JPH02132944U - - Google Patents

Info

Publication number
JPH02132944U
JPH02132944U JP4176489U JP4176489U JPH02132944U JP H02132944 U JPH02132944 U JP H02132944U JP 4176489 U JP4176489 U JP 4176489U JP 4176489 U JP4176489 U JP 4176489U JP H02132944 U JPH02132944 U JP H02132944U
Authority
JP
Japan
Prior art keywords
resin sealing
mounting hole
element mounting
lead frame
sealing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4176489U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4176489U priority Critical patent/JPH02132944U/ja
Publication of JPH02132944U publication Critical patent/JPH02132944U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP4176489U 1989-04-10 1989-04-10 Pending JPH02132944U (US07122603-20061017-C00045.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4176489U JPH02132944U (US07122603-20061017-C00045.png) 1989-04-10 1989-04-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4176489U JPH02132944U (US07122603-20061017-C00045.png) 1989-04-10 1989-04-10

Publications (1)

Publication Number Publication Date
JPH02132944U true JPH02132944U (US07122603-20061017-C00045.png) 1990-11-05

Family

ID=31552712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4176489U Pending JPH02132944U (US07122603-20061017-C00045.png) 1989-04-10 1989-04-10

Country Status (1)

Country Link
JP (1) JPH02132944U (US07122603-20061017-C00045.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020123691A (ja) * 2019-01-31 2020-08-13 株式会社三社電機製作所 半導体製品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020123691A (ja) * 2019-01-31 2020-08-13 株式会社三社電機製作所 半導体製品

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