JPH02137025U - - Google Patents
Info
- Publication number
- JPH02137025U JPH02137025U JP4373289U JP4373289U JPH02137025U JP H02137025 U JPH02137025 U JP H02137025U JP 4373289 U JP4373289 U JP 4373289U JP 4373289 U JP4373289 U JP 4373289U JP H02137025 U JPH02137025 U JP H02137025U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating resin
- anode lead
- resin layer
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000005245 sintering Methods 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 1
Description
第１図は本考案の一実施例のチツプ型固体電解
コンデンサの断面図、第２図は本考案の他の実施
例のチツプ型固体電解コンデンサの断面図、第３
図、第４図は何れも従来のチツプ型固体電解コン
デンサの断面図である。
１…陽極リード、１ａ…陽極リード断面、２…
陽極体、３…陽極リード引き出し面、４…第１の
絶縁樹脂、５…酸化膜層、６…半導体酸化膜層、
７…グラフアイト層、８…第２の絶縁樹脂層、９
…陽極リードと対向する面、１０…メツキ層、１
１…銀ペースと層、１２…半田層、１３…陽極端
子、１４…陰極端子、１５…モールド樹脂、１６
…外装樹脂層、１７…電極層。
FIG. 1 is a cross-sectional view of a chip-type solid electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a chip-type solid electrolytic capacitor according to another embodiment of the present invention, and FIG.
Both FIG. 4 and FIG. 4 are cross-sectional views of conventional chip-type solid electrolytic capacitors. 1... Anode lead, 1a... Anode lead cross section, 2...
Anode body, 3... Anode lead extraction surface, 4... First insulating resin, 5... Oxide film layer, 6... Semiconductor oxide film layer,
7...Graphite layer, 8... Second insulating resin layer, 9
... Surface facing the anode lead, 10... Plating layer, 1
1... Silver paste and layer, 12... Solder layer, 13... Anode terminal, 14... Cathode terminal, 15... Mold resin, 16
... Exterior resin layer, 17... Electrode layer.
Claims (1)
圧成形体を高温・高真空中で焼結してなる陽極体
と、該陽極体の陽極リード引き出し面に形成され
た撥水性を有する第１の絶縁樹脂層と、該第１の
絶縁樹脂層の被着された部分を除く前記陽極体上
に順次形成された誘電体酸化膜層、半導体酸化膜
層、グラフアイト層と、該グラフアイト層上に形
成された第２の絶縁樹脂層と、陽極リード対向面
の第２の絶縁樹脂層を除去し露出されたグラフア
イト層上に形成された銀ペースト、メツキ層、半
田層等の導体層よりなる電極部と、陽極リード周
辺の第１の絶縁樹脂層の除去により露出された弁
作用金属部分および陽極リード露出面に形成され
たメツキ層、銀ペースト層、半田層等の導体層よ
りなる電極部とを有することを特徴とするチツプ
型固体電解コンデンサ。 An anode body formed by sintering a press-molded body made of a valve metal with an anode lead planted therein at high temperature and high vacuum; an insulating resin layer, a dielectric oxide film layer, a semiconductor oxide film layer, a graphite layer, which are sequentially formed on the anode body except for the portion to which the first insulating resin layer is adhered, and the graphite layer. A conductor layer such as a silver paste, a plating layer, a solder layer, etc. formed on the graphite layer exposed by removing the second insulating resin layer formed above and the second insulating resin layer on the surface facing the anode lead. the valve metal part exposed by removing the first insulating resin layer around the anode lead, and a conductor layer such as a plating layer, a silver paste layer, a solder layer, etc. formed on the exposed surface of the anode lead. A chip-type solid electrolytic capacitor characterized by having an electrode part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4373289U JPH02137025U (en) | 1989-04-14 | 1989-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4373289U JPH02137025U (en) | 1989-04-14 | 1989-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137025U true JPH02137025U (en) | 1990-11-15 |
Family
ID=31556394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4373289U Pending JPH02137025U (en) | 1989-04-14 | 1989-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137025U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088387A (en) * | 2005-09-26 | 2007-04-05 | Nichicon Corp | Solid electrolytic capacitor |
-
1989
- 1989-04-14 JP JP4373289U patent/JPH02137025U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088387A (en) * | 2005-09-26 | 2007-04-05 | Nichicon Corp | Solid electrolytic capacitor |
| JP4637702B2 (en) * | 2005-09-26 | 2011-02-23 | ニチコン株式会社 | Solid electrolytic capacitor |
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