430 U JP H02138430U
- Authority
- JP
- Japan
- Prior art keywords
- holder
- transfer element
- transfer
- vertical shaft
- pivoted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4694789U JPH02138430U (US07923587-20110412-C00022.png) | 1989-04-20 | 1989-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4694789U JPH02138430U (US07923587-20110412-C00022.png) | 1989-04-20 | 1989-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138430U true JPH02138430U (US07923587-20110412-C00022.png) | 1990-11-19 |
Family
ID=31562457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4694789U Pending JPH02138430U (US07923587-20110412-C00022.png) | 1989-04-20 | 1989-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138430U (US07923587-20110412-C00022.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04105537U (ja) * | 1991-02-19 | 1992-09-10 | 三菱電機株式会社 | ダイボンデイング装置 |
-
1989
- 1989-04-20 JP JP4694789U patent/JPH02138430U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04105537U (ja) * | 1991-02-19 | 1992-09-10 | 三菱電機株式会社 | ダイボンデイング装置 |
