JPH02132970U - - Google Patents

Info

Publication number

JPH02132970U

JPH02132970U JP4277889U JP4277889U JPH02132970U JP H02132970 U JPH02132970 U JP H02132970U JP 4277889 U JP4277889 U JP 4277889U JP 4277889 U JP4277889 U JP 4277889U JP H02132970 U JPH02132970 U JP H02132970U

Authority

JP

Japan

Prior art keywords

recesses

printed circuit

engaged

circuit board

soldering

Prior art date

1989-04-11

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1

Cited By (3)