JPH02135795A - Resist coater of substrate for printed circuit - Google Patents

Abstract

PURPOSE:To improve the reliability of coating of a resist film by applying a magnetic field in a direction perpendicular to an electrolyte conveying tube axis for the film, supplying a current in a direction perpendicular to both the direction of the field and the axial direction, and applying a voltage between the electrolyte and a substrate for a printed circuit. CONSTITUTION:Magnetic field applying means 9 for applying a magnetic field in a direction perpendicular to the axial direction of an electrolyte conveying tube 8 for a resist film therein, conducting means 10 for supplying a current in a direction perpendicular to both the axial direction and the direction of the magnetic field to the electrolyte 2 for the film in the tube 8, and voltage applying means 6, 11 for applying a voltage between the electrolyte 2 and a substrate 3 for a printed circuit are provided. Accordingly, thrust is operated axially of the tube to the electrolyte 2, the electrolyte 2 is atomized in a spray state to the substrate 3 to guide the electrolyte into a through hole. Thus, the reliability of coating of the film can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a resist coating apparatus for printed circuit boards used in the manufacturing process of printed distribution boards.

(Prior Art) Conventionally, a resist coating apparatus for a printed circuit board is configured as shown in FIG. To explain this based on the figure, in the figure, the reference numeral 1 indicates a processing tank in which the electrolyte 2 of the photosensitive resist film is stored, and 3 indicates the electrolyte 2 in the processing tank 1. A printed circuit board made of a facing metal-clad laminate, 4 and 5 are conductors serving as electrode plates facing each other via this board 3, and 6 is connected to these inner conductors 4.5 and the board 3 and connected to the processing tank. This is a power supply provided outside of 1. Further, 7 is a blowing vibrator provided at the bottom of the processing tank 1 for stirring the liquid.

Next, a coating method using the resist coating apparatus for a printed circuit board configured as described above will be described.

First, a substrate 3 and a conductor 4,
Soak 5. At this time, each conductor 4.5 faces each other with the substrate 3 in between. Next, the inner conductor 4 is
, 5 and the substrate 3, the conductor 4 and the substrate 3 are connected.
A voltage is applied between the conductor 5 and the substrate 3 to electrodeposit a photosensitive resist film on the substrate 3.

In this way, the photosensitive resist film can be applied to the printed circuit board.

[Problem to be solved by the invention]

However, in the above-mentioned conventional resist film coating apparatus for printed circuit boards, since the substrate 3 and the conductors 4 and 5 are immersed in the electrolytic solution 2, a large amount of the electrolytic solution 2 is required in the processing tank 1. , there was a problem that the 5-stroke was bulky. Furthermore, if the substrate has through holes (not shown) such as through holes for printed circuit boards, the electrolyte 2 may not flow into the through holes, reducing the reliability of resist film application. That problem arose.

The present invention has been made to solve the above-mentioned problems, and improves the reliability of resist film application when applying resist to a substrate, especially to a substrate with through holes. It is an object of the present invention to provide an apparatus that can perform coating in an efficient manner.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a resist coating apparatus for a printed circuit board having the following configuration.

In other words, a resist film electrolyte conveying tube having one end open toward the printed circuit board side, a magnetic field applying means for applying a magnetic field within the conveying tube in a direction perpendicular to the axial direction thereof, and the above-mentioned To thaw the resist film mold, a voltage is applied between an energizing means for passing a current in a direction perpendicular to the ink axis direction and perpendicular to the direction of the magnetic field, and the resist film electrolyte and the printed circuit board. and a voltage applying means.

[Effect]

With the above configuration, a thrust is applied to the resist film electrolytic solution in the axial direction of the conveying tube, and the electrolytic solution moves and is sprayed onto the printed circuit board.

〔Example) The present invention will be explained below with reference to Examples.

FIG. 1 is a schematic diagram showing a resist coating apparatus for a printed circuit board, which is an embodiment of the present invention. In the figure,
2 is an electrolytic solution for the photosensitive resist film, 3 is a printed circuit board, and 6 is a power source for electrodeposition. Reference numeral 8 denotes a conveying tube that conveys the electrolytic solution 2 for the resist film and sprays it toward the substrate 3. In order to prevent the influence of induction heating caused by the magnetic field, a nonmetallic material, that is, plastic, is used, and the tube 8 conveys the electrolytic solution 2 for the resist film and sprays it toward the substrate 3 from the tip (opening) facing diagonally upward. Spray electrolyte onto 3. Reference numeral 9 denotes electromagnetic coils fixed to the outer surface of the conveying pipe 8, which are arranged in an upper and lower pair. 10 is located at a position rotated by 90 degrees with respect to the mounting position of the electromagnetic coil 9 when viewed from the cross section of the transport pipe 8 where the electromagnetic coil 9 is installed, and is provided facing inside the transport pipe 8. The pair of electrodes constitutes part of a current-carrying means for passing a current in a direction perpendicular to the axial direction of the conveying tube 8 and perpendicular to the direction of the magnetic field. Further, a voltage is applied between the transport tube 8 and the substrate 3 by a power source 6. A fixed electrode 11 within the transport tube 8 is for applying this voltage.

Next, the operation of this embodiment will be explained.

The electrolytic solution 2 in the transport tube 8 passes current by M, pole lO,
On the other hand, this? "By applying a magnetic field in a direction perpendicular to the direction of flow, a force acting on the electrolyte 2 moves in the direction of the arrow, according to Fleming's left-hand rule, and the electrolyte can be blown out toward the substrate 3. At this time, fixed electrode 1
A voltage is applied between the photoresist 1 and the substrate 3 by a power source 6 to electrodeposit a photosensitive resist film on the substrate 3.

With this device, the electrolytic solution 2 can be sprayed onto the substrate 3, and by adjusting the strength of the magnetic field or current, the amount of electrolytic solution used for electrodeposition can be adjusted to an appropriate amount. In addition to being able to use only a small amount of liquid, the electrolyte can be introduced not only to the front and back surfaces of the substrate but also into through-holes such as through-holes.

Note that the generation of the magnetic field and the energization by the electrode 1o are conducted using direct current,
Either a pulsating flow or an alternating current may be used, as long as a thrust is generated in the electrolyte toward the substrate, and the waveform thereof is appropriately selected depending on the coating situation. Further, whether or not to move the substrate relative to the resist coating device is selected depending on the shape of the substrate and the coating situation.

〔Effect of the invention〕

As described above, according to the present invention, since the electrolytic solution for the resist film is sprayed onto the substrate, the amount of electrolytic solution used can be reduced to a small extent, and costs can be reduced.

Further, since the electrolytic solution can be introduced not only to the front and back surfaces of the substrate but also into the through holes, reliability in coating one resist can be improved and coating can be performed efficiently.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a conventional device. In the figure, 2 is an electrolytic solution, 3 is a substrate, 6 is a power supply, 8 is a transport pipe,
9 is an electromagnetic coil, 10 is a pair of 'rr1 poles, and 11 is a fixed electrode. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] A transport tube for resist film electrolyte having one end opened toward the printed circuit board side, a magnetic field applying means for applying a magnetic field within the transport pipe in a direction perpendicular to the axial direction thereof, and the resist film within the transport pipe. energizing means for passing a current through the electrolytic solution in a direction perpendicular to the axial direction and perpendicular to the direction of the magnetic field;
A resist coating apparatus for a printed circuit board, comprising a voltage applying means for applying a voltage between the resist film electrolyte and the printed circuit board.