JPH02132974U - - Google Patents
Info
- Publication number
- JPH02132974U JPH02132974U JP4264889U JP4264889U JPH02132974U JP H02132974 U JPH02132974 U JP H02132974U JP 4264889 U JP4264889 U JP 4264889U JP 4264889 U JP4264889 U JP 4264889U JP H02132974 U JPH02132974 U JP H02132974U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- solder
- mini
- frame
- solder tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4264889U JPH02132974U (en:Method) | 1989-04-12 | 1989-04-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4264889U JPH02132974U (en:Method) | 1989-04-12 | 1989-04-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02132974U true JPH02132974U (en:Method) | 1990-11-05 |
Family
ID=31554374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4264889U Pending JPH02132974U (en:Method) | 1989-04-12 | 1989-04-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02132974U (en:Method) |
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1989
- 1989-04-12 JP JP4264889U patent/JPH02132974U/ja active Pending