JPH02132311A - Circuit pattern inspection instrument for printed wiring board - Google Patents

Circuit pattern inspection instrument for printed wiring board

Info

Publication number
JPH02132311A
JPH02132311A JP28705388A JP28705388A JPH02132311A JP H02132311 A JPH02132311 A JP H02132311A JP 28705388 A JP28705388 A JP 28705388A JP 28705388 A JP28705388 A JP 28705388A JP H02132311 A JPH02132311 A JP H02132311A
Authority
JP
Japan
Prior art keywords
light
retroreflected
circuit pattern
spatial filter
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28705388A
Other languages
Japanese (ja)
Other versions
JP2537543B2 (en
Inventor
Koji Oka
浩司 岡
Moritoshi Ando
護俊 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP63287053A priority Critical patent/JP2537543B2/en
Publication of JPH02132311A publication Critical patent/JPH02132311A/en
Application granted granted Critical
Publication of JP2537543B2 publication Critical patent/JP2537543B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To remove the influence of unnecessary reflected light to be given upon a pattern detection signal by detecting retroreflected light through a spatial filter which has an annular light transmission area arranged at the periphery of a minute light shield area arranged in the center of an optical axis and a light shield area arranged at its periphery. CONSTITUTION:On the circuit pattern surface of the printed wiring board 13 which is formed by forming a circuit pattern having no light diffusibility on a surface having light diffusibility, a laser beam is scanned through a polygon 16, a scanning lens 17, and a mirror 18 and its retroreflected light is detected through the annular transmission type spatial filter 27. A direct reflected component contained in the retroreflected light is cut off by the minute light shield part 100 arranged in the center of the optical axis of the spatial filter 27 and unnecessary retroreflected light is cut off by the outside light shield area 102. Only a diffused light component is transmitted through the annular transmission area 101 to reach a photomultiplier 22, and the influence of the unnecessary retroreflected light to be given upon the pattern detection signal is eliminated.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリン1・配線板の回路パターンの検査装置
に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for inspecting circuit patterns of printed circuit boards and wiring boards.

LSI等の高速化、高集積化に伴って電子部品を搭載す
るマザーボードとしてのプリント配線板にも高密度化、
小形化、薄形化が要請されても)る。
As LSIs and other devices become faster and more highly integrated, printed wiring boards, which serve as motherboards on which electronic components are mounted, also become denser.
(even if there is a demand for smaller and thinner products).

かかる状況にあって、プリント配線板上の回路ノく夕一
ンも複雑化する傾向にある。プリント配線板の高品質化
、高信頼性化のためには当該回路ノくタンを検査するこ
とが必要である。そのような目的で用いられるのが本発
明に係るプリント配線板の回路パターン検査装置である
Under such circumstances, circuits on printed wiring boards tend to become more complex. In order to improve the quality and reliability of printed wiring boards, it is necessary to inspect the circuit boards. The printed wiring board circuit pattern inspection apparatus according to the present invention is used for such purpose.

〔従来の技術〕[Conventional technology]

従来のレーザ光走査方式を用いたプリント配線板の回路
パターン検査装置の例を第4図に示す。
FIG. 4 shows an example of a circuit pattern inspection device for a printed wiring board using a conventional laser beam scanning method.

第4図において、レーザ光源14からのレーザビームは
ビームエキスパンダ15によりそのビーム径が拡大され
、ビームスプリ・ソタ19を経由してポリゴン(回転多
面鏡)16により走査され、走査レンズ17、ミラー1
8を介して載置テーブル11上に置かれたプリント配線
板13上の回路パターン面に照射される。このレーサビ
ームは走査レンズ17によりスポツ1・状に集光され、
ミラー18により反射されて回路パターン上を図示する
矢印の方向に走査される。
In FIG. 4, a laser beam from a laser light source 14 has its beam diameter expanded by a beam expander 15, passes through a beam splitter 19, is scanned by a polygon (rotating polygon mirror) 16, and is scanned by a scanning lens 17 and a mirror. 1
The circuit pattern surface on the printed wiring board 13 placed on the mounting table 11 is irradiated via the beam 8 . This laser beam is focused into a spot 1 by a scanning lens 17,
It is reflected by the mirror 18 and scanned over the circuit pattern in the direction of the arrow shown.

