JPH02131346U - - Google Patents
Info
- Publication number
- JPH02131346U JPH02131346U JP3996889U JP3996889U JPH02131346U JP H02131346 U JPH02131346 U JP H02131346U JP 3996889 U JP3996889 U JP 3996889U JP 3996889 U JP3996889 U JP 3996889U JP H02131346 U JPH02131346 U JP H02131346U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- semiconductor
- sealed package
- hermetically sealed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 7
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000006200 vaporizer Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3996889U JPH02131346U (no) | 1989-04-06 | 1989-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3996889U JPH02131346U (no) | 1989-04-06 | 1989-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02131346U true JPH02131346U (no) | 1990-10-31 |
Family
ID=31549345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3996889U Pending JPH02131346U (no) | 1989-04-06 | 1989-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02131346U (no) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635238U (no) * | 1986-06-25 | 1988-01-14 |
-
1989
- 1989-04-06 JP JP3996889U patent/JPH02131346U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635238U (no) * | 1986-06-25 | 1988-01-14 |