JPH0213729U - - Google Patents

Info

Publication number
JPH0213729U
JPH0213729U JP9265488U JP9265488U JPH0213729U JP H0213729 U JPH0213729 U JP H0213729U JP 9265488 U JP9265488 U JP 9265488U JP 9265488 U JP9265488 U JP 9265488U JP H0213729 U JPH0213729 U JP H0213729U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor element
electrodes
terminals
thin metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9265488U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9265488U priority Critical patent/JPH0213729U/ja
Publication of JPH0213729U publication Critical patent/JPH0213729U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP9265488U 1988-07-12 1988-07-12 Pending JPH0213729U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9265488U JPH0213729U (zh) 1988-07-12 1988-07-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9265488U JPH0213729U (zh) 1988-07-12 1988-07-12

Publications (1)

Publication Number Publication Date
JPH0213729U true JPH0213729U (zh) 1990-01-29

Family

ID=31317091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9265488U Pending JPH0213729U (zh) 1988-07-12 1988-07-12

Country Status (1)

Country Link
JP (1) JPH0213729U (zh)

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