回路パターンで反射された反射光は、走査時の経路とは
逆にミラー18、走査レンズ17、ボリゴン16の経路
をたどってビームスプリツタ]9に帰還される。ビーム
スプリツタ19において反射光成分が分離される。この
分離された光を以下、再帰反射光Rという。再帰反射光
Rは再結像用レンズ20により結像される。この再結像
面には空間フィルタ21が配置されている。この空間フ
ィルタ21は再帰反射光Rに含まれるノイズ成分を除去
し、S/N比を向上させて検査精度を向上させるための
もので、詳細は後述する。ノイズ成分が除去された再帰
反射光Rはフオ1・マルチブライヤ(光電子増倍管)2
2に入射され、その光強度が検出される。
The light reflected by the circuit pattern is returned to the beam splitter 9 by following the path of the mirror 18, the scanning lens 17, and the polygon 16, contrary to the path during scanning. A beam splitter 19 separates the reflected light components. This separated light is hereinafter referred to as retroreflected light R. The retroreflected light R is imaged by the reimaging lens 20. A spatial filter 21 is arranged on this re-imaging plane. This spatial filter 21 is for removing noise components included in the retroreflected light R, improving the S/N ratio, and improving inspection accuracy, and details will be described later. The retroreflected light R from which noise components have been removed is sent to the photomultiplier (photomultiplier tube) 2.
2, and its light intensity is detected.

ここで、空間フィルタ21の機能について説明する。第
5図に、プリン1・配線板13のパターン面と再結像面
上の再帰反射光の強度分布を示す。
Here, the function of the spatial filter 21 will be explained. FIG. 5 shows the intensity distribution of retroreflected light on the pattern surface and re-imaging surface of the print 1/wiring board 13.

なお、第5図においては、説明の都合上、ポリゴン16
に代えて振動ミラー26を用いているが、その機能は同
じである。
In addition, in FIG. 5, for convenience of explanation, the polygon 16
Although a vibrating mirror 26 is used instead, its function is the same.

再帰反射光Rとしては、プリント配線板13上の基材部
Aからの再帰反射光RA、回路ノくターンを構成する導
体側面Bの再帰反射光RB1導体上面Cからの再帰反射
、光R。03つがある。これらの各再帰反射光R −R
oの再結像面上の光強度A 分布はi,IB,Ioのようになる。すなわち、A 再帰反射光RAの光強度分布IAはブロードな山型とな
る。これは、プリント配線板13の基祠部Aとして、一
般的には、ポリイミドやエポキシ樹脂が用いられ、これ
らは光拡散性が高いためである。一方、再帰反射光R。
The retroreflected light R includes retroreflected light RA from the base member A on the printed wiring board 13, retroreflected light RB from the conductor side surface B constituting the circuit nozzle, retroreflected light from the upper surface C of the conductor, and light R. There are 03. Each of these retroreflected lights R - R
The light intensity A distribution on the reimaging surface of o is as follows: i, IB, Io. That is, the light intensity distribution IA of the retroreflected light RA has a broad mountain shape. This is because polyimide or epoxy resin is generally used as the base portion A of the printed wiring board 13, and these resins have high light diffusing properties. On the other hand, retroreflected light R.

の光強度分■。はレザスポッ1・位置を中心とするナロ
ーな山型となる。
■ Light intensity minute. becomes a narrow mountain shape centered on the leather spot 1 position.

これは、導体上面Cが金属(銅箔)であるために導体上
面Cにおいては光拡散性が極めて小さく、正反射成分が
ほとんどであるためである。再帰反射光R の光強度分
布I。は、反射方向のずれ等B により、光強度分布■4と光強度分布I。の中間的な特
性となる。
This is because the upper surface C of the conductor is made of metal (copper foil), so the light diffusivity on the upper surface C of the conductor is extremely small, and the specular reflection component is the majority. Light intensity distribution I of retroreflected light R. Due to the deviation of the reflection direction, etc. B, the light intensity distribution ■4 and the light intensity distribution I. It has intermediate characteristics.

