JPS6413775U - - Google Patents
Info
- Publication number
- JPS6413775U JPS6413775U JP11022387U JP11022387U JPS6413775U JP S6413775 U JPS6413775 U JP S6413775U JP 11022387 U JP11022387 U JP 11022387U JP 11022387 U JP11022387 U JP 11022387U JP S6413775 U JPS6413775 U JP S6413775U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- mounting
- hole
- plated
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Supports For Pipes And Cables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11022387U JPS6413775U (en:Method) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11022387U JPS6413775U (en:Method) | 1987-07-17 | 1987-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413775U true JPS6413775U (en:Method) | 1989-01-24 |
Family
ID=31347185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11022387U Pending JPS6413775U (en:Method) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413775U (en:Method) |
-
1987
- 1987-07-17 JP JP11022387U patent/JPS6413775U/ja active Pending
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