JPH0213305U - - Google Patents
Info
- Publication number
- JPH0213305U JPH0213305U JP8995288U JP8995288U JPH0213305U JP H0213305 U JPH0213305 U JP H0213305U JP 8995288 U JP8995288 U JP 8995288U JP 8995288 U JP8995288 U JP 8995288U JP H0213305 U JPH0213305 U JP H0213305U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- grounding
- strip conductor
- dielectric substrate
- land portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Waveguides (AREA)
- Microwave Amplifiers (AREA)
Description
第１図及び第２図は本考案に係るマイクロスト
リツプ線路の一実施例を示すパターン平面図、第
３図及び第４図は従来のマイクロストリツプ線路
を示すパターン平面図である。
１……誘電体基板、２……主線路用ストリツプ
導体、６……ＦＥＴ、１０……接地用のストリツ
プ導体、１１，１４……スルーホール、１２……
開口部、１３……ランド部、１５……銅箔片。
1 and 2 are pattern plan views showing an embodiment of the microstrip line according to the present invention, and FIGS. 3 and 4 are pattern plan views showing a conventional microstrip line. 1... Dielectric substrate, 2... Strip conductor for main line, 6... FET, 10... Strip conductor for grounding, 11, 14... Through hole, 12...
Opening portion, 13...land portion, 15...copper foil piece.
Claims (1)
ストリツプ導体と、 誘電体基板の前記他面に形成され、スルーホー
ルにより前記接地導体と接続される接地用のスト
リツプ導体と、 この接地用のストリツプ導体の一部に設けられ
たインダクタンス調整用の開口部と、 この開口部内で、スルーホールにより前記接地
導体と接続されるランド部とを具備し、 前記接地用のストリツプ導体とランド部とを被
覆導体を用いて接続又は非接続することにより、
前記接地用のストリツプ導体と接地導体との間の
インダクタンスを調整可能にしたことを特徴とす
るマイクロストリツプ線路。[Claims for Utility Model Registration] A dielectric substrate with a ground conductor formed on one side, a strip conductor for a main line formed on the other side of the dielectric substrate, and a strip conductor for a main line formed on the other side of the dielectric substrate. , a grounding strip conductor connected to the grounding conductor by a through hole; an opening for inductance adjustment provided in a part of this grounding strip conductor; and a land portion to be connected to the land portion, and by connecting or disconnecting the grounding strip conductor and the land portion using a covered conductor,
A microstrip line characterized in that the inductance between the grounding strip conductor and the grounding conductor is adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8995288U JPH0213305U (en) | 1988-07-08 | 1988-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8995288U JPH0213305U (en) | 1988-07-08 | 1988-07-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213305U true JPH0213305U (en) | 1990-01-26 |
Family
ID=31314490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8995288U Pending JPH0213305U (en) | 1988-07-08 | 1988-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213305U (en) |
-
1988
- 1988-07-08 JP JP8995288U patent/JPH0213305U/ja active Pending