このような光強度分布1  ,I  ,I  を示すA
BC 再帰反射光R p, −R cをフォトマルチプライヤ
22により検出した場合、フォトマルチブライヤ22か
ら出力される導体上面Cに対応する検出信号レベルは高
く、基材部Aに対応する検出信号レベルは低くなる(図
示せず。)。これを2値化回路23(第4図)により2
値化して演算部24により検査に必要な演算処理を行う
ことになるのであるが、上記光強度分布IA,1,I 
 のままBC で信号処理を行うと、次のような不都合がある。
A showing such a light intensity distribution 1 , I , I
When the BC retroreflection light Rp, -Rc is detected by the photomultiplier 22, the detection signal level corresponding to the conductor upper surface C output from the photomultiplier 22 is high, and the detection signal level corresponding to the base material part A is high. (not shown). This is converted to 2 by the binarization circuit 23 (Fig. 4).
The light intensity distribution IA, 1, I
If signal processing is performed using BC as is, the following problems will occur.

すなわち、導体上面Cは銅箔であるため、その表面が酸
化することがある。この酸化部分は部分的にせよ、黒色
に近いものとなり、したがってその再帰光強度レベルが
低下し、光強度分布IAと区別できない場合が生じる。
That is, since the upper surface C of the conductor is made of copper foil, the surface may be oxidized. This oxidized portion becomes close to black, even if only partially, and the intensity level of the reflected light decreases, resulting in cases where it cannot be distinguished from the light intensity distribution IA.

このことは、検出精度の低下を意味する。This means a decrease in detection accuracy.

そこで、かかる不具合を防止するため、再結像面上に、
第6図に示すような空間フィルタ21を用いることが知
られている。この空間フィルタ21は透明板中の再帰反
射光Rの光軸中心に位置する部分に直径dの微少遮光部
28が配置されて構成されている。このような遮光部2
8を配置することにより、再帰反射光Rの中の直径dに
対応する面積分の再帰反射光Rが遮光される。すなわち
、第7図(a)に示すように、再帰反射光RAの場合直
径dに対応する光(斜線部)が遮光されるが、再帰反射
光RA自体もともと拡散光成分がほとんどである。これ
に対して再帰反射光R。の場合、第7図(b)に示すよ
うに、再帰反射光Rcに含まれる直接反射成分(ピーク
の斜線部)のほとんどは遮光されることになる。したが
って、再帰反射光RAに対応する検出信号は、第8図に
示すように、高レベルSとなり、再帰反射光R。
Therefore, in order to prevent such problems, on the re-imaging surface,
It is known to use a spatial filter 21 as shown in FIG. This spatial filter 21 is constructed by disposing a minute light shielding part 28 having a diameter d in a portion located at the center of the optical axis of the retroreflected light R in a transparent plate. Such a light shielding part 2
8, the retroreflected light R is blocked by an area corresponding to the diameter d. That is, as shown in FIG. 7(a), in the case of the retroreflected light RA, the light corresponding to the diameter d (shaded area) is blocked, but the retroreflected light RA itself is essentially a diffused light component. On the other hand, retroreflected light R. In this case, as shown in FIG. 7(b), most of the direct reflection components (shaded peak portion) included in the retroreflection light Rc are blocked. Therefore, the detection signal corresponding to the retroreflected light RA becomes a high level S, as shown in FIG.

