JPH02132784A - Soldering method for conductive member - Google Patents

Abstract

PURPOSE:To make it possible to perform soldering work simply and certainly, by selectively heating the soldering portions of conductive members by means of irradiation of laser beams, and melting solder by means of the conductive members heated so as to perform soldering. CONSTITUTION:Micro-portions in the vicinity of respective connecting portions 8 of plural conductivity members 4, 5 where they make contact with each other are selectively heated by means of irradiation of respective laser beams 11, 12, and solder 9 retained in the conductive members 4, 5 is melted by means of heat transmission of the conductive members 4, 5 heated, and spreads around the connecting portions 8, where soldering takes place. Therefore, the surface of the solder after soldering is smooth, the soldering is firm, and the solder spreading is good. It is thus enabled to perform soldering simply and certainly.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention uses a laser beam to solder lead wires and a metal frame of an electronic component, such as a chip-shaped inductor, to electrically and mechanically The present invention relates to a method of soldering a conductive member to be connected to a conductive member.

(Prior art) Conventionally, in order to solder the lead wire of an electronic component such as a chip-shaped inductor to a metal frame, the lead wire is brought into contact with a metal frame, and the solder is melted at this contact portion with a soldering iron. The method used was to introduce the material to the contact area and solidify it.

(Problem to be Solved by the Invention) When using the conventional soldering method as described above, the solder that has been sufficiently heated and melted comes into contact with the lead wires and frame whose temperature is lower than that of the solder, so that the solder is sufficiently heated and melted at the connection part. The solder may not go all the way through.

In addition, since the solder is transferred to the connection part while being heated directly with a soldering iron, the surface of the solder is not smooth, and
There is a problem that the lead wire and frame are deformed by the movement of the soldering iron tip, and in the case of minute electronic components, parts other than the necessary parts are heated by the soldering iron, etc., causing surface changes to the solder plating on the surface of the metal frame. There are various problems such as causing.

In view of the above-mentioned problems, the purpose of this invention is to make the surface of the solder after soldering smooth, to have good solderability and good solder wrapping, to make it easy to solder intricate connections, and to make the surface of the solder smooth. The present invention provides a soldering iron suitable for soldering conductive members and a non-contact method for soldering conductive members.

[Structure of the invention]

(Means for Solving the Problems) The method for soldering conductive members of the present invention includes separately applying a laser beam to each conductive member near a connecting portion where a plurality of conductive members are brought into contact with each other and electrically and mechanically connected. A beam is irradiated to heat the solder, which is held near the connecting portion of any of the gastric guiding members, and the solder is melted by conduction heat, thereby soldering the connecting portions of a plurality of S electric members without contact with a soldering iron. It is.

In addition, the irradiation lines of the plurality of laser beams are varied to create a temperature difference in the conductive member, thereby imparting directionality of flow to the solder.

(Function) In the method for soldering conductive members of the present invention, minute portions of a plurality of conductive members in the vicinity of mutually contacting connection portions are selectively heated by laser beam irradiation, and the heated conductive members are heated. Due to heat conduction, the solder held on the conductive member melts and wraps around the connection portion to perform soldering.

In addition, by varying the irradiation amount of each laser beam, a temperature difference is created in each conductive member, and the conductive member on the side where the irradiation interval is longer is quickly heated, and the solder flows toward the conductive member on the high temperature side.

(Embodiment) An embodiment of the present invention will be explained using a chip-shaped inductor shown in the accompanying drawings.

1 to 3, reference numeral 1 denotes a chip-shaped inductor body, a core 2, a coil 3 wound around the core 2, and a lead wire 4 as one conductive member connected to both end surfaces of the core 2. 4, and both ends of the coil 3 are connected to the base of a lead wire 4.

Reference numeral 5 denotes a metal frame as the other conductive member, which is made of a solder-plated elongated steel plate, and terminal pieces 6 and 6 are formed facing each other in the width direction of this metal frame 5. An arc-shaped recess is formed at the upper end, and a semi-cylindrical receiving part 7 whose inner circumferential surface is flush with the recess is formed.
is projected from the terminal piece 6.

Incidentally, a large number of pairs of terminal pieces 6.6 are protruded in the length direction of the metal frame 5 at appropriate intervals.

Lead wire 4 of inductor body 1 configured as described above
A method of connecting the terminal piece 6 to the terminal piece 6 will be explained.

The lead wire 4 is held in the receiving part 7 of the terminal piece 6.

Next, cream solder 9 is held on the lead wire 4 at a position close to the connecting portion 8 where the lead wire 4 and the receiving portion are in contact by applying or printing with a dispenser.

Next, the first and second laser beams 10 are directed toward a position close to the connection part 8 of the lead wire 4 avoiding the cream solder 9, and a position close to the connection part 8 on the outer surface of the receiving part 7 of the terminal piece 6, respectively. ，
11 is irradiated. The irradiation angle is the first laser beam 1
0 is from the vertical direction directly above the lead wire 4, and the second laser beam 11 is oriented at an angle of 45° to the X-axis, y-axis, and Z-axis, respectively.
from this angle.

Further, the ratio of the irradiation doses of the first and second laser beams 10 and 11 is 1:2. Due to this difference in irradiation supply, 2
One focus 12. 13, heat conduction occurs from the receiving part 7 toward the lead wire 4, and the solder 9 flows while melting in the opposite direction to this heat conduction, that is, from the lead wire 4 toward the receiving part 7. As shown in FIG. 4, a solder portion 14 that wraps around the outer surface of the connecting portion 8 is formed. The surface of the solder portion 14 is smooth.

In this way, a large number of minute lead wires 4 of the inductor body 1 are held between the terminal pieces 6 and 6 on the metal frame 5.
．． 4 is soldered to the terminal piece 6 and electrically and mechanically connected.

Note that the above embodiments are based on the lead wire 4 of the chip-shaped inductor.
Although the soldering of the metal frame 5 has been described, the present invention can also be applied to a method of soldering lead wires of other electronic components and metal frames or other conductive members.

〔Effect of the invention〕

According to the present invention, the solder connection portion of the conductive member is selectively heated by laser beam irradiation, and the solder is melted by the heated S-electrode member, so that the adhesion of the solder to the heated conductive member is improved. It has good solderability and can improve solderability. Further, since the solder is melted by conductive heat from the conductive member and flows into the connection portion, the surface can be smooth and uniform soldering can be performed. Furthermore, solder can be introduced into three-dimensionally intersecting connections, complicated connections, and areas that require solder to wrap around, without using a soldering iron or the like, and without making contact with the solder tip. The attachment work can be done easily and reliably.

Furthermore, by varying the amount of laser beam irradiation, a temperature difference is applied to the conductive member and the direction of solder flow is determined, so that the flow is set smoothly and in a desired direction, and the solder bondability can be made to be as desired.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an embodiment of the soldering method of the present invention, FIG. 2 is a side view of the same, FIG. 3 is a perspective view of the same, and FIG. 4 is an electronic component soldered by the method of the present invention. FIG. 4.5. Conductive member, 8. Connection portion, 9. Solder, 10.
11... Laser beam.

Claims (2)

[Claims] (1) A plurality of conductive members are brought into contact with each other to electrically and mechanically connect each of the conductive members near the connection portion by separately irradiating a laser beam to heat the connection portion of any of the conductive members. 1. A method of soldering conductive members, which comprises soldering the joints of a plurality of conductive members by melting solder held nearby by conductive heat. (2) A method for soldering a conductive member according to claim 1, characterized in that the irradiation amount of the plurality of laser beams is varied to create a temperature difference in the conductive member, thereby imparting flow directionality to the solder.