JPH02137574U - - Google Patents
Info
- Publication number
- JPH02137574U JPH02137574U JP4571189U JP4571189U JPH02137574U JP H02137574 U JPH02137574 U JP H02137574U JP 4571189 U JP4571189 U JP 4571189U JP 4571189 U JP4571189 U JP 4571189U JP H02137574 U JPH02137574 U JP H02137574U
- Authority
- JP
- Japan
- Prior art keywords
- pump device
- control box
- semiconductor
- wall surface
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す切欠側面図、
第２図は同例の切欠正面図、第３図は要部の変形
例を示す切欠側面図、第４図は従来例を示す説明
図である。
１……外箱、４……制御箱、５……半導体。
FIG. 1 is a cutaway side view showing an embodiment of the present invention;
FIG. 2 is a cutaway front view of the same example, FIG. 3 is a cutaway side view showing a modification of the main part, and FIG. 4 is an explanatory diagram showing a conventional example. 1...Outer box, 4...Control box, 5...Semiconductor.
Claims (1)
る制御箱を備えた小形ポンプ装置において、上記
制御箱が熱伝導率の高い材料から形成されるとと
もにその内壁面に上記半導体が取付けられた状態
で上記外箱の内壁面に密接されてなることを特徴
とする小形ポンプ装置。 In a small pump device equipped with a control box having a semiconductor and disposed within an outer box for housing the pump, the control box is formed of a material with high thermal conductivity, and the semiconductor is attached to the inner wall surface of the control box. A small pump device characterized in that the pump device is brought into close contact with the inner wall surface of the outer box in a state where the pump device is in a closed state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4571189U JPH02137574U (en) | 1989-04-19 | 1989-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4571189U JPH02137574U (en) | 1989-04-19 | 1989-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137574U true JPH02137574U (en) | 1990-11-16 |
Family
ID=31560128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4571189U Pending JPH02137574U (en) | 1989-04-19 | 1989-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137574U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999045273A1 (en) * | 1998-03-04 | 1999-09-10 | Ebara Corporation | Performance regulating device for fluid machinery |
-
1989
- 1989-04-19 JP JP4571189U patent/JPH02137574U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999045273A1 (en) * | 1998-03-04 | 1999-09-10 | Ebara Corporation | Performance regulating device for fluid machinery |