に対応する検出信号は低レベルNとなる。その結果、得
られる検出信号は全て拡散光のみで取扱われるため、再
帰反射光R。の直接反射成分の影響を受けることがなく
なる。よって、導体上面Cに酸化部分が存在し、黒く変
色したとしても検出の誤りを生ずることがなく、S/N
比を向上できる。
The detection signal corresponding to is at a low level N. As a result, all the detection signals obtained are treated as diffused light only, so retroreflected light R. is no longer affected by direct reflection components. Therefore, even if there is an oxidized part on the upper surface C of the conductor and it turns black, there will be no detection error, and the S/N will be reduced.
ratio can be improved.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、上述のように、中心に微少遮光部28を
有する空間フィルタ21を用いたとしても次のような問
題がある。
However, as described above, even if the spatial filter 21 having the minute light shielding part 28 at the center is used, the following problem still exists.

すなわち、第9図に示すように、拡散光成分からなる再
帰反射光Rに不要反射光RNが外乱的ノイズとして含ま
れ、この不要反射光RNが本来検出信号として用いられ
るべき再帰反射光RA,Roに重畳されて正確な検出が
行なわれなくなる。
That is, as shown in FIG. 9, unnecessary reflected light RN is included as disturbance noise in retroreflected light R consisting of a diffused light component, and this unnecessary reflected light RN is used as retroreflected light RA, which should originally be used as a detection signal. It is superimposed on Ro and accurate detection is no longer possible.

この不要反射光RNは、ミラー18、走査レンズ17、
ポリゴン16、ビームスプリッタ19、再結像用レンズ
20の光学系(こおける多重反射やレンズの表面反射に
より生ずるものである。これらの不要反射光RNは、一
般的には、再帰反射光R,Roの再結像位置から比較的
離れた位置にA 再結像される。したがって、不要反射光RNも、また、
空間フィルタ21を通過し、パターン検出信号に悪影響
を与えるものである。
This unnecessary reflected light RN is transmitted to the mirror 18, the scanning lens 17,
The optical system of the polygon 16, the beam splitter 19, and the re-imaging lens 20 (occurs due to multiple reflections in the mirror and surface reflection of the lens. These unnecessary reflected lights RN are generally retroreflected lights R, A is re-imaged at a position relatively far from the re-image-forming position of Ro. Therefore, the unnecessary reflected light RN is also
It passes through the spatial filter 21 and has an adverse effect on the pattern detection signal.

第10図に、不要反射光RNが重畳された場合の例を示
す。不要反射光RNが混入しない場合は、第8図(a)
に示すように高レベル、低レベル共に一定のレベルにな
るが、不要反射光RNが混入した場合は、第8図(b)
に破線で示すように信号レベルが上昇してしまい、誤検
出を生じることとなる。
FIG. 10 shows an example where unnecessary reflected light RN is superimposed. If unnecessary reflected light RN is not mixed in, Fig. 8(a)
As shown in Figure 8(b), both the high level and the low level are at a constant level, but if unnecessary reflected light RN is mixed in, as shown in Figure 8(b).
The signal level increases as shown by the broken line, resulting in false detection.

そこで、本発明はかかる不要反射光によるバタン検出信
号への影響を除去しつる空間フィルタを有するプリンI
・配線板の回路パターン検査装置を提供することを目的
とする。
Therefore, the present invention provides a printer I having a spatial filter that eliminates the influence of such unnecessary reflected light on the slam detection signal.
- The purpose is to provide a circuit pattern inspection device for wiring boards.

〔課題を解決するための手段〕[Means to solve the problem]

上記課題を解決するために、本発明は、光拡散性を有す
る基板(A)上に非光拡散性を有する回路パターン(C
)が形成されたプリント配線板(B)の回路パターン面
にレーザビームを走査し、その再帰反射光(R)を空間
フィルタを介して検出するプリント配線板の回路パター
ン検査装置において、前記空間フィルタ(27)は、光
軸中心に微少遮光領域(100)を配置し、その周囲に
環状の光透過領域( 1. 0 1 )を配置し、かつ
、その周囲に遮光領域(102)を配置して構成する。
In order to solve the above problems, the present invention provides a circuit pattern (C) having a non-light diffusing property on a substrate (A) having a light diffusing property.
) is formed on the circuit pattern surface of the printed wiring board (B) and detects the retroreflected light (R) through a spatial filter. In (27), a minute light-shielding region (100) is arranged at the center of the optical axis, a ring-shaped light-transmitting region (1.0 1 ) is arranged around it, and a light-shielding region (102) is arranged around it. Configure.

