JPH02137679U - - Google Patents
Info
- Publication number
- JPH02137679U JPH02137679U JP4551089U JP4551089U JPH02137679U JP H02137679 U JPH02137679 U JP H02137679U JP 4551089 U JP4551089 U JP 4551089U JP 4551089 U JP4551089 U JP 4551089U JP H02137679 U JPH02137679 U JP H02137679U
- Authority
- JP
- Japan
- Prior art keywords
- cooler
- semiconductor device
- refrigerant
- cooling
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 239000003507 refrigerant Substances 0.000 claims 3
- 238000009835 boiling Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 1
Description
第１図は本考案の一実施例を示す構成図、第２
図は同実施例における冷却器の詳細を示す説明図
、第３図は冷却器の水平面に対する傾斜角度と冷
却能力との関係を示す曲線図、第４図は従来の整
流器の冷却装置を示す構成図、第５図は同装置に
使用されている冷却器の詳細を示す構成図である
。
２１……キエービクル、２２……半導体素子、
２３……タンク、２４……冷却器、２４ａ……チ
ユーブ、２４ｂ……冷却Ｕフイン、２５……入口
ヘツダ、２６……出口ヘツダ、２７……上昇管、
２８……戻り菅、２９……風胴、３０……付属品
。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure is an explanatory diagram showing details of the cooler in the same embodiment, Figure 3 is a curve diagram showing the relationship between the inclination angle of the cooler with respect to the horizontal plane and cooling capacity, and Figure 4 is a configuration showing a conventional rectifier cooling device. 5 are block diagrams showing details of the cooler used in the device. 21... Key vehicle, 22... Semiconductor element,
23...Tank, 24...Cooler, 24a...Tube, 24b...Cooling U-fin, 25...Inlet header, 26...Outlet header, 27...Rising pipe,
28...Return tube, 29...Wind body, 30...Accessories.
Claims (1)
なる半導体装置をキユービクル内の底部に配置し
、この半導体装置の上方部にチユーブの外周面に
多数の冷却フインを取付けた冷却器を配置すると
共にその入口部および出口部を前記タンクに連結
して前記半導体素子群を前記冷媒の沸騰により一
次冷却し、その冷媒を前記冷却器による自然空冷
により二次冷却するようにした半導体装置の冷却
装置において、前記冷却器をチユーブの外周面に
コイル状の冷却フインを取り付けた構成とし、こ
の冷却器を前記半導体装置の上方部に水平面に対
して３０°〜６０°の範囲に傾斜させて設けるよ
うにしたことを特徴とする半導体装置の冷却装置
。 A semiconductor device consisting of a group of semiconductor elements housed in a tank together with a refrigerant is placed at the bottom of the cubicle, and a cooler with a number of cooling fins attached to the outer circumferential surface of the tube is placed above the semiconductor device. In a cooling device for a semiconductor device, the inlet part and the outlet part are connected to the tank, and the semiconductor element group is primarily cooled by boiling the refrigerant, and the refrigerant is secondarily cooled by natural air cooling by the cooler, The cooler has a configuration in which coil-shaped cooling fins are attached to the outer peripheral surface of a tube, and the cooler is provided above the semiconductor device at an angle of 30° to 60° with respect to a horizontal plane. A cooling device for a semiconductor device characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4551089U JPH02137679U (en) | 1989-04-18 | 1989-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4551089U JPH02137679U (en) | 1989-04-18 | 1989-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137679U true JPH02137679U (en) | 1990-11-16 |
Family
ID=31559753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4551089U Pending JPH02137679U (en) | 1989-04-18 | 1989-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137679U (en) |
-
1989
- 1989-04-18 JP JP4551089U patent/JPH02137679U/ja active Pending