JPH02132947U - - Google Patents
Info
- Publication number
- JPH02132947U JPH02132947U JP4271189U JP4271189U JPH02132947U JP H02132947 U JPH02132947 U JP H02132947U JP 4271189 U JP4271189 U JP 4271189U JP 4271189 U JP4271189 U JP 4271189U JP H02132947 U JPH02132947 U JP H02132947U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- resin encapsulation
- encapsulation mold
- mold
- lower die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000002184 metal Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4271189U JPH02132947U (ru) | 1989-04-11 | 1989-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4271189U JPH02132947U (ru) | 1989-04-11 | 1989-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132947U true JPH02132947U (ru) | 1990-11-05 |
Family
ID=31554494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4271189U Pending JPH02132947U (ru) | 1989-04-11 | 1989-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132947U (ru) |
-
1989
- 1989-04-11 JP JP4271189U patent/JPH02132947U/ja active Pending