〔作用〕[Effect]

本発明によれば、空間フィルタ(27)の微少遮光部(
100)により再帰反射光(R)に含まれる直接反射成
分が遮光されるとともに、不要再帰反射光(RN)は外
側遮光領域( 1. 0 2 )により遮光される。し
たがって、環状透過領域(1 0 1)を拡散光成分の
みが透過してフォI・マルチプライヤ(22)に到達す
ることになるため、不要再帰反射光(RN)によるパタ
ーン検出信号への影響を防止できる。
According to the present invention, the minute light shielding part (
100), the direct reflection component included in the retroreflection light (R) is blocked, and unnecessary retroreflection light (RN) is blocked by the outer light-shielding region (1.02). Therefore, only the diffused light component passes through the annular transmission region (1 0 1) and reaches the foI multiplier (22), which reduces the influence of unnecessary retroreflection light (RN) on the pattern detection signal. It can be prevented.

〔実施例〕〔Example〕

次に、本発明の実施例を図面に基づいて説明する。 Next, embodiments of the present invention will be described based on the drawings.

第2図に、本発明の実施例を示す。第2図において第4
図と重複する部分には同一の符号を附し、その詳細な説
明は省略する。
FIG. 2 shows an embodiment of the invention. 4 in Figure 2
The same reference numerals are given to parts that overlap with those in the figures, and detailed explanation thereof will be omitted.

第2図において、第4図と異なるのは、空間フィルタ2
7の構成である。
In Fig. 2, the difference from Fig. 4 is that the spatial filter 2
7 configurations.

すなわち、空間フィルタ27の詳細を第1図に示す。第
1図に示すように、空間フィルタ27は基板上に、再帰
反射光Rの光軸中心に直径D1の微少遮光領域100が
配置され、その周囲に直径D2の環状透過領域101が
配置され、さらにその外側周囲に外側遮光領域102が
形成されてなる。換言すると、全体として遮光性を有す
る領域内に環状の透明部を設けたものである。
That is, the details of the spatial filter 27 are shown in FIG. As shown in FIG. 1, the spatial filter 27 has a minute light blocking region 100 with a diameter D1 arranged on the substrate at the center of the optical axis of the retroreflected light R, and an annular transmission region 101 with a diameter D2 arranged around it. Furthermore, an outer light shielding area 102 is formed around the outer periphery. In other words, an annular transparent portion is provided within a region that has a light-shielding property as a whole.

微少遮光領域100は直径D1を有し、第6図の遮光部
28と同じ機能を有して第7図のように直接反射成分を
遮光する。一方、外側遮光領域102は不要反射光RN
を遮光するだめのものであり、その内径すなわち環状透
過領域101の外径D より大きなビーム径の不要反射
光RNを除去する。したがって、環状透過領域101は
拡散光のみを通過させることとなり、拡散光検出法によ
るプリント配線板13の回路パターン検査の精度を向上
させることができる。
The minute light-shielding region 100 has a diameter D1 and has the same function as the light-shielding portion 28 shown in FIG. 6, and shields directly reflected components as shown in FIG. 7. On the other hand, the outer light shielding area 102 is exposed to unnecessary reflected light RN.
The unnecessary reflected light RN having a beam diameter larger than its inner diameter, that is, the outer diameter D of the annular transmission region 101, is removed. Therefore, the annular transmission region 101 allows only diffused light to pass through, and it is possible to improve the accuracy of circuit pattern inspection on the printed wiring board 13 using the diffused light detection method.

直径D2の大きさは、当該検査装置に発生する不要反射
光RNのビーム径に依存し、経験的、実験的に定めうる
値である。
The size of the diameter D2 depends on the beam diameter of the unnecessary reflected light RN generated in the inspection device, and is a value that can be determined empirically or experimentally.

空間フィルタ27の製造に際しては、第1の方法として
第3図(a)のように、ガラス板等の透明基板上に第1
図の態様で微少遮光領域100、外側遮光領域102を
金属膜の蒸着等により形成する。第2の方法としては第
3図(b)ように、所定寸法で金属箔をくり抜いて作成
する等の方法が考えられる。第3図(b)の29は微少
遮光領域100と外側遮光領域102を結びつけるブリ
ッジであり、微少遮光領域100を支えるためのもので
ある。
When manufacturing the spatial filter 27, as shown in FIG.
In the manner shown in the figure, a minute light-shielding region 100 and an outer light-shielding region 102 are formed by vapor deposition of a metal film or the like. As a second method, as shown in FIG. 3(b), a method such as hollowing out a metal foil to a predetermined size may be considered. Reference numeral 29 in FIG. 3(b) is a bridge that connects the minute light shielding area 100 and the outer light shielding area 102, and is for supporting the minute light shielding area 100.

〔発明の効果〕〔Effect of the invention〕

以上、説明したように、本発明によれば、拡散光検出法
を用いたプリン1・配線板の回路パターン検査装置にお
いて、光学系の多重反射や表面反射等により発生する不
要反射光によるパターン検出1 ] ] 2 信号への影響を除去することができ、高精度な検査を行
うことができる。
As described above, according to the present invention, in a circuit pattern inspection apparatus for print 1 and wiring boards using a diffused light detection method, pattern detection is performed using unnecessary reflected light generated due to multiple reflections in the optical system, surface reflection, etc. 1 ] ] 2 The influence on the signal can be removed, and highly accurate inspection can be performed.

【図面の簡単な説明】 第1図は本発明の原理説明図、 第2図は本発明の実施例のプロ・ソク図、第3図は空間
フィルタの例を示す斜視図、第4図は従来の検査装置の
プロ・ソク図、第5図は再結像面上の再帰反射光の強度
分布の説明図、 第6図は再結像系の構成図、 第7図は遮光部による基材部の再帰反射光と導体上面の
再帰反射光に対する空間フィルタの光出力特性図、 第8図はパターン検出信号の説明図、 第9図は従来技術の問題点を示す斜視図、第10図はパ
ターン検出信号への不要反射光の影響を示す説明図であ
る。 13・・・プリント配線板 A・・・基祠部 C・・・導体上面 R,R,R,Ro・・・再帰反射光 AB 22・・・フォトマルチプライヤ 27,27a,27b・・・空間フィルタ100・・微
少遮光領域 101・・・環状透過領域 102・・・外側遮光領域
[Brief Description of the Drawings] Fig. 1 is a diagram explaining the principle of the present invention, Fig. 2 is a professional diagram of an embodiment of the present invention, Fig. 3 is a perspective view showing an example of a spatial filter, and Fig. 4 is a diagram illustrating the principle of the present invention. Figure 5 is an explanatory diagram of the intensity distribution of retroreflected light on the re-imaging surface, Figure 6 is a configuration diagram of the re-imaging system, and Figure 7 is a diagram of the conventional inspection device. Optical output characteristic diagram of the spatial filter for the retroreflected light from the material part and the retroreflected light from the upper surface of the conductor, Fig. 8 is an explanatory diagram of the pattern detection signal, Fig. 9 is a perspective view showing the problems of the conventional technology, Fig. 10 FIG. 2 is an explanatory diagram showing the influence of unnecessary reflected light on a pattern detection signal. 13... Printed wiring board A... Base part C... Conductor top surface R, R, R, Ro... Retroreflected light AB 22... Photo multiplier 27, 27a, 27b... Space Filter 100...Small light shielding area 101...Annular transmission area 102...Outer light shielding area

Claims (1)

【特許請求の範囲】  光拡散性を有する基板(A)上に非光拡散性を有する
回路パターン(C)が形成されたプリント配線板(B)
の回路パターン面にレーザビームを走査し、その再帰反
射光(R)を空間フィルタを介して検出するプリント配
線板の回路パターン検査装置において、 前記空間フィルタ(27)は、光軸中心に微少遮光領域
(100)を配置し、その周囲に環状の光透過領域(1
01)を配置し、かつ、その周囲に遮光領域(102)
を配置して構成したことを特徴とするプリント配線板の
回路パターン検査装置。
[Claims] A printed wiring board (B) in which a circuit pattern (C) having non-light diffusing properties is formed on a substrate (A) having light diffusing properties.
In a circuit pattern inspection device for a printed wiring board that scans a laser beam on a circuit pattern surface and detects the retroreflected light (R) through a spatial filter, the spatial filter (27) has a slight light shield at the center of the optical axis. A region (100) is arranged, and an annular light transmitting region (100) is placed around it.
01) and a light shielding area (102) around it.
A circuit pattern inspection device for a printed wiring board, characterized in that it is configured by arranging the following.
JP63287053A 1988-11-14 1988-11-14 Circuit pattern inspection device for printed wiring boards Expired - Lifetime JP2537543B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63287053A JP2537543B2 (en) 1988-11-14 1988-11-14 Circuit pattern inspection device for printed wiring boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63287053A JP2537543B2 (en) 1988-11-14 1988-11-14 Circuit pattern inspection device for printed wiring boards

Publications (2)

Publication Number Publication Date
JPH02132311A true JPH02132311A (en) 1990-05-21
JP2537543B2 JP2537543B2 (en) 1996-09-25

Family

ID=17712444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63287053A Expired - Lifetime JP2537543B2 (en) 1988-11-14 1988-11-14 Circuit pattern inspection device for printed wiring boards

Country Status (1)

Country Link
JP (1) JP2537543B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5847823A (en) * 1997-04-28 1998-12-08 International Business Machines Corporation Surface inspection tool
US5867261A (en) * 1997-04-28 1999-02-02 International Business Machines Corporation Surface inspection tool
US5898492A (en) * 1997-09-25 1999-04-27 International Business Machines Corporation Surface inspection tool using reflected and scattered light
US5917589A (en) * 1997-04-28 1999-06-29 International Business Machines Corporation Surface inspection tool
US5969370A (en) * 1997-04-28 1999-10-19 International Business Machines Corporation Surface inspection tool
US6100971A (en) * 1997-04-28 2000-08-08 International Business Machines Corporation Surface inspection tool
US6624884B1 (en) 1997-04-28 2003-09-23 International Business Machines Corporation Surface inspection tool
US6704435B1 (en) 1997-04-28 2004-03-09 International Business Machines Corporation Surface inspection tool

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55176555U (en) * 1979-06-07 1980-12-18
JPS622113A (en) * 1985-06-28 1987-01-08 Ando Electric Co Ltd Surface roughness meter using reflected light

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55176555U (en) * 1979-06-07 1980-12-18
JPS622113A (en) * 1985-06-28 1987-01-08 Ando Electric Co Ltd Surface roughness meter using reflected light

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5847823A (en) * 1997-04-28 1998-12-08 International Business Machines Corporation Surface inspection tool
US5867261A (en) * 1997-04-28 1999-02-02 International Business Machines Corporation Surface inspection tool
US5917589A (en) * 1997-04-28 1999-06-29 International Business Machines Corporation Surface inspection tool
US5969370A (en) * 1997-04-28 1999-10-19 International Business Machines Corporation Surface inspection tool
US6100971A (en) * 1997-04-28 2000-08-08 International Business Machines Corporation Surface inspection tool
US6117620A (en) * 1997-04-28 2000-09-12 International Business Machines Corporation Method of producing a calibration disk
US6624884B1 (en) 1997-04-28 2003-09-23 International Business Machines Corporation Surface inspection tool
US6704435B1 (en) 1997-04-28 2004-03-09 International Business Machines Corporation Surface inspection tool
US5898492A (en) * 1997-09-25 1999-04-27 International Business Machines Corporation Surface inspection tool using reflected and scattered light

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Publication number Publication date
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